Patents by Inventor Jin-ho GU
Jin-ho GU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11607193Abstract: An ultrasonic probe for acquiring an ultrasonic image is provided. The ultrasonic probe includes a transducer generating an ultrasonic signal and including a lens provided to transmit the ultrasonic signal to the outside, a case accommodating the transducer and having an opening at one side so that the lens is brought into contact with an external target object, and a buffer member provided along a circumference of the transducer to protect the transducer from external impact and disposed between the case and the transducer.Type: GrantFiled: January 15, 2019Date of Patent: March 21, 2023Assignee: SAMSUNG MEDISON CO., LTD.Inventors: Jin Ho Gu, Gil Ju Jin, Dong Hyun Kim, Jae Yk Kim
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Patent number: 11502452Abstract: Disclosed herein is a connector cover configured to be used in an ultrasonic probe connector and an ultrasonic probe assembly. The connector cover includes a case, and a coupling device disposed at one end portion in the case and configured to be coupled to the connector. The coupling device includes a body including a fastening portion configured to be coupled to a connector protrusion provided to protrude from the connector toward a first direction, and a rotating shaft connected to the case and the body, and the connector cover is configured to be coupled to the connector along a second direction.Type: GrantFiled: January 19, 2021Date of Patent: November 15, 2022Assignee: SAMSUNG MEDISON CO., LTD.Inventors: Yoonsung Kyung, Jin Ho Gu
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Patent number: 11311272Abstract: Disclosed herein is an ultrasonic probe having improved heat dissipation capability. The ultrasonic probe includes a housing, an acoustic module disposed in the housing, and configured to transmit an ultrasonic signal to an object and receive an signal reflected from the object, an electronic circuit disposed in the housing and electrically connected to the acoustic module to drive the acoustic module, and a hole communicating an outside of the housing with the electronic circuit so that the electronic circuit is cooled by air outside the housing.Type: GrantFiled: January 31, 2019Date of Patent: April 26, 2022Assignee: SAMSUNG MEDISON CO., LTD.Inventors: Jin Ho Gu, Gil-Ju Jin
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Patent number: 11154275Abstract: An ultrasonic probe, a method for controlling the same, and an ultrasonic imaging apparatus including the same are disclosed. The ultrasonic probe includes a housing; a first contact sensing portion located at one position of an outer surface of the housing, and configured to detect contact; and a second contact sensing portion located at a different position from the first contact sensing portion, and configured to detect contact. A combination of contact sensing results obtained from the first contact sensing portion and the second contact sensing portion is determined such that an operation corresponding to the determined combination of the contact sensing results is carried out.Type: GrantFiled: April 4, 2017Date of Patent: October 26, 2021Assignee: SAMSUNG MEDISON CO., LTD.Inventors: Jin Ho Gu, Gil-Ju Jin
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Publication number: 20210234306Abstract: Disclosed herein is a connector cover configured to be used in an ultrasonic probe connector and an ultrasonic probe assembly. The connector cover includes a case, and a coupling device disposed at one end portion in the case and configured to be coupled to the connector. The coupling device includes a body including a fastening portion configured to be coupled to a connector protrusion provided to protrude from the connector toward a first direction, and a rotating shaft connected to the case and the body, and the connector cover is configured to be coupled to the connector along a second direction.Type: ApplicationFiled: January 19, 2021Publication date: July 29, 2021Inventors: Yoonsung Kyung, Jin Ho Gu
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Patent number: 10932755Abstract: Disclosed herein is a multi-row ultrasonic probe of which a manufacturing failure rate can be decreased. The ultrasonic probe includes a piezoelectric layer configured to generate ultrasonic waves, a sound layer provided on a rear side of the piezoelectric layer, a flexible printed circuit board provided on a rear side of the sound layer, and a sound absorption layer configured to absorb the ultrasonic waves generated by the piezoelectric layer and propagating toward a rear surface of the ultrasonic probe, the sound absorption layer being provided on a rear surface of the flexible printed circuit board. The piezoelectric layer includes a kerf configured to divide the piezoelectric layer in a direction of elevation. The sound layer includes a funnel extending in a direction extending from a front side of the sound layer to the rear side of the sound layer to divide the sound layer.Type: GrantFiled: January 11, 2018Date of Patent: March 2, 2021Assignee: SAMSUNG MEDISON CO., LTD.Inventors: Jin Ho Gu, Sung Do Kwon, Seong Jin Kim, Joong Hyun Park
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Patent number: 10568606Abstract: An ultrasonic probe includes a connection layer including a conductor array for connecting a transducer array and a printed circuit board (PCB) to an application specific integrated circuit (ASIC). The ultrasonic probe includes a transducer array which transmits and receives an ultrasonic wave, a first electronic circuit electrically connected to the transducer array, a second electronic circuit electrically connected to the first electronic circuit, and a connection layer disposed between the transducer array and the first electronic circuit and including a first conductor array in contact with the transducer array so that the transducer array is electrically connected to the first electronic circuit and a second conductor array in contact with the second electronic circuit so that the second electronic circuit is electrically connected to the first electronic circuit.Type: GrantFiled: December 1, 2015Date of Patent: February 25, 2020Assignee: Samsung Medison Co., Ltd.Inventors: Jin Ho Gu, Jae-Yk Kim, Jong Mok Lee, Young Mun Cho
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Publication number: 20190393405Abstract: Disclosed are an ultrasonic probe for obtaining an ultrasonic image and a manufacturing method thereof. The ultrasonic probe includes a transducer layer including a piezoelectric layer configured to generate ultrasonic waves and an acoustic layer disposed below the piezoelectric layer, and a matching layer disposed above the piezoelectric layer, wherein the transducer layer includes an active portion configured to transmit and receive ultrasonic waves, and a stepped portion extending outward from the active portion to prevent cutting damage of the active portion.Type: ApplicationFiled: June 19, 2019Publication date: December 26, 2019Inventors: Seung Hyun KIM, Jin Ho GU, Ji Su KIM
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Publication number: 20190231309Abstract: Disclosed herein is an ultrasonic probe having improved heat dissipation capability. The ultrasonic probe includes a housing, an acoustic module disposed in the housing, and configured to transmit an ultrasonic signal to an object and receive an signal reflected from the object, an electronic circuit disposed in the housing and electrically connected to the acoustic module to drive the acoustic module, and a hole communicating an outside of the housing with the electronic circuit so that the electronic circuit is cooled by air outside the housing.Type: ApplicationFiled: January 31, 2019Publication date: August 1, 2019Inventors: Jin Ho Gu, Gil-Ju Jin
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Publication number: 20190216428Abstract: An ultrasonic probe for acquiring an ultrasonic image is provided. The ultrasonic probe includes a transducer generating an ultrasonic signal and including a lens provided to transmit the ultrasonic signal to the outside, a case accommodating the transducer and having an opening at one side so that the lens is brought into contact with an external target object, and a buffer member provided along a circumference of the transducer to protect the transducer from external impact and disposed between the case and the transducer.Type: ApplicationFiled: January 15, 2019Publication date: July 18, 2019Inventors: Jin Ho GU, Gil Ju JIN, Dong hyun KIM, Jae Yk KIM
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Patent number: 10074798Abstract: Provided is a method of manufacturing an ultrasonic probe. The method includes forming a sacrificial layer on a substrate; forming a plurality of openings in the sacrificial layer that are separated from one another; forming piezoelectric units by growing a piezoelectric element in each of the plurality of openings; and removing the sacrificial layer.Type: GrantFiled: December 4, 2014Date of Patent: September 11, 2018Assignee: SAMSUNG MEDISON CO., LTD.Inventors: Won-Hee Lee, Jin-Ho Gu, Jae-Yk Kim
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Publication number: 20180235575Abstract: Disclosed herein is a multi-row ultrasonic probe of which a manufacturing failure rate can be decreased. The ultrasonic probe includes a piezoelectric layer configured to generate ultrasonic waves, a sound layer provided on a rear side of the piezoelectric layer, a flexible printed circuit board provided on a rear side of the sound layer, and a sound absorption layer configured to absorb the ultrasonic waves generated by the piezoelectric layer and propagating toward a rear surface of the ultrasonic probe, the sound absorption layer being provided on a rear surface of the flexible printed circuit board. The piezoelectric layer includes a kerf configured to divide the piezoelectric layer in a direction of elevation. The sound layer includes a funnel extending in a direction extending from a front side of the sound layer to the rear side of the sound layer to divide the sound layer.Type: ApplicationFiled: January 11, 2018Publication date: August 23, 2018Inventors: Jin Ho GU, Sung Do KWON, Seong Jin KIM, Joong Hyun PARK
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Publication number: 20180064416Abstract: An ultrasonic probe, a method for controlling the same, and an ultrasonic imaging apparatus including the same are disclosed. The ultrasonic probe includes a housing; a first contact sensing portion located at one position of an outer surface of the housing, and configured to detect contact; and a second contact sensing portion located at a different position from the first contact sensing portion, and configured to detect contact. A combination of contact sensing results obtained from the first contact sensing portion and the second contact sensing portion is determined such that an operation corresponding to the determined combination of the contact sensing results is carried out.Type: ApplicationFiled: April 4, 2017Publication date: March 8, 2018Inventors: Jin Ho GU, Gil-Ju JIN
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Patent number: 9746448Abstract: An ultrasonic probe apparatus and an ultrasonic imaging apparatus are disclosed. The ultrasonic probe apparatus includes: an ultrasonic transducer configured to output an electrical signal upon receiving ultrasonic waves; a sound absorption unit, one surface of which is an installation surface of the ultrasonic transducer and is electrically connected to the ultrasonic transducer; a first electronic circuit electrically connected to the sound absorption unit; and a substrate connection unit disposed between the sound absorption unit and the first electronic circuit, configured to electrically interconnect the first electronic circuit and the sound absorption unit. The ultrasonic imaging apparatus includes the above ultrasonic probe and a main body.Type: GrantFiled: April 10, 2015Date of Patent: August 29, 2017Assignee: SAMSUNG MEDISON CO., LTD.Inventor: Jin Ho Gu
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Patent number: 9668715Abstract: Provided are an acoustic probe and a method of manufacturing the acoustic probe including a chip module substrate, a piezoelectric unit for cross-converting ultrasound and an electric signal while the piezoelectric unit is vibrating, and a connection unit for supporting the piezoelectric unit and electrically connecting the piezoelectric unit and the chip module substrate.Type: GrantFiled: January 13, 2014Date of Patent: June 6, 2017Assignee: SAMSUNG MEDISON CO., LTD.Inventors: Jin-ho Gu, Jae-yk Kim, Gil-ju Jin
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Patent number: 9642597Abstract: Disclosed are an ultrasonic diagnostic instrument and a manufacturing method thereof. The ultrasonic diagnostic instrument includes a matching layer, at least one transducer provided at a lower surface of the matching layer to generate ultrasonic waves, a first acoustic absorption layer provided at a lower surface of the transducer to transmit an ultrasonic wave generation signal to the transducer, a controller provided at a lower surface of the first acoustic absorption layer to control operation of the transducer, the controller having a recess formed in a lower surface thereof, and a second acoustic absorption layer provided at a lower surface of the controller and having an insert formed at an upper surface thereof, the insert corresponding to the recess of the controller.Type: GrantFiled: November 10, 2014Date of Patent: May 9, 2017Assignee: SAMSUNG MEDISON CO., LTD.Inventors: Jin Ho Gu, Won Hee Lee, Jae-Yk Kim
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Publication number: 20160187301Abstract: An ultrasonic probe apparatus and an ultrasonic imaging apparatus are disclosed. The ultrasonic probe apparatus includes: an ultrasonic transducer configured to output an electrical signal upon receiving ultrasonic waves; a sound absorption unit, one surface of which is an installation surface of the ultrasonic transducer and is electrically connected to the ultrasonic transducer; a first electronic circuit electrically connected to the sound absorption unit; and a substrate connection unit disposed between the sound absorption unit and the first electronic circuit, configured to electrically interconnect the first electronic circuit and the sound absorption unit. The ultrasonic imaging apparatus includes the above ultrasonic probe and a main body.Type: ApplicationFiled: April 10, 2015Publication date: June 30, 2016Inventor: Jin Ho GU
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Publication number: 20160151043Abstract: An ultrasonic probe includes a connection layer including a conductor array for connecting a transducer array and a printed circuit board (PCB) to an application specific integrated circuit (ASIC). The ultrasonic probe includes a transducer array which transmits and receives an ultrasonic wave, a first electronic circuit electrically connected to the transducer array, a second electronic circuit electrically connected to the first electronic circuit, and a connection layer disposed between the transducer array and the first electronic circuit and including a first conductor array in contact with the transducer array so that the transducer array is electrically connected to the first electronic circuit and a second conductor array in contact with the second electronic circuit so that the second electronic circuit is electrically connected to the first electronic circuit.Type: ApplicationFiled: December 1, 2015Publication date: June 2, 2016Inventors: Jin Ho GU, Jae-Yk KIM, Jong Mok LEE, Young Mun CHO
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Publication number: 20150157292Abstract: Disclosed are an ultrasonic diagnostic instrument and a manufacturing method thereof. The ultrasonic diagnostic instrument includes a matching layer, at least one transducer provided at a lower surface of the matching layer to generate ultrasonic waves, a first acoustic absorption layer provided at a lower surface of the transducer to transmit an ultrasonic wave generation signal to the transducer, a controller provided at a lower surface of the first acoustic absorption layer to control operation of the transducer, the controller having a recess formed in a lower surface thereof, and a second acoustic absorption layer provided at a lower surface of the controller and having an insert formed at an upper surface thereof, the insert corresponding to the recess of the controller.Type: ApplicationFiled: November 10, 2014Publication date: June 11, 2015Inventors: Jin Ho GU, Won Hee LEE, Jae-Yk KIM
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Patent number: RE48587Abstract: An ultrasonic probe apparatus and an ultrasonic imaging apparatus are disclosed. The ultrasonic probe apparatus includes: an ultrasonic transducer configured to output an electrical signal upon receiving ultrasonic waves; a sound absorption unit, one surface of which is an installation surface of the ultrasonic transducer and is electrically connected to the ultrasonic transducer; a first electronic circuit electrically connected to the sound absorption unit; and a substrate connection unit disposed between the sound absorption unit and the first electronic circuit, configured to electrically interconnect the first electronic circuit and the sound absorption unit. The ultrasonic imaging apparatus includes the above ultrasonic probe and a main body.Type: GrantFiled: August 1, 2019Date of Patent: June 8, 2021Assignee: SAMSUNG MEDISON CO., LTD.Inventor: Jin Ho Gu