Patents by Inventor Jin-Cheol Kim

Jin-Cheol Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7676921
    Abstract: A method of manufacturing a printed circuit board including embedded capacitors, composed of a polymer condenser laminate including a plurality of polymer condenser layers, each of which has a polymer sheet and a conductor pattern formed on the polymer sheet, and a via hole for interlayer connection therethrough, and a circuit layer formed on either surface or both surfaces of the polymer condenser laminate and having a circuit pattern and a via hole for interlayer connection therethrough. The printed circuit board manufactured by the method of the current invention has higher capacitance density per unit area than conventional embedded capacitor printed circuit boards, whereby capacitors having various capacitance values, such as multilayered ceramic capacitors having high capacitance, can be embedded in the printed circuit board, instead of being mounted thereon.
    Type: Grant
    Filed: February 2, 2007
    Date of Patent: March 16, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Cheol Kim, Min Soo Kim, Jun Rok Oh, Tae Kyoung Kim
  • Publication number: 20090288863
    Abstract: The present invention relates to a glass composition having a low thermal expansion coefficient, a glass fiber, an insulating layer of printed circuit board and a printed circuit board. A glass fiber, an insulating layer of printed circuit board and a printed circuit board may be obtained by employing a glass composition including 40 to 60 parts by weight of silicon oxide, 20 to 40 parts by weight of aluminum oxide and 5 to 20 parts by weight of lithium oxide.
    Type: Application
    Filed: December 30, 2008
    Publication date: November 26, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin-Cheol Kim, Jun-Rok Oh
  • Patent number: 7618553
    Abstract: Disclosed is an insulating material for a printed circuit board, including a liquid crystal polyester resin and ceramic powder, thus exhibiting a temperature coefficient of capacitance ranging from ?300 to +300 ppm/° C. in the temperature range of ?55˜125° C. and a dielectric constant ranging from 5 to 40. This insulating material has superior dielectric properties, and a small change in dielectric constant depending on the change in temperature, and thus exhibits high reliability when applied to high-frequency circuits.
    Type: Grant
    Filed: September 21, 2007
    Date of Patent: November 17, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Cheol Kim, Jun Rok Oh, Tae Kyoung Kim, Sang Jun Yoon, Hwa Young Lee
  • Publication number: 20090262520
    Abstract: A backlight unit is disclosed. The backlight unit may include a thermoplastic resin board in which cavities may be formed, a light emitting diode (LED) component which may be mounted on a bottom surface of the cavity, and a molding resin which may be filled in the cavity and which may secure the light emitting diode component. The thermoplastic resin board may include a light-reflective filler, to improve reflection efficiency, dispersed within the thermoplastic resin board. According to certain embodiments of the invention, a simple process can be utilized to reduce the thickness of the backlight unit, making it applicable to compact devices.
    Type: Application
    Filed: August 22, 2008
    Publication date: October 22, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ho-Joon Park, Jin-Cheol Kim, Sang-Jun Yoon, Geum-Hee Yun, Jun-Rok Oh
  • Publication number: 20090189177
    Abstract: Disclosed are a light emitting diode package and a manufacturing method thereof. According to an embodiment of the present invention, the method includes: manufacturing a package main body having a plurality of cavities, the cavities being formed in a line on one surface, through molding by putting thermoplastic polymer into a previously produced mold; forming an electrode passing through the package main body; mounting a light emitting diode chip on a basal surface of the each cavity formed in the package main body; connecting electrically the light emitting diode chip and the electrode by using a bonding means; and sealing the light emitting diode chip and the bonding means by using a molding resin.
    Type: Application
    Filed: September 30, 2008
    Publication date: July 30, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hwa-Young Lee, Ho-Joon Park, Jin Cheol Kim, Sang-Jun Yoon, Geum-Hee Yun, Jun-Rok Oh
  • Publication number: 20090168449
    Abstract: Disclosed is a light emitting diode unit, more particularly, a light emitting diode unit including a thermoplastic substrate, a light emitting diode, mounted on one surface of the thermoplastic substrate and a heat sink, directly adhered to the other surface of the thermoplastic substrate. With the present invention, the manufacturing cost and the manufacturing time of the light emitting diode unit can be reduced by allowing the heat sink, discharging the heat generated by the light emitting diode, to be directly adhered to the substrate on which the light emitting diode is mounted. Also, the heat discharging ability of the light emitting diode unit by using the heat sink directly adhered to the thermoplastic substrate.
    Type: Application
    Filed: June 11, 2008
    Publication date: July 2, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ho-Joon Park, Jun-Rok Oh, Jin-Cheol Kim, Sang-Jun Yoon, Hwa-Young Lee
  • Publication number: 20090141481
    Abstract: Disclosed are an array light source using a light-emitting diode and a backlight unit including the same. In accordance with an embodiment of the present invention, the array light source can include a plurality of light-emitting diodes (LED); and a wiring board on which wires for transferring signals to each of the LEDs are formed. Here, the wiring board can include a plurality of sublayers, and the wires can be divided into at least two wiring groups and separately formed on different sublayers of the wring board per wiring group.
    Type: Application
    Filed: April 23, 2008
    Publication date: June 4, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ho-Joon PARK, Jin-Cheol KIM, Sang-Jun YOON, Hwa-Young LEE, Geum-Hee YUN, Jun-Rok OH
  • Publication number: 20090106977
    Abstract: A manufacturing method of a printed circuit board is disclosed. The method may include: forming a circuit pattern on a surface of an insulation layer, made primarily from a thermoplastic resin, such that the circuit pattern protrudes from the surface of the insulation layer, and burying the circuit pattern in the insulation layer by pressing the circuit pattern.
    Type: Application
    Filed: May 8, 2008
    Publication date: April 30, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin-Cheol Kim, Jun-Rok Oh
  • Patent number: 7463840
    Abstract: Provided is an electro-photographic image forming apparatus and a method of determining a charging voltage thereof. The electro-photographic image forming apparatus includes: a charge roller for supplying a voltage of a predetermined level to a photoconductor; a transfer roller for transferring a developed image to a printing media by using a developer; a high voltage power supply for supplying a charging voltage at a preset level and a transfer voltage at a preset level to the charge roller and the transfer roller, respectively; and a controller for predicting a charged electric potential deviation based on the transfer voltage to be supplied by the high voltage power supply and for determining a charging voltage level to correct for the predicted charged electric potential deviation. Therefore, the deviation of the charged electric potential caused by the transfer voltage is prevented.
    Type: Grant
    Filed: May 31, 2006
    Date of Patent: December 9, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jin-Cheol Kim, Joong-gwang Shi, Yoo-seok Yang
  • Publication number: 20080242787
    Abstract: The present invention relates a eucryptite ceramic filler and an insulating composite material containing the eucryptite ceramic filler. In particular, the invention provides a eucryptite ceramic filler of formula (I): xLiO2-yAl2O3-zSiO2 ??(I) wherein x, y and z represent a molar ratio, x and y are each independently from 0.9 to 1.1, and z is from 1.9 to 2.1; and the eucryptite ceramic filler is used to reduce a coefficient of thermal expansion of an insulating composite material.
    Type: Application
    Filed: January 18, 2008
    Publication date: October 2, 2008
    Inventors: Jin-Cheol Kim, Jun-Rok Oh, Geum-Hee Yun, Hwa-Young Lee, Tae-Koung Kim
  • Publication number: 20080223603
    Abstract: A capacitor embedded printed circuit board (PCB), the PCB including: a multilayer polymer capacitor layer where a plurality of polymer sheets is laminated; one or more first inner electrodes and second inner electrodes, separated by one or more of the plurality of polymer sheets and alternately disposed to form a pair; a plurality of first extended electrodes and second extended electrodes connected to the first inner electrodes and second inner electrodes, respectively; one or more insulating layers laminated on one or both surfaces of the multilayer polymer capacitor, where a plurality of conductive patterns and conductive via holes, forming an interlayer circuit are formed; a plurality of first via holes for capacitor, penetrating the multilayer polymer capacitor layer to be connected to the first extended electrodes; and a plurality of second via holes for capacitor, penetrating the multilayer polymer capacitor layer to be connected to the second extended electrodes, wherein the plurality of the first and
    Type: Application
    Filed: February 12, 2008
    Publication date: September 18, 2008
    Inventors: Jin Cheol Kim, Tae Kyoung Kim, Jun Rok Oh
  • Publication number: 20080187337
    Abstract: An image forming apparatus includes an image former which comprises a photosensitive body and a developing device to apply a developer to the photosensitive body, a power supply which supplies developing voltage to the developing device, a detector which detects a density of an image formed by the image former, and a controller which controls the power supply to adjust a level of the developing voltage if the detected density is out of a permissible range.
    Type: Application
    Filed: January 8, 2008
    Publication date: August 7, 2008
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jin-cheol KIM, Hyun-sun Jung, Yoo-seok Yang, Yong-baek Yoo
  • Publication number: 20080166146
    Abstract: An image forming apparatus includes a moving unit including a conveyer belt which moves a printing medium, an attraction unit to attract the printing medium to the conveyer belt, a transferring unit to transfer developer onto the printing medium, a power supply which supplies transfer power and attraction power to the transferring unit and the attraction unit, and a controller which controls the power supply to supply only one of the transfer power and the attraction power in accordance with a location of the printing medium.
    Type: Application
    Filed: December 21, 2007
    Publication date: July 10, 2008
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jeong-hwan KIM, Jin-cheol Kim, Hyun-sun Jung, Yoo-seok Yang
  • Publication number: 20080159783
    Abstract: An image forming apparatus including: a plurality of photosensitive members on which electrostatic latent images are formed; a plurality of charge units to charge the respective photosensitive members with an electric potential; at least one exposure unit which irradiates light to the respective photosensitive members; a plurality of developer supply devices, which adhere a developer to the respective photosensitive members, to form visible images on a surface of the respective photosensitive members; a transfer unit, which transfers the visible images formed on the respective photosensitive members to a transfer medium; and a plurality of exposure lamps which are mounted between the plurality of photosensitive members.
    Type: Application
    Filed: September 28, 2007
    Publication date: July 3, 2008
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: HYUN SUN JUNG, Jin Cheol Kim, Yoo Seok Yang
  • Publication number: 20080081177
    Abstract: Disclosed is an insulating material for a printed circuit board, including a liquid crystal polyester resin and ceramic powder, thus exhibiting a temperature coefficient of capacitance ranging from ?300 to +300 ppm/° C. in the temperature range of ?55˜125° C. and a dielectric constant ranging from 5 to 40. This insulating material has superior dielectric properties, and a small change in dielectric constant depending on the change in temperature, and thus exhibits high reliability when applied to high-frequency circuits.
    Type: Application
    Filed: September 21, 2007
    Publication date: April 3, 2008
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD
    Inventors: Jin Cheol Kim, Jun Rok Oh, Tae Kyoung Kim, Sang Jun Yoon, Hwa Young Lee
  • Patent number: 7281321
    Abstract: The present invention is related to a printed circuit board having embedded capacitors using a hybrid material and a method of manufacturing the same. This invention provides a printed circuit board having embedded capacitors using a material for a hybrid dielectric layer including liquid crystal polymer and ceramic powder, and a method of manufacturing such a printed circuit board.
    Type: Grant
    Filed: February 22, 2006
    Date of Patent: October 16, 2007
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Kyoung Kim, Jun Rok Oh, Jin Cheol Kim
  • Publication number: 20070172248
    Abstract: A charging voltage supply and a method for supplying a charging voltage are provided. The charging voltage supply generates a voltage and branches the generated voltage to at least one charging roller according to voltage applied to a transfer roller. Accordingly, the charging voltage supply can compensate for the charging voltage in view of the reduction of a charging potential of a photosensitive body according to the transfer voltage.
    Type: Application
    Filed: November 17, 2006
    Publication date: July 26, 2007
    Inventors: Joong-gwang Shin, Yong-baek Yoo, Jin-cheol Kim, Yoo-seok Yang
  • Publication number: 20070086800
    Abstract: An image forming apparatus includes at least one photoconductive medium on which an electrostatic latent image is formed; at least one developing device for developing the electrostatic latent image formed on the photoconductive medium with a developer to form a visible developer image, and a developing performance improving unit for controlling at least one of the photoconductive medium and the developing device to periodically form a patch developer image using developer that has uneven attributes (such as uneven coulomb per mass (Q/M)), and clean and remove the patch developer image. Accordingly, developer having uneven Q/M is periodically used for printing patch developer image and removed, thereby preventing the developer from being used for desired images, and thereby preventing inferior developing of desired images at the uneven-developer generating parts.
    Type: Application
    Filed: March 21, 2006
    Publication date: April 19, 2007
    Inventors: Yoo-seok Yang, Jin-cheol Kim, Joong-gwang Shin
  • Publication number: 20070086802
    Abstract: A method and apparatus for applying a developing bias voltage of an image forming apparatus are provided. When an image is formed on paper, an AC bias voltage and a DC bias voltage are applied in an overlapping manner to the developing roller, and when an image is not formed on paper, the AC bias voltage is turned off and only the DC bias voltage is applied to the developing roller.
    Type: Application
    Filed: July 21, 2006
    Publication date: April 19, 2007
    Inventors: Joong-gwang Shin, Jin-cheol Kim, Yoo-seok Yang
  • Publication number: 20070077079
    Abstract: Provided is an electro-photographic image forming apparatus and a method of determining a charging voltage thereof. The electro-photographic image forming apparatus includes: a charge roller for supplying a voltage of a predetermined level to a photoconductor; a transfer roller for transferring a developed image to a printing media by using a developer; a high voltage power supply for supplying a charging voltage at a preset level and a transfer voltage at a preset level to the charge roller and the transfer roller, respectively; and a controller for predicting a charged electric potential deviation based on the transfer voltage to be supplied by the high voltage power supply and for determining a charging voltage level to correct for the predicted charged electric potential deviation. Therefore, the deviation of the charged electric potential caused by the transfer voltage is prevented.
    Type: Application
    Filed: May 31, 2006
    Publication date: April 5, 2007
    Inventors: Jin-Cheol Kim, Joong-gwang Shi, Yoo-seok Yang