Patents by Inventor Jimmy Kuo-Wei Chen

Jimmy Kuo-Wei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20010009724
    Abstract: Deposition of metal in a preferred shape, including coatings on parts, or stand-alone materials, and subsequent heat treatment to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25° C. This technique involves depositing a material in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment. This moderate heat treatment differs from other commonly employed “stress relief” heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. Coating and heat treating a spring-shaped substrate provides a resilient, conductive contact useful for electronic applications.
    Type: Application
    Filed: January 29, 2001
    Publication date: July 26, 2001
    Inventors: Jimmy Kuo-Wei Chen, Benjamin N. Eldridge, Thomas H. Dozier, Junjye J. Yeh, Gayle J. Herman
  • Patent number: 6150186
    Abstract: Deposition of metal in a preferred shape, including coatings on parts, or stand-alone materials, and subsequent heat treatment to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25.degree. C. This technique involves depositing a material in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment. This moderate heat treatment differs from other commonly employed "stress relief" heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. Coating a shape and heat treating provides a shaped deposit with improved material properties.
    Type: Grant
    Filed: December 22, 1998
    Date of Patent: November 21, 2000
    Assignee: FormFactor, Inc.
    Inventors: Jimmy Kuo-Wei Chen, Benjamin N. Eldridge, Thomas H. Dozier, Junjye J. Yeh, Gayle J. Herman
  • Patent number: D522972
    Type: Grant
    Filed: April 4, 2005
    Date of Patent: June 13, 2006
    Assignee: Neoconix, Inc.
    Inventors: William B. Long, Eric Radza, Jimmy Kuo-Wei Chen, Michael B. Graves