Patents by Inventor Jim Yin

Jim Yin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128580
    Abstract: A vehicle battery pack includes several supporting beams extending in a first direction; and battery modules located between the supporting beams. The battery module comprises: a base plate extending in the first direction; multiple battery cells arranged in a stacked manner and placed on the base plate; and end plates connected to the base plate, the end plates compress the multiple battery cells from both sides in the first direction. The battery cell has end faces facing a second direction and the end faces are adjacent to the supporting beams. A vehicle can include the aforementioned vehicle battery pack.
    Type: Application
    Filed: October 5, 2023
    Publication date: April 18, 2024
    Inventors: Bin Yin, Steven Shi, Jim Liu
  • Patent number: 5684674
    Abstract: Computer apparatus 10 has a convective air flow therethrough for removing heat generated by the IC chips on circuit boards 12H, 12M, and 12L and by other computer components within housing 10H. The housing confines the convective air flow, and has elongated I/O openings 10E therethrough for accommodating I/O connections to the circuit boards. The circuit boards are mounted within the housing in an adjacent parallel relationship forming air flow channels therebetween. Each circuit board has a housing end 12P proximate the I/O openings in the housing and an interior end 12D distant from the housing. A mounting bracket 14 is fastened to each circuit board at the housing end and is secured to the housing to cover the I/O openings. Air vent apertures 16 in the mounting brackets provide air flow communication through the mounting brackets and the I/O openings for directing a portion of the convective air flow through the channel over the adjacent circuit boards.
    Type: Grant
    Filed: January 16, 1996
    Date of Patent: November 4, 1997
    Assignee: Micronics Computers Inc.
    Inventor: Jim Yin