Patents by Inventor Jim Woodling

Jim Woodling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Prevention of edge stain in silicon wafers by ozone dipping
    Patent number: 5972802
    Abstract: A method of preventing edge stain in silicon wafers from the edge polishing step with an alkaline slurry, the method consisting of formation of an oxide layer by an ozone dipping step prior to edge polishing.
    Type: Grant
    Filed: October 7, 1997
    Date of Patent: October 26, 1999
    Assignee: SEH America, Inc.
    Inventors: Masami Nakano, Jim Woodling
  • Prevention of edge stain in silicon wafers by oxygen annealing
    Patent number: 5893982
    Abstract: A method of preventing edge stain in silicon wafers from the edge polishing step with an alkaline slurry, the method consisting of formation of an oxide layer by an annealing step in the presence of oxygen prior to edge polishing.
    Type: Grant
    Filed: January 8, 1997
    Date of Patent: April 13, 1999
    Assignee: Seh America, Inc.
    Inventors: Masami Nakano, Jim Woodling