Patents by Inventor Jin-Biao Liu

Jin-Biao Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7277287
    Abstract: A heat dissipation device comprises a seat for absorbing heat from a heat generating device. At least a heat pipe has a first section thereof thermally combined to the seat, and two second sections thereof extending from the first section and remotely from the seat. Pluralities of heat sinks are located on the seat. Each of the pluralities of heat sinks has a base and a plurality of fins integrally extending from the base and is made of aluminum extrusion. The bases of the heat sinks thermally sandwich the two second sections of the at least a heat pipe therebetween. At least one of the bases of the heat sinks is angled or perpendicular to the seat.
    Type: Grant
    Filed: March 20, 2006
    Date of Patent: October 2, 2007
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shih-Hsun Wung, Guang Yu, Da-Yuan Zhou, Jin-Biao Liu
  • Publication number: 20070215335
    Abstract: A heat sink includes a base and a plurality of column-shaped fins. The base defines an array of blind holes therein. The fins threadedly engage in the base at the blind holes by self-tapping so that the fins are interferentially and intimately engaged with the base. The fins each include a head for facilitating to turn the fins, a terminated cone received in the blind holes and a spiral thread between the head and the terminated cone.
    Type: Application
    Filed: March 14, 2006
    Publication date: September 20, 2007
    Inventors: Chun-Chi Chen, Shih-Hsun Wung, Guang Yu, Da-Yuan Zhou, Jin-Biao Liu
  • Publication number: 20070165374
    Abstract: A heat dissipation device in a computer enclosure includes a heat spreader (20) mounted on a CPU (12), a first heat sink (30), a cooling fan (40) coupled to the first heat sink, a second heat sink (50), a heat pipe (80) mounted on the heat spreader and thermally connected the first heat sink and the second heat sink, a system fan (60) attached to the second heat sink, and a fan duct (70) interconnected between the cooling fan and the second heat sink. The system fan is positioned adjacent to louvers of the computer enclosure. An airflow generated by the cooling fan and the system fan flows through the first heat sink, then the fan duct, the second heat sink, and finally the louvers to leave the computer enclosure.
    Type: Application
    Filed: January 19, 2006
    Publication date: July 19, 2007
    Inventors: Chun-Chi Chen, Shih-Hsun Wung, Guang Yu, Da-Yuan Zhou, Jin-Biao Liu
  • Publication number: 20070144705
    Abstract: A heat sink for dissipating heat from an electronic element comprises a base with a plurality of first fins extending upwardly therefrom, a conducting member thermally contacting the base with a plurality of second fins extending from two opposite lateral face of the conducting member toward different directions and perpendicular to the first fins, a heat pipe connecting the base and the conducting member to transfer heat from the base to the conducting member.
    Type: Application
    Filed: December 28, 2005
    Publication date: June 28, 2007
    Inventors: Chun-Chi Chen, Shih-Hsun Wung, Guang Yu, Da-Yuan Zhou, Jin-Biao Liu
  • Publication number: 20070114006
    Abstract: A heat-dissipating fin assembly (1) includes a plurality of individual fin plates (10) arranged side by side. Each of the fin plates includes a main body (14) and a pair of flanges extending perpendicularly from opposite top and bottom sides of the main body. Each flange comprises a first plane extending from the main body and a second plane extending from the first plane. The second plane comprises a pair of engaging projections extending from two ends thereof. The second plane of a rear fin plate covers the first plane of an adjacent front fin plate. The rear and front fin plates are interlocked by the engaging projections of the rear fin plate bent to respectively engage two ends of the first plane of the front fin plate.
    Type: Application
    Filed: November 21, 2005
    Publication date: May 24, 2007
    Inventors: Chun-Chi Chen, Shih-Hsun Wung, Guang Yu, Da-Yuan Zhou, Jin-Biao Liu
  • Publication number: 20070091568
    Abstract: A heat sink includes a fin assembly (20) including a plurality of fin plates (22) and a fan (30) mounted on the fin assembly. Each fin plate includes a plurality of cutouts (226) defined on one edge thereof, and the cutouts of the fin plates cooperatively form a scraggy surface when the fin plates are assembled together. Airflow produced by the fan directly impinges on the scraggy surface thereby enhancing heat transferring between the fin plates and the airflow.
    Type: Application
    Filed: October 24, 2005
    Publication date: April 26, 2007
    Inventors: Chun-Chi Chen, Shih-Hsun Wung, Guang Yu, Da-Yuan Zhou, Jin-Biao Liu
  • Publication number: 20060273137
    Abstract: A heat dissipation device comprises a seat for absorbing heat from a heat generating device. At least a heat pipe has a first section thereof thermally combined to the seat, and two second sections thereof extending from the first section and remotely from the seat. Pluralities of heat sinks are located on the seat. Each of the pluralities of heat sinks has a base and a plurality of fins integrally extending from the base and is made of aluminum extrusion. The bases of the heat sinks thermally sandwich the two second sections of the at least a heat pipe therebetween. At least one of the bases of the heat sinks is angled or perpendicular to the seat.
    Type: Application
    Filed: March 20, 2006
    Publication date: December 7, 2006
    Applicant: FOXCONN TECHNOLOGY CO.,LTD.
    Inventors: Chun-Chi Chen, Shih-Hsun Wung, Guang Yu, Da-Yuan Zhou, Jin-Biao Liu