Abstract: An inner module with a retainer is installed primarily inside a wireless earphone, including a circuit loop, an insulation seat to fix the circuit loop, and at least a retainer. The circuit loop includes at least a first circuit board, and at least a second circuit board which is extended from the first circuit board. The insulation seat includes at least a base plate to enclose the first circuit board, and a first side wall which is extended from the base plate. The first side wall is provided with a first positioning slot to accommodate the second circuit board. The retainer is fixed on the first side wall to fix the second circuit board in the first positioning slot. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone.

Abstract: A combinatorial inner module is installed primarily inside a wireless earphone, including a circuit loop, a lower cover and an upper cover. The circuit loop is provided with a first circuit board and a second circuit board which is extended from the first circuit board. The upper cover is disposed above the lower cover to fix the first circuit board between the upper cover and the lower cover. Moreover, the upper cover includes a first side wall which is formed with an angle with respect to the lower cover and is used to install the second circuit board, forming an included angle between the second circuit board and the first circuit board. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone, which reduces the labor cost in assembling the wireless earphone significantly.

Abstract: An inner module used in a wireless earphone is installed primarily in a wireless earphone, including a circuit loop and an upper cover. The circuit loop includes at least a first circuit board, at least a second circuit board which is extended from the first circuit board, and a lower cover which encloses the first circuit board. The upper cover is installed on the lower cover, including a first side wall which forms an angle with respect to the lower cover. In addition, the first side wall is provided with a first positioning slot to accommodate the second circuit board. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone, which reduces the labor cost in assembling the wireless earphone significantly.

Abstract: An inner module assembly formed by a metal tape is installed primarily inside a wireless earphone. The inner module assembly includes a circuit loop having a first circuit board and a second circuit board, with the circuit loop being formed with plural junctions; a first metal tape which fixes the second circuit board and includes a first extension section extending to the outside of the second circuit board and having a first cut-off face; and an insulation seat which is formed on the first circuit board to enclose the circuit loop and the first metal tape, with part of the junctions and the first cut-off face being exposed on a surface of the insulation seat. Therefore, the inner module assembly is formed into a modularized design to simplify the assembly procedure of the wireless earphone.

Abstract: An inner module used in a wireless earphone is installed primarily in a wireless earphone, including a circuit loop and an upper cover. The circuit loop includes at least a first circuit board, at least a second circuit board which is extended from the first circuit board, and a lower cover which encloses the first circuit board. The upper cover is installed on the lower cover, including a first side wall which forms an angle with respect to the lower cover. In addition, the first side wall is provided with a first positioning slot to accommodate the second circuit board. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone, which reduces the labor cost in assembling the wireless earphone significantly.

Abstract: An inner module with a retainer is installed primarily inside a wireless earphone, including a circuit loop, an insulation seat to fix the circuit loop, and at least a retainer. The circuit loop includes at least a first circuit board, and at least a second circuit board which is extended from the first circuit board. The insulation seat includes at least a base plate to enclose the first circuit board, and a first side wall which is extended from the base plate. The first side wall is provided with a first positioning slot to accommodate the second circuit board. The retainer is fixed on the first side wall to fix the second circuit board in the first positioning slot. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone.

Abstract: A combinatorial inner module is installed primarily inside a wireless earphone, including a circuit loop, a lower cover and an upper cover. The circuit loop is provided with a first circuit board and a second circuit board which is extended from the first circuit board. The upper cover is disposed above the lower cover to fix the first circuit board between the upper cover and the lower cover. Moreover, the upper cover includes a first side wall which is formed with an angle with respect to the lower cover and is used to install the second circuit board, forming an included angle between the second circuit board and the first circuit board. Therefore, the inner module is formed into a modularized design to simplify the assembly procedure of the wireless earphone, which reduces the labor cost in assembling the wireless earphone significantly.

Abstract: An inner module assembly formed by a metal tape is installed primarily inside a wireless earphone. The inner module assembly includes a circuit loop having a first circuit board and a second circuit board, with the circuit loop being formed with plural junctions; a first metal tape which fixes the second circuit board and includes a first extension section extending to the outside of the second circuit board and having a first cut-off face; and an insulation seat which is formed on the first circuit board to enclose the circuit loop and the first metal tape, with part of the junctions and the first cut-off face being exposed on a surface of the insulation seat. Therefore, the inner module assembly is formed into a modularized design to simplify the assembly procedure of the wireless earphone.