Abstract: A material conveying device includes a base frame, a first conveying unit, a second conveying unit and a transfer assembly. The first conveying unit is provided on the base frame, the second conveying unit is provided on the base frame, and the transfer assembly is provided on the base frame and can transfer a material between the first conveying unit and the second conveying unit. The present disclosure further provides a processing equipment facilitating material distribution and a material distribution method.

Abstract: Disclosed herein are classifier models, computer implemented systems, machine learning systems and methods thereof for classifying asymptomatic patients into a risk category for having or developing cancer and/or classifying a patient with an increased risk of having or developing cancer into an organ system-based malignancy class membership and/or into a specific cancer class membership.

Abstract: Disclosed herein are classifier models, computer implemented systems, machine learning systems and methods thereof for classifying asymptomatic patients into a risk category for having or developing cancer and/or classifying a patient with an increased risk of having or developing cancer into an organ system-based malignancy class membership and/or into a specific cancer class membership and/or a category with a time range for follow up testing or reclassification with newly measured input factors.

Abstract: A thick-film resistor component may include a thick film component formed between a thick-film resistor and an electrically conductive sheet, wherein a portion of the sheet is selectively removed to form resistor contacts while exposing a portion of the thick-film component. Electrical terminals to a thick-film resistor may be sized to reduce stress and/or be selectively positioned relative to the resistor to define a desired resistor value. A thick-film resistor may include one or more resistor segments configured to be selectively open-circuited to incrementally adjust the value of the resistor.

Abstract: A circuit for measuring mechanical stress impressed on a printed circuit board includes a number of electrically conductive pads formed on at least one outer surface of the printed circuit board, and a resistive material applied in a pattern to the printed circuit board and defining a resistor between first and second ones of the number of electrically conductive pads. The resistive material exhibits an electrical resistance that varies as the resistive material is deformed so that the resistor exhibits an electrical resistance value that varies as a function of mechanical stress impressed on the printed circuit board sufficient to deform the resistive material defining the resistor. Any number of such resistors may be formed on or within the printed circuit board, and any such resistor may form part of an external resistor bridge network configured to monitor changes in its resistance value.

Abstract: A thick-film resistor component may include a thick film component formed between a thick-film resistor and an electrically conductive sheet, wherein a portion of the sheet is selectively removed to form resistor contacts while exposing a portion of the thick-film component. Electrical terminals to a thick-film resistor may be sized to reduce stress and/or be selectively positioned relative to the resistor to define a desired resistor value. A thick-film resistor may include one or more resistor segments configured to be selectively open-circuited to incrementally adjust the value of the resistor.

Abstract: A circuit for measuring mechanical stress impressed on a printed circuit board includes a number of electrically conductive pads formed on at least one outer surface of the printed circuit board, and a resistive material applied in a pattern to the printed circuit board and defining a resistor between first and second ones of the number of electrically conductive pads. The resistive material exhibits an electrical resistance that varies as the resistive material is deformed so that the resistor exhibits an electrical resistance value that varies as a function of mechanical stress impressed on the printed circuit board sufficient to deform the resistive material defining the resistor. Any number of such resistors may be formed on or within the printed circuit board, and any such resistor may form part of an external resistor bridge network configured to monitor changes in its resistance value.