Patents by Inventor Jin Han SHIH

Jin Han SHIH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF MAKING A SEMICONDUCTOR DEVICE PACKAGE
    Publication number: 20220367308
    Abstract: A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.
    Type: Application
    Filed: July 28, 2022
    Publication date: November 17, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tun-Ching PI, Yen-Chi HUANG, Hao-Chih HSIEH, Jin Han SHIH
  • SEMICONDUCTOR DEVICE PACKAGE
    Publication number: 20200083132
    Abstract: A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.
    Type: Application
    Filed: May 10, 2019
    Publication date: March 12, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yen-Chi HUANG, Hao-Chih HSIEH, Jin Han SHIH, Yung I. YEH, Tun-Ching PI