Patents by Inventor Jin-An WU

Jin-An WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12048049
    Abstract: An improved discontinuous reception (DRX) mechanism is disclosed. In one embodiment, a method is disclosed comprising receiving a request to attach to a cellular network from user equipment (UE). The method then identifies a group identifier associated with the UE and determines a DRX parameter based on the group identifier. Finally, the method transmits the DRX parameter to the UE.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: July 23, 2024
    Assignee: Verizon Patent and Licensing Inc.
    Inventors: Jin Yang, Susan Wu Sanders, Frank Jager, John Joseph Cooke
  • Publication number: 20240229191
    Abstract: The present disclosure discloses an application of cuprous sulfide in a recovery of Au (III) from aqueous solutions, which relates to the fields of hydrometallurgy and precious metal recovery. The method of the present disclosure uses cuprous sulfide nanoparticles to recover Au (III) from aquesous solution, and undergoes gold adsorption under mechanical stirring. The method described in the present disclosure can efficiently recover Au (III) from aqueous solutions, has good recovery effects on Au (III) from acidic waste liquid, and has the advantages of energy conservation, environmental protection, and low cost.
    Type: Application
    Filed: October 16, 2023
    Publication date: July 11, 2024
    Inventors: Yunlong Chen, Jin Wu, Futing Zi, Xianzhi Hu, Fengru Meng, Yongmao Zeng, Zhongying Wang, Yihuai Yang
  • Publication number: 20240183599
    Abstract: An ice making assembly includes a mold body defining an ice-making cavity. An evaporator is coupled to the mold body. The evaporator includes a cap positioned on the mold body such that an open end of the cap is positioned at the mold body. An inlet tube is mounted to the cap. An outlet tube is also mounted to the cap. An evaporation chamber is formed between the cap and the mold body. The inlet tube is configured for directing a flow of refrigerant into the evaporation chamber, and the outlet tube configured for directing the flow of refrigerant out of the evaporation chamber.
    Type: Application
    Filed: July 9, 2021
    Publication date: June 6, 2024
    Inventors: Jin Wu, Bo Yan, Yayu Song, Eddy Zhou, Michael Zhou, Roy Teng, Zhijun Shi, Jason Jiang, Brent Junge, Justin Brown
  • Publication number: 20240185645
    Abstract: A real time monitoring module for a transportation vehicle includes a data collector unit for receiving signals from a variety of vehicle devices including a control unit for processing the signals to provide different lists of signals, a first memory unit to store working data of the control unit, a second memory unit to store the different lists of signals, and a communication interface to forward the different lists of signals to a sending unit of the transportation vehicle wherein the sending unit provides a communication interface for the different lists of signals to various backend devices.
    Type: Application
    Filed: March 22, 2022
    Publication date: June 6, 2024
    Inventors: Fernandez-Garcia JOAQUIN, Tao LI, Mihail STOYANOV, Tayfun KILIC, Jin WU, Arul MATHESWARAN
  • Patent number: 11996424
    Abstract: According to an aspect, an image sensor package includes a transparent member, a substrate, and an interposer disposed between and coupled to the transparent member and the substrate, where the interposer defines a first cavity area and a second cavity area. The image sensor package includes an image sensor die disposed within the first cavity area of the interposer, where the image sensor die has a sensor array configured to receive light through the transparent member and the second cavity area. The image sensor package includes a bonding material that couples the image sensor die to the interposer within the first cavity area.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: May 28, 2024
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Weng-Jin Wu
  • Publication number: 20240170913
    Abstract: A surface light emitting element with high heat dissipation and uniform light emission includes a metal reflective layer, a first metal conductive layer, an omnidirectional reflecting current isolation layer, a first-type semiconductor current spreading layer, a light emitting diode layer, a second-type semiconductor current spreading layer and a second metal conductive layer. The metal reflective layer includes at least one surrounding wall structure. The omnidirectional reflecting current isolation layer is arranged on the metal reflective layer and entirely covers the two sides of the at least one surrounding wall structure to form at least one cylindrical channel. The light emitting diode layer is located in the at least one cylindrical channel.
    Type: Application
    Filed: November 18, 2022
    Publication date: May 23, 2024
    Inventors: Chih-Sung CHANG, Wei-Yu YEN, Wayne JAN, Tau-Jin WU
  • Patent number: 11970755
    Abstract: The present disclosure discloses an application of cuprous sulfide in a recovery of Au (III) from aqueous solutions, which relates to the fields of hydrometallurgy and precious metal recovery. The method of the present disclosure uses cuprous sulfide nanoparticles to recover Au (III) from aqueous solution, and undergoes gold adsorption under mechanical stirring. The method described in the present disclosure can efficiently recover Au (III) from aqueous solutions, has good recovery effects on Au (III) from acidic waste liquid, and has the advantages of energy conservation, environmental protection, and low cost.
    Type: Grant
    Filed: October 16, 2023
    Date of Patent: April 30, 2024
    Assignee: Kunming University of Science and Technology
    Inventors: Yunlong Chen, Jin Wu, Futing Zi, Xianzhi Hu, Fengru Meng, Yongmao Zeng, Zhongying Wang, Yihuai Yang
  • Publication number: 20240132996
    Abstract: The present disclosure discloses an application of cuprous sulfide in a recovery of Au (III) from aqueous solutions, which relates to the fields of hydrometallurgy and precious metal recovery. The method of the present disclosure uses cuprous sulfide nanoparticles to recover Au (III) from aquesous solution, and undergoes gold adsorption under mechanical stirring. The method described in the present disclosure can efficiently recover Au (III) from aqueous solutions, has good recovery effects on Au (III) from acidic waste liquid, and has the advantages of energy conservation, environmental protection, and low cost.
    Type: Application
    Filed: October 15, 2023
    Publication date: April 25, 2024
    Inventors: Yunlong Chen, Jin Wu, Futing Zi, Xianzhi Hu, Fengru Meng, Yongmao Zeng, Zhongying Wang, Yihuai Yang
  • Publication number: 20240120355
    Abstract: Implementations of a cover for an image sensor may include an optically transmissive portion and a black mask layer applied as a strip adjacent a perimeter of a largest planar surface of the optically transmissive portion. The first edge of the strip closest to the perimeter may be separated from the perimeter by a predetermined distance.
    Type: Application
    Filed: September 25, 2023
    Publication date: April 11, 2024
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Gregg BARDEL, Shih-Chang TAI, Shunsuke YASUDA, Weng-Jin WU
  • Publication number: 20240109888
    Abstract: Compounds having formula (I), and enantiomers, and diastereomers, stereoisomers, pharmaceutically-acceptable salts thereof, are useful as kinase modulators, including RIPK1 modulation. All the variables are as defined herein.
    Type: Application
    Filed: July 6, 2023
    Publication date: April 4, 2024
    Inventors: Guanglin Luo, Jie Chen, Carolyn Diane Dzierba, David B. Frennesson, Junqing Guo, Amy C. Hart, Xirui Hu, Michael E. Mertzman, Matthew Reiser Patton, Jianliang Shi, Steven H. Spergel, Brian Lee Venables, Yong-Jin Wu, Zili Xiao, Michael G. Yang
  • Publication number: 20240102645
    Abstract: The present invention relates to a candle which includes a base unit and a candle body which is mounted to the base unit. The candle body includes a wick and a fibre optic running therethrough. The base unit includes a light sensor configured to detect light from the wick, when lit. There is additionally provided a light source configured to operate in dependence on detection of light by the light sensor.
    Type: Application
    Filed: November 5, 2020
    Publication date: March 28, 2024
    Inventors: Martin Richard BUTLER, Jin WU, Guoqiang LAI, Bin LIAO, Fengyang WANG
  • Patent number: 11920845
    Abstract: An ice making assembly includes an ice mold and a pump assembly for urging an ice-building spray into the ice mold to form an ice billet. A controller operates the pump assembly to provide the ice-building spray at a first flow rate until the ice billet reaches a predetermined thickness and then operates the pump assembly to provide the ice-building spray at a second flow rate that is less than the first flow rate.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: March 5, 2024
    Assignee: Haier US Appliance Solutions, Inc.
    Inventors: Andrew Schiller, Adam Pusateri, Justin Tyler Brown, Brent Alden Junge, Jin Wu, Bo Yan, Yayu Song, Michael Zhou, Roy Teng, Eddy Zhou, Jason Jiang
  • Publication number: 20240067816
    Abstract: A thermoplastic vulcanizate is provided. The thermoplastic vulcanizate includes: (A) about 100 parts by weight of a styrene copolymer rubber; (B) about 40-90 parts by weight of a thermoplastic elastomer; (C) about 5-15 parts by weight of an interfacial compatible resin; and (D) about 0.2-3 parts by weight of a cross-linking formulation, wherein the content of component (A) is greater than the content of component (B). Component (A) is dispersed in component (B) in the form of particles with a particle size of about 0.5-10 ?m.
    Type: Application
    Filed: May 16, 2023
    Publication date: February 29, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jin-An WU, Fu-Ming CHIEN, Yun-Chen CHANG
  • Publication number: 20240065367
    Abstract: A sports shoe is provided. The sports shoe includes a shoe vamp and a shoe sole connected to the shoe vamp. The shoe vamp includes a textile component, wherein the textile component includes thermoplastic polyester fibers. The shoe sole includes a shoe outsole and a shoe midsole foam disposed between the shoe outsole and the shoe vamp, wherein the shoe outsole includes a vulcanizate and the shoe midsole foam includes a first thermoplastic elastomer. The vulcanizate includes rubber particles, a second thermoplastic elastomer, and an interface-compatible resin, wherein the content of the rubber particles is greater than the content of the second thermoplastic elastomer. The rubber particles are dispersed in the second thermoplastic elastomer in the form of spherical particles with particle sizes of about 0.5-10 um.
    Type: Application
    Filed: August 23, 2023
    Publication date: February 29, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jin-An WU, Che-Tseng LIN, Chien-Ming CHEN
  • Publication number: 20240030265
    Abstract: In a general aspect, a package includes an optical sensor die fabricated in a semiconductor wafer. The optical sensor die has an optically active area on a front side of the semiconductor wafer generating a raw image signal. A transparent cover attached to the front side of the semiconductor wafer above the optically active area of the optical sensor die. An image signal processor (ISP) die processing the raw image signal is embedded in a layer of molding material attached to a back side the semiconductor wafer opposite the front side of the semiconductor wafer.
    Type: Application
    Filed: July 21, 2022
    Publication date: January 25, 2024
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Weng-Jin WU
  • Patent number: 11807746
    Abstract: An impact-resistant polystyrene resin includes a continuous phase and a plurality of particles dispersed in the continuous phase. The average particle size of the particles is about 0.1 to 4.0 ?m, and the average distance between the particles is about 0.3 to 5.0 ?m. The impact-resistant polystyrene resin is made from a polystyrene composition including a polystyrene plastic, a styrene block copolymer, a processing aid, and an antioxidant.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: November 7, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kuan-Yeh Huang, Jin-An Wu, Fu-Ming Chien, Yun-Chen Chang, Fan-Jie Lin
  • Patent number: 11767322
    Abstract: Compounds having formula (I), and enantiomers, and diastereomers, stereoisomers, pharmaceutically-acceptable salts thereof, are useful as kinase modulators, including RIPK1 modulation. All the variables are as defined herein.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: September 26, 2023
    Assignee: Bristol-Myers Squibb Company
    Inventors: Guanglin Luo, Jie Chen, Carolyn Diane Dzierba, David B. Frennesson, Junqing Guo, Amy C. Hart, Xirui Hu, Michael C. Mertzman, Matthew Reiser Patton, Jianliang Shi, Steven H. Spergel, Brian Lee Venables, Yong-Jin Wu, Zili Xiao, Michael G. Yang
  • Patent number: D1023265
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: April 16, 2024
    Assignee: Reckitt & Colman (Overseas) Hygiene Home Limited
    Inventors: Eleanor Bainton, John Mouatt, Dafni Panagopoulou, Blake John Parkinson, David Sanders, James Peter Spence, Fengyang Wang, Christopher Brian Witty, Cheeyong Woon, Jin Wu, George Zhang
  • Patent number: D1026344
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: May 7, 2024
    Assignee: Beijing Kitten & Puppy Technology Co., Ltd.
    Inventors: Jin Wu, Jiefeng Liu, Lianhong Niu
  • Patent number: D1031964
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: June 18, 2024
    Assignee: Reckitt & Colman (Overseas) Hygiene Home Limited
    Inventors: Warz Choi, Jeremy Dodd, Emily Christina Giversen, Miles Andrew Kilburn, Tangent Lu, Blake John Parkinson, Samuel James Roper, David Sanders, James Peter Spence, Fengyang Wang, Jake Stephen Williams, Christopher Brian Witty, Jin Wu, George Zhang