Patents by Inventor Jin Gyu Park

Jin Gyu Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10092651
    Abstract: Provided is a fast dissolving film composition comprising a medically active component as an active ingredient, in which the bitter taste of the active ingredient is masked and the fast dissolving film composition has a high content of 50% or higher. More particularly, provided is a pharmaceutical composition which comprises sildenafil or pharmaceutically acceptable salts thereof as an active ingredient, and which comprises a combination of a specific bitter taste masking agent to achieve masking of a bitter taste. Further, provided is a fast dissolving film composition which comprises a combination of a specific plasticizer to mask a bitter taste, and in which the physical properties of the high-content film are excellent.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: October 9, 2018
    Assignee: SEOUL PHARMA CO., LTD.
    Inventors: Hyun Jun Jeong, Ik Hyeon Chang, Dal Geun Kim, Jin Hoo Lee, Jin Hee Um, Hyun Soo Kim, Kyung Tae Jung, Kyu Jeong Yeon, Jin Gyu Park
  • Patent number: 9541674
    Abstract: A photonic assembly for observing a preselected color includes an assembly of colloidal particles in a continuous liquid phase, the colloidal particles comprising a core scattering center and a shell layer surrounding the core, wherein the core scattering center is selected to scatter light having a predetermined wavelength, and wherein the shell has a thickness selected to provide an overall colloidal particle size that is about the same dimension as the wavelength of preselected color to be observed.
    Type: Grant
    Filed: May 23, 2014
    Date of Patent: January 10, 2017
    Assignee: President and Fellows of Harvard College
    Inventors: Vinothan Manoharan, Sofia Magkiriadou, Jin-Gyu Park
  • Publication number: 20160184439
    Abstract: The present invention relates to an oral dissolving film formulation containing donepezil and a manufacturing method thereof and, more specifically, an oral dissolving film formulation for treating dementia including donepezil or acid addition salt thereof, cyclodextrin or derivatives thereof, alginic acid or salts thereof and a substrate for forming films, which is manufactured by adding a substrate for forming films to a liquid solution manufactured by firstly adding donepezil or acid addition salt thereof and secondly adding alginic acid or salts thereof to a solution in which cyclodextrin or derivatives thereof is melted, covering bitter taste and paralysis of donepezil.
    Type: Application
    Filed: August 1, 2014
    Publication date: June 30, 2016
    Inventors: Hyun Soo KIM, Won Young JANG, Jin Hee UM, Sang Pil SIM, Kyu Jeong YEON, Jin Gyu PARK
  • Patent number: 9119294
    Abstract: A composite material for electromagnetic interference shielding is provided. The composite material comprises a stack including at least two electrically conductive nanoscale fiber films, which are spaced apart from one another by at least one insulating gap positioned between the at least two nanoscale fiber films. The stack is effective to provide a substantial multiple internal reflection effect. An electromagnetic interference shielded apparatus and a method for shielding an electrical circuit from electromagnetic interference is provided.
    Type: Grant
    Filed: August 26, 2013
    Date of Patent: August 25, 2015
    Assignee: Florida State University Research Foundation
    Inventors: Zhiyong Liang, Ben Wang, Chun Zhang, Jin Gyu Park
  • Publication number: 20150025084
    Abstract: Provided is a fast dissolving film composition comprising a medically active component as an active ingredient, in which the bitter taste of the active ingredient is masked and the fast dissolving film composition has a high content of 50% or higher. More particularly, provided is a pharmaceutical composition which comprises sildenafil or pharmaceutically acceptable salts thereof as an active ingredient, and which comprises a combination of a specific bitter taste masking agent to achieve masking of a bitter taste. Further, provided is a fast dissolving film composition which comprises a combination of a specific plasticizer to mask a bitter taste, and in which the physical properties of the high-content film are excellent.
    Type: Application
    Filed: February 28, 2013
    Publication date: January 22, 2015
    Applicant: SEOUL PHARMA CO., LTD
    Inventors: Hyun Jun Jeong, Ik Hyeon Chang, Dal Geun Kim, Jin Hoo Lee, Jin Hee Um, Hyun Soo Kim, Kyung Tae Jung, Kyu Jeong Yeon, Jin Gyu Park
  • Publication number: 20140254017
    Abstract: A photonic assembly for observing a preselected color includes an assembly of colloidal particles in a continuous liquid phase, the colloidal particles comprising a core scattering center and a shell layer surrounding the core, wherein the core scattering center is selected to scatter light having a predetermined wavelength, and wherein the shell has a thickness selected to provide an overall colloidal particle size that is about the same dimension as the wavelength of preselected color to be observed.
    Type: Application
    Filed: May 23, 2014
    Publication date: September 11, 2014
    Applicant: PRESIDENT AND FELLOWS OF HARVARD COLLEGE
    Inventors: Vinothan MANOHARAN, Sofia MAGKIRIADOU, Jin-Gyu PARK
  • Patent number: 8828543
    Abstract: Disclosed herein are anisotropic conductive particles having superior electrical reliability which are useful as materials for electrical connection structures. Further disclosed is a method for preparing conductive particles comprising polymer resin base particles and a conductive complex metal plating layer formed on the surface of the base particles wherein the conductive complex metal plating layer has a substantially continuous density gradient and can include nickel (Ni) and gold (Au).
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: September 9, 2014
    Assignee: Cheil Industries Inc.
    Inventors: Tae Sub Bae, Jin Gyu Park, Jung Bae Jun, Jae Ho Lee, Jung Il Park, Sang Woon Lee
  • Publication number: 20130341081
    Abstract: A composite material for electromagnetic interference shielding is provided. The composite material comprises a stack including at least two electrically conductive nanoscale fiber films, which are spaced apart from one another by at least one insulating gap positioned between the at least two nanoscale fiber films. The stack is effective to provide a substantial multiple internal reflection effect.
    Type: Application
    Filed: August 26, 2013
    Publication date: December 26, 2013
    Applicant: Florida State University Research Foundation
    Inventors: Zhiyong Liang, Ben Wang, Chun Zhang, Jin Gyu Park
  • Patent number: 8520406
    Abstract: A composite material for electromagnetic interference shielding is provided. The composite material comprises a stack including at least two electrically conductive nanoscale fiber films, which are spaced apart from one another by at least one insulating gap positioned between the at least two nanoscale fiber films. The stack is effective to provide a substantial multiple internal reflection effect. An electromagnetic interference shielded apparatus and a method for shielding an electrical circuit from electromagnetic interference is provided.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: August 27, 2013
    Assignee: Florida State University Research Foundation, Inc.
    Inventors: Zhiyong Liang, Ben Wang, Chun Zhang, Jin Gyu Park
  • Patent number: 8351220
    Abstract: A composite material for electromagnetic interference shielding is provided. The composite material comprises a stack including at least two electrically conductive nanoscale fiber films, which are spaced apart from one another by at least one insulating gap positioned between the at least two nanoscale fiber films. The stack is effective to provide a substantial multiple internal reflection effect. An electromagnetic interference shielded apparatus and a method for shielding an electrical circuit from electromagnetic interference is provided.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: January 8, 2013
    Assignee: Florida State University Research Foundation
    Inventors: Zhiyong Liang, Ben Wang, Chun Zhang, Jin Gyu Park
  • Patent number: 8129023
    Abstract: Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films which can be used in circuit board mounting applications. The conductive particles have a uniform shape, a narrow particle diameter distribution, and appropriate compressive de-formability and recoverability from deformation. In addition, the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Further disclosed are polymer-based particles used in the conductive particles.
    Type: Grant
    Filed: June 15, 2007
    Date of Patent: March 6, 2012
    Assignee: Cheil Industries Inc.
    Inventors: Jung Bae Jun, Jin Gyu Park, Jae Ho Lee, Tae Sub Bae
  • Patent number: 8089151
    Abstract: Embodiments of the present invention include a conductive particle that includes a conductive nickel/gold (Ni/Au) complex metal layer having a phosphorous content of less than about 1.5 weight percent formed on the surface of a polymer resin particle. Methods of forming the same are also included. A conductive particle with a Ni/Au complex metal layer having less than about 1.5 weight percent of phosphorous may have relatively high conductivity while providing relatively good adhesion of the Ni/Au metal layer to the polymer resin particle. Further embodiments of the present invention provide an anisotropic adhesive composition comprising a conductive particle according to an embodiment of the invention.
    Type: Grant
    Filed: August 7, 2006
    Date of Patent: January 3, 2012
    Assignee: Cheil Industries, Inc.
    Inventors: Jung Bae Jun, Jin Gyu Park, Heung Se Lee
  • Patent number: 7897714
    Abstract: One aspect of the invention relates to a method of preparing silicone fine particles which comprises preparing a mixture comprising an organotrialkoxysilane and an organochlorosilane to give a concentration of the organochlorosilane in the mixture of about 100 to about 2,000 ppm; mixing the mixture with water to prepare a sol solution; and maintaining a pH value of the sol solution within a range of about 8 to about 11. Another aspect of the invention relates to a thermoplastic resin composition which employs the silicone fine particles as a diffuser.
    Type: Grant
    Filed: October 25, 2007
    Date of Patent: March 1, 2011
    Assignee: Cheil Industries Inc.
    Inventors: Han Su Lee, Ju Sung Kim, Jin Gyu Park
  • Patent number: 7851063
    Abstract: Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films, which can be used in circuit board mounting applications. The conductive particles can exhibit superior electrical reliability. Further disclosed are polymer particles having good compressive deformability and recoverability from deformation without being ruptured when an adhesive film containing conductive particles including the polymer particles as a component is interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Because the polymer particles have a spherical shape, a uniform particle diameter, and a narrow particle diameter distribution, the particles can exhibit enhanced conducting properties.
    Type: Grant
    Filed: July 26, 2007
    Date of Patent: December 14, 2010
    Assignee: Cheil Industries Inc.
    Inventors: Jung Bae Jun, Jin Gyu Park, Jae Ho Lee, Tae Sub Bae
  • Patent number: 7815999
    Abstract: An insulated conductive particle for an anisotropic conductive film is disclosed. One embodiment of the particle includes a conductive particle and insulating fixative particles discontinuously fixed on the surface of the conductive particle. The insulating particles provides insulation with other adjacent insulated conductive particles, while the insulated conductive particle is electrically connected between electrodes with the insulating fixative particles being deviated from its position. The instant disclosure also provides a method for manufacturing the insulated conductive particle, an anisotropic conductive adhesive film containing the insulated conductive particles, and an electrically connected structure using the film.
    Type: Grant
    Filed: November 10, 2006
    Date of Patent: October 19, 2010
    Assignee: Cheil Industries, Inc.
    Inventors: Jin Gyu Park, Tae Sub Bae, Jung Bae Jun, Jae Ho Lee, Jae Geun Hong
  • Publication number: 20100188833
    Abstract: A composite material for electromagnetic interference shielding is provided. The composite material comprises a stack including at least two electrically conductive nanoscale fiber films, which are spaced apart from one another by at least one insulating gap positioned between the at least two nanoscale fiber films. The stack is effective to provide a substantial multiple internal reflection effect.
    Type: Application
    Filed: January 28, 2010
    Publication date: July 29, 2010
    Applicant: FLORIDA STATE UNIVERSITY RESEARCH FOUNDATION
    Inventors: Zhiyong Liang, Ben Wang, Chun Zhang, Jin Gyu Park
  • Publication number: 20090258308
    Abstract: The present invention provides a toner having a core-shell structure which is formed by aggregation-coalescence of latex particles having bimodal particle size distribution. The toner according to the present invention can prevent scattering and image offset by enhancing adhesiveness and charge-up rate. The toner can also have controlled particle morphology of the particles and a uniform particle size distribution.
    Type: Application
    Filed: June 18, 2009
    Publication date: October 15, 2009
    Applicant: Cheil Industries Inc.
    Inventors: Jong Chull PARK, Mi Sun KIM, Kyung Hyun BAEK, Jin Gyu PARK
  • Patent number: 7566494
    Abstract: Insulated conductive particles, anisotropic adhesive films, and electrical connections using the same are provided. In some embodiments of the present invention, an insulated conductive particle includes a conductive particle with insulating microparticles bound thereto, wherein the insulating microparticles include a hard particle region and a soft functional resin region, and wherein the soft functional resin region includes a functional group capable of binding a metal.
    Type: Grant
    Filed: January 5, 2006
    Date of Patent: July 28, 2009
    Assignee: Cheil Industries, Inc.
    Inventors: Jung Bae Jun, Jin Gyu Park, Jae Ho Lee
  • Publication number: 20080124549
    Abstract: One aspect of the invention relates to a method of preparing silicone fine particles which comprises preparing a mixture comprising an organotrialkoxysilane and an organochlorosilane to give a concentration of the organochlorosilane in the mixture of about 100 to about 2,000 ppm; mixing the mixture with water to prepare a sol solution; and maintaining a pH value of the sol solution within a range of about 8 to about 11. Another aspect of the invention relates to a thermoplastic resin composition which employs the silicone fine particles as a diffuser.
    Type: Application
    Filed: October 25, 2007
    Publication date: May 29, 2008
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Han Su LEE, Ju Sung KIM, Jin Gyu PARK
  • Publication number: 20070145585
    Abstract: Embodiments of the present invention include a conductive particle that includes a conductive nickel/gold (Ni/Au) complex metal layer having a phosphorous content of less than about 1.5 weight percent formed on the surface of a polymer resin particle. Methods of forming the same are also included. A conductive particle with a Ni/Au complex metal layer having less than about 1.5 weight percent of phosphorous may have relatively high conductivity while providing relatively good adhesion of the Ni/Au metal layer to the polymer resin particle. Further embodiments of the present invention provide an anisotropic adhesive composition comprising a conductive particle according to an embodiment of the invention.
    Type: Application
    Filed: August 7, 2006
    Publication date: June 28, 2007
    Inventors: Jung Bae Jun, Jin Gyu Park, Heung Se Lee