Patents by Inventor Jin Bo Chae

Jin Bo Chae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoplastic resin composition having high rigidity and low coefficient of linear thermal expansion and molded article comprising same
    Patent number: 11884802
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene composite resin including high-crystalline polypropylene and the like, an elastomer, and an inorganic filler.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: January 30, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, HDC HYUNDAI ENGINEERING PLASTICS CO., LTD.
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Jin Bo Chae
  • THERMOPLASTIC RESIN COMPOSITION HAVING HIGH RIGIDITY AND LOW COEFFICIENT OF LINEAR THERMAL EXPANSION AND MOLDED ARTICLE COMPRISING SAME
    Publication number: 20230020121
    Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene composite resin including high-crystalline polypropylene and the like, an elastomer, and an inorganic filler.
    Type: Application
    Filed: July 6, 2022
    Publication date: January 19, 2023
    Inventors: Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Jin Bo Chae