Patents by Inventor Jin-Hak Choi
Jin-Hak Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11980649Abstract: The Agastache rugosa and licorice complex mixture of the present invention has the synergy effects for the efficacies of reducing cough through inhibition of TRPV1 activity, reducing lung inflammation through inhibition of CXCR1 and CXCR2 activities and GR-1+CD11b+ cell ratio reduction, and suppressing sputum production through inhibition of MUC5AC activity and therefore it can be widely utilized as a composition for the prevention or treatment of respiratory diseases.Type: GrantFiled: May 21, 2020Date of Patent: May 14, 2024Assignees: Cosmax NBT, Inc., Cosmax NS. Inc.Inventors: Jeong Ho Geum, Hye Rim Kim, Jin Hak Kim, Su Young Choi
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Patent number: 11978926Abstract: A current interrupt structure in which a double rupture structure, which has a rupture groove with a triangular shape and a rupture line with an extending shape of a triangular groove, such that when a swelling phenomenon occurs, stress is concentrated on the rupture line by the rupture groove, which enables accurate and smooth rupture and current flow interruption.Type: GrantFiled: January 5, 2018Date of Patent: May 7, 2024Assignee: LG ENERGY SOLUTION, LTD.Inventors: Jin Hak Kong, Yong Seok Choi, Dong Yeon Kim
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Publication number: 20240136674Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on a winding axis to define a core and an outer circumference. The first electrode includes a first active material portion coated with an active material layer and a first uncoated portion not coated with an active material layer along a winding direction. At least a part of the first uncoated portion is defined as an electrode tab by itself. The first uncoated portion includes a first portion adjacent to the core of the electrode assembly, a second portion adjacent to the outer circumference of the electrode assembly, and a third portion interposed between the first portion and the second portion. The first portion or the second portion has a smaller height than the third portion in the winding axis direction.Type: ApplicationFiled: January 19, 2022Publication date: April 25, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Jong-Sik PARK, Jae-Won LIM, Yu-Sung CHOE, Hak-Kyun KIM, Je-Jun LEE, Byoung-Gu LEE, Duk-Hyun RYU, Kwan-Hee LEE, Jae-Eun LEE, Pil-Kyu PARK, Kwang-Su HWANGBO, Do-Gyun KIM, Geon-Woo MIN, Hae-Jin LIM, Min-Ki JO, Su-Ji CHOI, Bo-Hyun KANG, Jae-Woong KIM, Ji-Min JUNG, Jin-Hak KONG, Soon-O LEE, Kyu-Hyun CHOI
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Publication number: 20240128022Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.Type: ApplicationFiled: December 6, 2023Publication date: April 18, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Woo Kim, Chang Hak Choi, Seok Hyun Yoon, Ki Yong Lee, Jong Myeong Jeon
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Patent number: 11923562Abstract: A battery module includes: a battery cell assembly having a plurality of battery cells; a top plate configured to cover an upper side of the battery cell assembly; a bottom plate configured to cover a lower side of the battery cell assembly; a sensing assembly disposed to cover a front side and a rear side of the battery cell assembly; a pair of side plates disposed at side surfaces, respectively, of the battery cell assembly; and a pair of compression pads disposed between the pair of side plates and the battery cell assembly, respectively.Type: GrantFiled: November 1, 2022Date of Patent: March 5, 2024Assignee: LG Energy Solution, Ltd.Inventors: Sung-Won Seo, Dong Yeon Kim, Ho-June Chi, Dal-Mo Kang, Jin-Hak Kong, Jeong-O Mun, Yoon-Koo Lee, Yong-Seok Choi, Alexander Eichhorn, Andreas Track
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Patent number: 11923523Abstract: A battery module for improving heat balance of a cell assembly provided in the battery module includes a cell assembly having at least three battery cells stacked along a stacking axis such that at least one battery cell located at an interior position within the cell assembly along the stacking axis has a greater thickness along the stacking axis than a battery cell located at an outer side of the cell assembly. A module housing includes at least one sidewall and is configured to accommodate the cell assembly in an inner space defined by the sidewall.Type: GrantFiled: February 19, 2019Date of Patent: March 5, 2024Assignee: LG Energy Solution, Ltd.Inventors: Jee-Soon Choi, Jin-Hak Kong, Yong-Seok Choi
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Publication number: 20240071690Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes, and an external electrode disposed on the body and connected to the internal electrodes. The body includes an active portion including the plurality of internal electrodes to form capacitance, and cover portions disposed on the active portion, and the cover portions include an outer cover portion including a carbon compound and an inner cover portion disposed between the active portion and the outer cover portion. An average carbon content (Cc2) of the outer cover portion compared to an average carbon content (Cc1) of the inner cover portion satisfies 100?Cc2/Cc1?10,000.Type: ApplicationFiled: August 14, 2023Publication date: February 29, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Yeop KIM, Jin Il KANG, Ji Hun LEE, Chang Hak CHOI
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Patent number: 7982138Abstract: Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel plated layer on the first nickel plated layer; and forming a gold plated layer on the second nickel plated layer.Type: GrantFiled: February 11, 2009Date of Patent: July 19, 2011Assignees: Samsung Electro-Mechanics Co., Ltd., Samsung LED Co., Ltd.Inventors: Jin-Hak Choi, Seoung-Jae Lee, Bae-Kyun Kim, Eun-Ju Yang, Jong-Yun Kim, Yeo-Joo Yoon
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Publication number: 20100059257Abstract: Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel plated layer on the first nickel plated layer; and forming a gold plated layer on the second nickel plated layer.Type: ApplicationFiled: February 11, 2009Publication date: March 11, 2010Inventors: Jin-Hak CHOI, Seoung-Jae Lee, Bae-Kyun Kim, Eun-Ju Yang, Jong-Yun Kim, Yeo-Joo Yoon
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Patent number: 7553751Abstract: A method of forming a solder bump may involve forming a first photoresist pattern on a wafer having a pad. The first photoresist pattern may have an opening that exposes a portion of the pad. A first under bump metallurgy (UBM) layer may be formed on the pad, and a second UBM layer may be formed on the first photoresist pattern. A second photoresist pattern may be formed that exposes the first UBM layer. A solder bump may be formed in the opening. The second photoresist pattern and the first photoresist pattern may be removed using a stripper, thereby removing the second UBM layer by a lift-off method.Type: GrantFiled: September 29, 2006Date of Patent: June 30, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Se-Young Jeong, Jin-Hak Choi, Nam-Seog Kim, Kang-Wook Lee
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Publication number: 20070020913Abstract: A method of forming a solder bump may involve forming a first photoresist pattern on a wafer having a pad. The first photoresist pattern may have an opening that exposes a portion of the pad. A first under bump metallurgy (UBM) layer may be formed on the pad, and a second UBM layer may be formed on the first photoresist pattern. A second photoresist pattern may be formed that exposes the first UBM layer and covers the second UBM layer. A solder bump may be formed in the opening. The second photoresist pattern and the first photoresist pattern may be removed using a stripper, thereby removing the second UBM layer by a lift-off method.Type: ApplicationFiled: September 29, 2006Publication date: January 25, 2007Inventors: Se-Young Jeong, Jin-Hak Choi, Nam-Seog Kim, Kang-Wook Lee
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Patent number: 7132358Abstract: A method of forming a solder bump may involve forming a first photoresist pattern on a wafer having a pad. The first photoresist pattern may have an opening that exposes a portion of the pad. A first under bump metallurgy (UBM) layer may be formed on the pad, and a second UBM layer may be formed on the first photoresist pattern. A second photoresist pattern may be formed that exposes the first UBM layer and covers the second UBM layer. A solder bump may be formed in the opening. The second photoresist pattern and the first photoresist pattern may be removed using a stripper, thereby removing the second UBM layer by a lift-off method.Type: GrantFiled: August 20, 2004Date of Patent: November 7, 2006Assignee: Samsung Electronics Co., Ltd.Inventors: Se-Young Jeong, Jin-Hak Choi, Nam-Seog Kim, Kang-Wook Lee
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Publication number: 20060169893Abstract: An X-ray photoelectron spectroscopy includes an X-ray generator generating an X-ray, a collimator collimating the X-ray generated in the X-ray generator, a monochromator for converting the collimated X-ray into a single wavelength X-ray and reflecting the single wavelength X-ray to a test sample, the monochromator being installed to be displaceable and rotatable in response to an irradiating direction of the X-ray, an analysis chamber in which the test sample is disposed, the analysis chamber being installed to be rotatable in response to the displacement of the monochromator so as to allow the single wavelength to be accurately irradiated to the test sample, an energy analyzer for measuring kinetic energy of an electron that is emitted from the test sample by the single wavelength X-ray, and an electron detector for detecting an electron passing to the energy analyzer.Type: ApplicationFiled: October 21, 2005Publication date: August 3, 2006Applicant: Samsung Electronic Co., Ltd.Inventors: Jae-cheol Lee, Chang-bin Lim, Jin-hak Choi
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Publication number: 20050164483Abstract: A method of forming a solder bump may involve forming a first photoresist pattern on a wafer having a pad. The first photoresist pattern may have an opening that exposes a portion of the pad. A first under bump metallurgy (UBM) layer may be formed on the pad, and a second UBM layer may be formed on the first photoresist pattern. A second photoresist pattern may be formed that exposes the first UBM layer and covers the second UBM layer. A solder bump may be formed in the opening. The second photoresist pattern and the first photoresist pattern may be removed using a stripper, thereby removing the second UBM layer by a lift-off method.Type: ApplicationFiled: August 20, 2004Publication date: July 28, 2005Inventors: Se-Young Jeong, Jin-Hak Choi, Nam-Seog Kim, Kang-Wook Lee