Abstract: Heat management in electronic components is an important factor in managing the performance and longevity of such electronic components. By omitting a thermal interface layer and providing thermal vias between a heatsink and an electronic component, such as a surface mount technology (SMT) package, such components may improve thermal transfer to the heatsink and simplify assembly. Thermal vias may be fused during reflow to the heatsink and/or electronic component. As a benefit to the improved heat transfer provided, electronic components may operate at a lower temperature or be configured to perform greater heat-producing activities.

Abstract: Heat management in electronic components is an important factor in managing the performance and longevity of such electronic components. By omitting a thermal interface layer and providing thermal vias between a heatsink and an electronic component, such as a surface mount technology (SMT) package, such components may improve thermal transfer to the heatsink and simplify assembly. Thermal vias may be fused during reflow to the heatsink and/or electronic component. As a benefit to the improved heat transfer provided, electronic components may operate at a lower temperature or be configured to perform greater heat-producing activities.

Abstract: An electronic apparatus with natural convection structure is disclosed. The electronic apparatus with natural convection structure includes a main body to be placed on a surface, a hole piercing through the main body from a top surface to a bottom surface of the main body, and a supporting device disposed on the bottom surface of the main body. Via the specific height of the supporting device, the air under and near the bottom surface of the main body can flow through the hole for improving heat-dissipation of the electronic apparatus.

Abstract: A rotary total heat exchange apparatus (30) includes at least an air-providing member (3301), a first air passage and a second air passage, and a total heat exchange wheel (3311). The air-providing member provides a first airflow from outdoors and a second airflow from indoors into the rotary total heat exchange apparatus. The first and second air passages isolate from each other for guiding the first and second airflows respectively passing through the heat exchange wheel. The total heat exchange wheel faces to the first and second airflows provided by the air-providing member, and is capable of rotating through the first and second air passages for conducting a total heat exchange between the first and second airflows.

Abstract: A rotary total heat exchange apparatus (30) includes at least an air-providing member (3301), a first air passage and a second air passage, and a total heat exchange wheel (3311). The air-providing member provides a first airflow from outdoors and a second airflow from indoors into the rotary total heat exchange apparatus. The first and second air passages isolate from each other for guiding the first and second airflows respectively passing through the heat exchange wheel. The total heat exchange wheel faces to the first and second airflows provided by the air-providing member, and is capable of rotating through the first and second air passages for conducting a total heat exchange between the first and second airflows.

Abstract: A total heat exchanger in accordance with a preferred embodiment includes air-guiding means (21), a heat-pipe heat exchanger (31) and a total heat exchange member (41). The air-guiding means is for providing a first airflow from outdoors and a second airflow from indoors. The heat-pipe heat exchanger includes at least one heat pipe (32) spanning across said first and second airflows simultaneously for conducting a sensible heat exchange between the airflows. The total heat exchange member is capable of exchanging sensible heat and latent heat between said first and second airflows, and defines therein a first air passage and a second air passage intersecting with and isolated from each other. A total heat exchange of sensible heat and latent heat between the first and second airflows is carried out in the total heat exchange member when the airflows flow through the first and second air passages respectively.

Abstract: An electronic apparatus with natural convection structure is disclosed. The electronic apparatus with natural convection structure includes a main body to be placed on a surface, a hole piercing through the main body from a top surface to a bottom surface of the main body, and a supporting device disposed on the bottom surface of the main body. Via the specific height of the supporting device, the air under and near the bottom surface of the main body can flow through the hole for improving heat-dissipation of the electronic apparatus.

Abstract: A waterproof and heat-dissipating structure of an electronic apparatus including a circuit board, an input element and an output element is disclosed. The structure includes an aluminum-wrapped housing having at least four adjoining surfaces for defining a space, a first opening end and a second opening end, wherein the space is used for accommodating the circuit board, a first lateral plate fixed to the aluminum-wrapped housing, covering the first opening end and having a first hole for fixing the input element therein, and a second lateral plate fixed to the aluminum-wrapped housing, covering the second opening end and having a second hole for fixing the output element therein.

Abstract: A waterproof and heat-dissipating structure of an electronic apparatus including a circuit board, an input element and an output element is disclosed. The structure includes an aluminum-wrapped housing having at least four adjoining surfaces for defining a space, a first opening end and a second opening end, wherein the space is used for accommodating the circuit board, a first lateral plate fixed to the aluminum-wrapped housing, covering the first opening end and having a first hole for fixing the input element therein, and a second lateral plate fixed to the aluminum-wrapped housing, covering the second opening end and having a second hole for fixing the output element therein.

Abstract: Conducting articles such as fibers, films, tapes and the like are fabricated from intractable conducting polymers such as polyacetylene. The articles are prepared by (a) forming a gel of a carrier polymer in a compatible solvent, (b) polymerizing, within the gel, a selected monomer, and (c) doping the article so provided. The articles are highly electrically conductive as well as mechanically quite strong.

Abstract: Conducting articles such as fibers, films, tapes and the like are fabricated from intractable conducting polymers such as polyacetylene. The articles are prepared by (a) forming a gel of a carrier polymer in a compatible solvent, (b) polymerizing, within the gel, a selected monomer, and (c) doping the article so provided. The articles are highly electrically conductive as well as mechanically quite strong.