Abstract: A chip-onboard assembly for a side-looking optical component is mounted on a mounting surface of a printed circuit board (PCB) and includes a window assembly mounted to the PCB. The window assembly includes a glass window and a window holding bracket. The bracket has a first walled portion, a second walled portion attached to the first walled portion, and a third walled portion opposite the second wall portion. The first walled portion further has a cutaway section configured to accommodate the glass window. An optical encapsulant covers the covering the side-looking optical component. The glass window is attached to the side-looking optical component CoB assembly.

Abstract: A photo-electric smoke detector assembly includes a Y-shaped optic block with a first photo-electronic device mounted on a first end and second and third photo-electronic devices mounted on a second end, with an interaction volume at a midpoint. Two of the photo-electronic devices direct pulses of differing wavelengths toward the interaction volume, and the remaining photo-electronic device receives light from the pulses scattered off of smoke particles in the interaction volume.

Abstract: A surface mountable laser driver circuit package is configured to mount on a host printed circuit board (PCB). A surface mount circuit package includes a lead-frame. A plurality of laser driver circuit components is mounted on and in electrical communication with the lead-frame of the surface mount circuit package. A dielectric layer is located between the lead-frame and the host PCB and includes portals through the dielectric layer each arranged to accommodate an electrical connection between the lead-frame and the host PCB. The lead-frame and the dielectric layer are arranged such that a first lead-frame portion and a first dielectric layer portal align with a first end of a host PCB trace configured to provide a current return path for the surface mount laser driver, and a second lead-frame portion and a second dielectric layer portal align with a second end of the host PCB trace.

Abstract: A method for manufacturing a hermetic side looking laser surface-mount device (SMD) package includes forming a glass cap. An array of pockets is formed in the first glass wafer. The array of pockets is sealed by bonding a second glass wafer to the first glass wafer. The glass cap is released by singulating the sealed array of pockets.

Abstract: A surface mount laser package for a side-looking semiconductor laser has a substantially planar leadframe with a component side and a board attach side. The component side has a conductive die attach pad and a plurality of wire bond pads. A laser die has an anode surface and a cathode surface, where the cathode surface is mounted to the conductive die attach pad. A plurality of bond wires span between the laser die anode surface and a wire bond pad. A molding encases the laser die and the plurality of bond wired on the component side of the leadframe and also lies between the conductive die attach pad and each of the wire bond pads within a plane of the leadframe. The conductive die attach pad has a metallization layer on the leadframe and each of the bond pads has a metallization layer on the leadframe.

Abstract: A surface mountable laser driver circuit package is configured to mount on a host printed circuit board (PCB). A surface mount circuit package includes a lead-frame. A plurality of laser driver circuit components is mounted on and in electrical communication with the lead-frame of the surface mount circuit package. A dielectric layer is located between the lead-frame and the host PCB and includes portals through the dielectric layer each arranged to accommodate an electrical connection between the lead-frame and the host PCB. The lead-frame and the dielectric layer are arranged such that a first lead-frame portion and a first dielectric layer portal align with a first end of a host PCB trace configured to provide a current return path for the surface mount laser driver, and a second lead-frame portion and a second dielectric layer portal align with a second end of the host PCB trace.

Abstract: An apparatus cuts a substrate having first and second portions, each portion having a respectively different level. A first support surface is located at a first level. The first portion of the substrate is supported by the first support surface. A second support surface is located at a second level different from the first level. The second portion of the substrate is supported by the second support surface. The first and second support surfaces are first and second die surfaces, respectively. A punch cuts the substrate between the first support surface and the second support surface. The punch has a V-shaped cross section. A stripper plate has first and second portions. The punch is positioned between the first and second portions of the stripper plate. The first portion of the substrate is clamped between the first portion of the stripper plate and the first die surface. The second portion of the substrate is clamped between the second portion of the stripper plate and the second die surface.