Abstract: An electroluminescent display apparatus includes a plurality of pixels that each include a driving element including a first gate electrode connected to a first gate node, a second gate electrode facing the first gate electrode, a source electrode connected to a source node, and a drain electrode, a light emitting device connected between the source node and an input terminal for a low level driving voltage to emit light during an emission period, and an internal compensation circuit including a first capacitor connected to the first gate node and the source node. The internal compensation circuit samples a threshold voltage of the driving element during a sampling period that precedes the emission period. A sampling reinforcement voltage for increasing a sampling current flowing in the driving element is applied to the second gate electrode of the driving element during the sampling period.

Abstract: Embodiments of the disclosure are related to display devices, a planarization layer disposed on a thin film transistor in a display panel is removed to form an opening in the planarization layer, and a top gate electrode is disposed in the opening of the planarization layer, thus a driving performance of the thin film transistor is enhanced while reducing a size of the thin film transistor disposed in the display panel. Furthermore, the top gate electrode is implemented using an electrode layer located on an upper layer of the planarization layer, the thin film transistor including double gate electrodes is implemented easily without an additional process.

Abstract: Embodiments of the disclosure are related to display devices, a planarization layer disposed on a thin film transistor in a display panel is removed to form an opening in the planarization layer, and a top gate electrode is disposed in the opening of the planarization layer, thus a driving performance of the thin film transistor is enhanced while reducing a size of the thin film transistor disposed in the display panel. Furthermore, the top gate electrode is implemented using an electrode layer located on an upper layer of the planarization layer, the thin film transistor including double gate electrodes is implemented easily without an additional process.

Abstract: In a gate in panel (GIP) type liquid crystal display (LCD) device in which a gate driver is directly mounted within a thin film transistor array substrate, a column spacer structure of a GIP circuit part has the same diamond structure as a gap spacer structure of an active region, and a dummy color filter pattern is formed at the GIP circuit part to have the same step as the active region where the cap spacers are positioned to thus prevent a cell gap deficiency between the GIP circuit part and the active region.

Abstract: The invention provides a fire resistant material and a formulation thereof. The formulation comprises a liquid suspension of a modified inorganic particle and an organic component. The modified inorganic particle comprises an inorganic particle with hydroxyl groups and a surface modifier coupled to the inorganic particle via a urethane linkage, wherein the surface modifier has an ethylenically unsaturated end group. The organic component comprises a monomer, oligomer, prepolymer, polymer, or combinations thereof, capable of reacting with the ethylenically unsaturated end group.

Abstract: A fabrication method which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The method for fabricating a printed circuit board includes: providing an insulating material; forming in the insulating material at least one via-hole for interlayer electrical connection; ion beam treating the surface of the insulating material having the via-hole formed therein; forming a copper seed layer on the surface-treated insulating material using a vacuum deposition process; and plating a copper pattern on the copper seed layer to form a circuit pattern.

Abstract: The invention provides a fire resistant material and a formulation thereof. The formulation comprises a liquid suspension of a modified inorganic particle and an organic component. The modified inorganic particle comprises an inorganic particle with hydroxyl groups and a surface modifier coupled to the inorganic particle via a urethane linkage, wherein the surface modifier has an ethylenically unsaturated end group. The organic component comprises a monomer, oligomer, prepolymer, polymer, or combinations thereof, capable of reacting with the ethylenically unsaturated end group.

Abstract: Through holes for flow paths of the fuel cell are formed in a thermoplastic polymer film by a process selected from a group consisting of laser drilling, etching and lithography, an inner side surface of the thermoplastic polymer film is coated with a metal layer, and the through holes are filled with a fuel diffusion material and a catalyst to provide an anode. The procedure is repeated to provide a cathode. Then, the anode and the cathode are placed to oppose each other. A cation conducting polymer membrane is disposed, between the anode and the cathode, and the anode, the cation conducting polymer membrane and the cathode are hot-pressed.

Abstract: The invention provides a fire resistant material and a formulation thereof. The formulation comprises a liquid suspension of a modified inorganic particle and an organic component. The modified inorganic particle comprises an inorganic particle with hydroxyl groups and a surface modifier coupled to the inorganic particle via a urethane linkage, wherein the surface modifier has an ethylenically unsaturated end group. The organic component comprises a monomer, oligomer, prepolymer, polymer, or combinations thereof, capable of reacting with the ethylenically unsaturated end group.

Abstract: A fabrication method which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The method for fabricating a printed circuit board includes: providing an insulating material; forming in the insulating material at least one via-hole for interlayer electrical connection; ion beam treating the surface of the insulating material having the via-hole formed therein; forming a copper seed layer on the surface-treated insulating material using a vacuum deposition process; and plating a copper pattern on the copper seed layer to form a circuit pattern.

Abstract: Disclosed herein are a printed circuit board and a fabrication method thereof, which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The printed circuit board includes an insulating material; a via-hole formed in a given location of the insulating material; a copper seed layer formed through ion beam surface treatment and vacuum deposition on the surface of the insulating material having the via-hole formed therein; and a copper pattern plating layer formed on a given region of the insulating material, which has the copper seed layer formed thereon, and in the via-hole.

Abstract: In a gate in panel (GIP) type liquid crystal display (LCD) device in which a gate driver is directly mounted within a thin film transistor array substrate, a column spacer structure of a GIP circuit part has the same diamond structure as a gap spacer structure of an active region, and a dummy color filter pattern is formed at the GIP circuit part to have the same step as the active region where the cap spacers are positioned to thus prevent a cell gap deficiency between the GIP circuit part and the active region.

Abstract: Disclosed are modified inorganic particles and methods of preparing the same. The modified inorganic particle comprises an inorganic particle with hydroxyl groups, and a surface modifier coupled to the inorganic particle via a urethane linkage, wherein the surface modifier has an ethylenically unsaturated end group. The method comprises providing an inorganic particle with hydroxyl groups; providing a surface modifier with an isocyanate group at one end and an ethylenically unsaturated group at the other end; and mixing the inorganic particle with the surface modifier for reaction such that the surface modifier is coupled to the inorganic particle.

Abstract: The invention provides a fire resistant material and a formulation thereof. The formulation comprises a liquid suspension of a modified inorganic particle and an organic component. The modified inorganic particle comprises an inorganic particle with hydroxyl groups and a surface modifier coupled to the inorganic particle via a urethane linkage, wherein the surface modifier has an ethylenically unsaturated end group. The organic component comprises a monomer, oligomer, prepolymer, polymer, or combinations thereof, capable of reacting with the ethylenically unsaturated end group.

Abstract: Disclosed are modified inorganic particles and methods of preparing the same. The modified inorganic particle comprises an inorganic particle with hydroxyl groups, and a surface modifier coupled to the inorganic particle via a urethane linkage, wherein the surface modifier has an ethylenically unsaturated end group. The method comprises providing an inorganic particle with hydroxyl groups; providing a surface modifier with an isocyanate group at one end and an ethylenically unsaturated group at the other end; and mixing the inorganic particle with the surface modifier for reaction such that the surface modifier is coupled to the inorganic particle.

Abstract: Disclosed is an optical device for illuminating a chip having a sample provided thereto with a beam in an apparatus for observing the sample. The optical device comprises a light source; and a first reflector reflecting the beam of the light source to allow the reflected beam to be incident on the chip at an inclined angle. In addition, the invention provides an apparatus for observing micro particles having the optical device. When the light of the light source is incident on the sample at an incline angle according to the optical device of the invention, it is possible to maximize a transmittancy of the light. Accordingly, the light emitted from the sample is clearer and a clear image can be thus obtained.

Abstract: A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compress on head cap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil. In another embodiment of the invention, the compression head includes a viscous material reception chamber which has a certain shape which is effective to cause said received viscous material to be selectively dispensed while having a substantially uniform velocity profile and which further provides for the creation of a substantially uniform pressure profile.

Abstract: A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compression head cap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil. The apparatus further includes a selectively expandable diaphragm which selectively and expandably allows the viscous material to be dispensed into the compression head cap.

Abstract: A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compression head cap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil. The apparatus further includes a selectively expandable diaphragm which selectively and expandably allows the viscous material to be dispensed into the compression head cap.

Abstract: A novel apparatus for compressing viscous material through openings in a stencil is disclosed. The novel apparatus has a compression head cap which provides a contained environment to direct and to aid the flow of pressurized viscous material through the openings in the stencil.