Patents by Inventor Jin-Gi JUNG

Jin-Gi JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240104217
    Abstract: A software package, a gateway for transmitting the same, and a software update method using the same are provided. A software package includes a binary file, a configuration file, and a hash file. The binary file includes read-only memory (ROM) data of a target controller. A management server generates the configuration file by combining a hash value obtained by hashing the binary file with meta information indicating an update procedure between a gateway and the target controller. The management server generates the hash file by hashing the configuration file. The gateway receives the software package and extract the binary file and the configuration file. The gateway transmits the binary file to the target controller according to the update procedure indicated by the meta information.
    Type: Application
    Filed: May 24, 2023
    Publication date: March 28, 2024
    Inventors: Yoon Sik Jung, Myeong Gyu Jeong, Jin Ah Kim, Hak Jun Kim, Min Gi Kim, Hyeok Sang Jeong, Young Jee Yang
  • Publication number: 20240078104
    Abstract: A vehicular software update system for remotely performing a software update of a vehicle and a method thereof are provided. The vehicular software update system includes a management controller installed in a vehicle and a server that performs a remote software update in cooperation with the management controller. The management controller controls the vehicle to start in response to receiving a request for the remote software update from the server, downloads software for update from the server after controlling the vehicle to start, transmits the downloaded software for update to a performance controller in the background, determines whether the transmission of the software for update in the background is completed based on the vehicle being turned off, and performs a software update of the performance controller using the software for update based on the transmission of the software for update in the background being completed.
    Type: Application
    Filed: May 19, 2023
    Publication date: March 7, 2024
    Inventors: Young Jee Yang, Myeong Gyu Jeong, Jin Ah Kim, Hak Jun Kim, Min Gi Kim, Hyeok Sang Jeong, Yoon Sik Jung
  • Publication number: 20240069888
    Abstract: A vehicular software update system includes a management controller coupled to a vehicle and at least one performance controller that receives software for over-the-air (OTA) update in the background from the management controller. The management controller determines a network load of the vehicle and adjusts a transmission speed of the software for OTA update, the software being transmitted to the at least one performance controller, based on a driving state of the vehicle and the network load of the vehicle.
    Type: Application
    Filed: March 7, 2023
    Publication date: February 29, 2024
    Inventors: Yoon Sik Jung, Myeong Gyu Jeong, Jin Ah Kim, Hak Jun Kim, Min Gi Kim, Hyeok Sang Jeong, Young Jee Yang
  • Patent number: 9859150
    Abstract: A method for manufacturing a semiconductor device include forming a dielectric layer over an underlying layer; forming an etch barrier over the dielectric layer, wherein a partial via opening is formed in the etch barrier and exposes a lower portion of the etch barrier; forming an assist-etch barrier over the etch barrier to fill the partial via opening; patterning the assist-etch barrier to form an initial trench opening in the assist-etch barrier, wherein the initial trench opening communicates with the partial via opening; patterning the lower portion of the etch barrier exposed by the partial via opening to form a final via opening in the etch barrier; patterning the dielectric layer exposed by the final via opening to form an initial via hole in the dielectric layer; patterning the etch barrier exposed by the initial trench opening to form a final trench opening in the etch barrier; patterning a lower portion of the dielectric layer exposed by the initial via hole to form a final via hole in the dielectr
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: January 2, 2018
    Assignee: SK Hynix Inc.
    Inventor: Jin-Gi Jung
  • Publication number: 20170178952
    Abstract: A method for manufacturing a semiconductor device include forming a dielectric layer over an underlying layer; forming an etch barrier over the dielectric layer, wherein a partial via opening is formed in the etch barrier and exposes a lower portion of the etch barrier; forming an assist-etch barrier over the etch barrier to fill the partial via opening; patterning the assist-etch barrier to form an initial trench opening in the assist-etch barrier, wherein the initial trench opening communicates with the partial via opening; patterning the lower portion of the etch barrier exposed by the partial via opening to form a final via opening in the etch barrier; patterning the dielectric layer exposed by the final via opening to form an initial via hole in the dielectric layer; patterning the etch barrier exposed by the initial trench opening to form a final trench opening in the etch barrier; patterning a lower portion of the dielectric layer exposed by the initial via hole to form a final via hole in the dielectr
    Type: Application
    Filed: July 11, 2016
    Publication date: June 22, 2017
    Inventor: Jin-Gi JUNG