Abstract: A mezzanine connector assembly adapted to connecting a top PCB and a bottom PCB. The mezzanine connector assembly includes a floatable upper connector and a lower connector. The upper connector has an electrical connecting device and an optical connecting device. The electrical connecting device includes a conductor having a floatable upper end and a fixed lower end, the optical connecting device having an optical waveguide with one end connected to the upper PCB and a lower end fixed to the housing by a ferrule. The lower connector has a housing, a turning lens received in the housing, and an electrical contact connected to the bottom PCB for mating with the lower end of the conductor of the upper connector, the turning lens defining an upward opening to receive the ferrule of the upper connector, a forward opening for receiving an optical plug.

Abstract: An object of the present invention is to provide a new modular SLC (Surface Laminar Circuit) interconnect system for replacing the traditional ceramic substrate implanted with 56 Duece modules, the interconnect system includes an organizer for accurately positioning the connector assemblies, and a plurality of fully populated connector housings defining a pitch same as that defined by the Duece modules. Each connector housing defines two receiving slots to receive two SLC modules which are further commonly held by a heat sink above. Each SLC module is equipped with a plurality of micro-controllers, a plurality of OE glass lenses, a plurality of IC chips, and a molded lens and fiber able assembly.

Abstract: An electrical connector assembly (600) comprising a shielding housing (20) and a socket (40), and a buckle (60) assembled to the shielding housing. The shielding housing has a horizontal passage (22) and an entrance (220) backwardly communicating the passage and forwardly opening for receiving a plug (80). The socket is used for mating with a front end of a plug inserted therein. The buckle has a front latch (62) movable between an open position where a plug inside the shielding housing is permitted to be pulled out and a closed position where the front latch blocks the entrance of the shielding housing so that a plug inside the shielding housing is blocked from being pulled out.

Abstract: An optical-electrical connector (100) having an end for mating with an electrical connector and an opposite end coupling with an optical medium, includes a thermal conductive shell (10), a printed circuit board assembly (20) received in the thermal conductive shell, and an optical-electrical module (50). The printed circuit board assembly includes a printed circuit board (21) including a thermal conductive layer (214) thermal conductively connected with the metal shell. The optical-electrical module is mounted on the printed circuit board and is in contact with the thermal conductive layer, heat produced by the optical-electrical module being transmitted to the thermal conductive shell by the thermal conductive layer.

Abstract: An electrical connector assembly (600) comprising a shielding housing (20) and a socket (40), and a buckle (60) assembled to the shielding housing. The shielding housing has a horizontal passage (22) and an entrance (220) backwardly communicating the passage and forwardly opening for receiving a plug (80). The socket is used for mating with a front end of a plug inserted therein. The buckle has a front latch (62) movable between an open position where a plug inside the shielding housing is permitted to be pulled out and a closed position where the front latch blocks the entrance of the shielding housing so that a plug inside the shielding housing is blocked from being pulled out.

Abstract: A flappable plug connector and a complementary receptacle connector are provided wherein the plug connector defining a mating tongue, is made with a pair of insert molding housings which are associated with the contacts thereof, commonly sandwiching a paddle card therebetween with a pair of power contacts exposed on two opposite lateral sides to form a sub-assembly. The corresponding receptacle connector defines a receiving cavity to receive the mating tongue of the plug connector. The plug connector defines a V-Bus clip surrounding the mating tongue for power transfer and the receptacle connector includes a pair of deflectable power contacts by two sides of the receiving cavity.

Abstract: An opto-electronic device includes an optical engine module and an electrical socket. The optical engine module includes an optical engine, an optical transmission interface for coupling with an optical device and an electrical transmission interface, the electrical transmission interface having electrical pads. The electrical socket includes a plurality of BGA terminals, each terminal having a module-connecting end and a board-connecting end. The electrical transmission interface is removeably assembled in the electrical socket and the electrical pads contact the module-connecting ends of the electrical socket.

Abstract: A high speed card edge connector (20, 30) includes an insulative housing (21, 31), and a number of first, second, third, and fourth contacts (221-224) received in the insulative housing and arranged in a number of first columns (25) and a number of second columns (26). Each of the first columns includes one first, one second, and one third contacts. Each of the second columns includes one first, one fourth, and one third contacts. Each of the first to the fourth contacts includes a mounting portion (22b). The mounting portions of the second and the fourth contacts are designed as penetration type termination, and the mounting portions of the first and the third contacts are designed as surface mounted type termination. The mounting portions of the second and the fourth contacts are arranged in different rows.

Abstract: Various methods and communications devices to improve bandwidth utilization in a wireless communication network are provided. By way of example, efficient content delivery in a radio access network is achieved by using an accelerator module configured to implement a stack having, among others, a hypertext transfer protocol (HTTP) layer, a transmission control protocol (TCP) layer, and a de-duplication, Lempel-Ziv (LZ) compression/decompression, and caching layer.

Abstract: A high speed card edge connector (20, 30) includes an insulative housing (21, 31), and a number of first, second, third, and fourth contacts (221-224) received in the insulative housing and arranged in a number of first columns (25) and a number of second columns (26). Each of the first columns includes one first, one second, and one third contacts. Each of the second columns includes one first, one fourth, and one third contacts. Each of the first to the fourth contacts includes a mounting portion (22b). The mounting portions of the second and the fourth contacts are designed as penetration type termination, and the mounting portions of the first and the third contacts are designed as surface mounted type termination. The mounting portions of the second and the fourth contacts are arranged in different rows.

Abstract: An AOC assembly comprising two printed circuit boards (PCB) (63), a board holder (61) and two dust proof, heat conducting metal covers (64) with integrated head spreader. Each of the two PC boards has a lower edge (632) extending in a longitudinal direction with circuit pads on opposite sides of PCB thereof. The board holder has two opposite vertical datum faces with two of said PC boards respectively positioned thereon. The two heat conducting covers oppositely fixed to the holder in a transverse direction perpendicular to the PC boards. When assembled, the integrated heat spreader of heat conducting metal shell would touch the active electronic components on the PCB and dissipate their excessive heat therefrom.

Abstract: An optical assembly (1) includes a socket (10) and an optical module (20). The socket includes a housing (11) and a number of contacts (12) received in the housing. The housing includes a bottom wall (110), side walls (111) extending upwardly form the bottom wall, and a receiving room (112) formed by the bottom and the side walls. The optical module is received in the receiving room and electrically connected with the contacts. The optical module includes a carrier (21), a lens array (22), and a waveguide (23) optically coupling with the lens array. The ferrule is used to align the waveguide with the lens array. The waveguide includes a number of reflection potions (232, 233) at an end thereof to change a transmission direction of an optical signal along a second direction with an angle relative to the first direction.

Abstract: An opto-electronic device includes an optical engine module and an electrical socket. The optical engine module includes an optical engine, an optical transmission interface for coupling with an optical device and an electrical transmission interface, the electrical transmission interface having electrical pads. The electrical socket includes a plurality of BGA terminals, each terminal having a module-connecting end and a board-connecting end. The electrical transmission interface is removeably assembled in the electrical socket and the electrical pads contact the module-connecting ends of the electrical socket.

Abstract: An optical module comprises: a housing; a first incident surface mounted on the housing for receiving an optical signal converted from an electrical signal; a first output surface mounted on the housing for exporting the optical signal from the first incident surface; a second incident surface mounted on the housing for receiving another optical signal to be converted to another electrical signal; and a second output surface mounted on the housing for exporting the another optical signal from the second incident surface. An aperture of the first incident surface is smaller than an aperture of the second incident surface.

Abstract: An optical coupling device includes a substrate loaded with a first optical module and IC drivers, and a second optical module intending to couple with the first optical module. The substrate defines an electrical connection port at one end thereof, the first optical module is located at another end of the substrate. The second optical module includes a first insulating holder and fiber cores embedded in the insulating holder. The first optical module includes a second insulating holders and VCSELS and PDS embedded with the second insulating holder, the fiber cores are directly coupled with VCSELS and PDS to transmit light lines therein.

Abstract: An opto-electronic device assembly adapted for mounted on a mother board includes a case and opto-electronic devices. The case has multiple cavities opening forwards and downwards. Each opto-electronic device includes an optical engine module and an electrical socket. The optical engine module includes an optical engine, an optical transmission interface and an electrical transmission interface with electrical pads. The electrical socket has a plurality of terminals with one ends contacting with PCB and another opposite ends contacting with the electrical pads. Each electrical transmission interface is removeably assembled in the electrical sockets to complete electrical connection between the substrate and the mother board. The opto-electrical devices are received in the cavities in a condition that the optical transmission interfaces exposes to a front open of the case.

Abstract: An object of the present invention is to provide a new modular SLC (Surface Laminar Circuit) interconnect system for replacing the traditional ceramic substrate implanted with 56 Duece modules, the interconnect system includes an organizer for accurately positioning the connector assemblies, and a plurality of fully populated connector housings defining a pitch same as that defined by the Duece modules. Each connector housing defines two receiving slots to receive two SLC modules which are further commonly held by a heat sink above. Each SLC module is equipped with a plurality of micro-controllers, a plurality of OE glass lenses, a plurality of IC chips, and a molded lens and fiber able assembly.

Abstract: Various methods and communications devices to improve bandwidth utilization in a wireless communication network are provided. By way of example, efficient content delivery in a radio access network is achieved by using an accelerator module configured to implement a stack having, among others, a hypertext transfer protocol (HTTP) layer, a transmission control protocol (TCP) layer, and a de-duplication, Lempel-Ziv (LZ) compression/decompression, and caching layer.

Abstract: Various methods and communications devices to reduce a bandwidth utilization of a backhaul link in a wireless communications system are provided. By way of example, bandwidth utilization is reduced by relegating the compression of data to the downlink transmission, storing only reference keys in the cache of the transmitting device, and taking advantage of an asymmetrical cache structure between communicating devices. Support is provided for a user equipment to move from one node to another node.

Abstract: An optical coupling device includes a substrate loaded with a first optical module and IC drivers, and a second optical module intending to couple with the first optical module. The substrate defines an electrical connection port at one end thereof, the first optical module is located at another end of the substrate. The second optical module includes a first insulating holder and fiber cores embedded in the insulating holder. The first optical module includes a second insulating holders and VCSELS and PDS embedded with the second insulating holder, the fiber cores are directly coupled with VCSELS and PDS to transmit light lines therein.