Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. In video encoding and decoding, multiple partition blocks are generated by splitting a target block. A prediction mode is derived for at least a part of the multiple partition blocks, among the multiple partition blocks, and prediction is performed on the multiple partition blocks based on the derived prediction mode. When prediction is performed on the partition blocks, information related to the target block may be used, and information related to an additional partition block, which is predicted prior to the partition block, may be used.

Abstract: A positive electrode active material including a first lithium composite oxide particle including a secondary particle formed by aggregation of one or more primary particles, and a coating oxide occupying at least a part of at least one of surfaces of the secondary particle, grain boundaries between the primary particles, or surfaces of the primary particles, the positive electrode active material satisfying an equation of 1.3?a/b?3.0, wherein a represents a max peak intensity at 2theta=44.75° to 44.80° and b represents a max peak intensity at 2theta=45.3° to 45.6° in X-ray diffraction (XRD) analysis using Cu K? radiation.

Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. In video encoding and decoding, multiple partition blocks are generated by splitting a target block. A prediction mode is derived for at least a part of the multiple partition blocks, among the multiple partition blocks, and prediction is performed on the multiple partition blocks based on the derived prediction mode. When prediction is performed on the partition blocks, information related to the target block may be used, and information related to an additional partition block, which is predicted prior to the partition block, may be used.

Abstract: A wearable device according to an embodiment comprises: a substrate; a light-emitting unit disposed on the substrate; a light-receiving unit disposed on the substrate and spaced apart at a predetermined distance from the light-emitting unit; and a first reflection part disposed on the substrate adjacent to the light-emitting unit so as to reflect light emitted from the light-emitting unit.

Abstract: An apparatus for measuring a bio-signal includes: a light source emitting a predetermined amount of light into a human body; a light receiving unit receiving at least some of the predetermined amount of light; and a cover, which is touchable by the human body, protecting the light source and the light receiving unit. The light source and the cover are arranged such that the light source and the cover are separated by a first gap, the light receiving unit and the cover are arranged such that the light receiving unit and the cover are separated by a second gap, and the first gap is less than the second gap.

Abstract: An antenna system using a motion sensor includes an antenna having a plurality of axes within a smart device, whereby motion sensor sensing axis information is generated by movement or rotation of the plurality of axes of the antenna, and a controller for controlling the information sensed by the motion sensor and a strength of a signal of the antenna having the plurality of axes received in real time.

Abstract: A wearable device according to an embodiment comprises: a substrate; a light-emitting unit disposed on the substrate; a light-receiving unit disposed on the substrate and spaced apart at a predetermined distance from the light-emitting unit; and a first reflection part disposed on the substrate adjacent to the light-emitting unit so as to reflect light emitted from the light-emitting unit.

Abstract: The present invention comprises: a supporting substrate; a rear electrode layer disposed on the supporting substrate; a light absorption layer disposed on the rear electrode layer; a front electrode layer disposed on the light absorption layer; and a first penetrating groove penetrating the rear electrode layer and the light absorption layer, wherein the rear electrode layer and the light absorption layer are arranged so as to be stepped.

Abstract: An antenna system using a motion sensor includes an antenna having a plurality of axes within a smart device, whereby motion sensor sensing axis information is generated by movement or rotation of the plurality of axes of the antenna, and a controller for controlling the information sensed by the motion sensor and a strength of a signal of the antenna having the plurality of axes received in real time.

Abstract: An apparatus for measuring a bio-signal includes: a light source emitting a predetermined amount of light into a human body; a light receiving unit receiving at least some of the predetermined amount of light; and a cover, which is touchable by the human body, protecting the light source and the light receiving unit. The light source and the cover are arranged such that the light source and the cover are separated by a first gap, the light receiving unit and the cover are arranged such that the light receiving unit and the cover are separated by a second gap, and the first gap is less than the second gap.

Abstract: The present invention comprises: a supporting substrate; a rear electrode layer disposed on the supporting substrate; a light absorption layer disposed on the rear electrode layer; a front electrode layer disposed on the light absorption layer; and a first penetrating groove penetrating the rear electrode layer and the light absorption layer, wherein the rear electrode layer and the light absorption layer are arranged so as to be stepped.

Abstract: A semiconductor package includes a substrate having a substrate body possessing a first region, a second region which is defined around the first region and a third region which is defined around the second region. Wiring lines are placed on the substrate body, and the wiring lines have first ends that extend to the third region. Connection patterns are placed in the third region and are electrically connected to the first ends of the wiring lines. A to semiconductor chip is disposed in the first region and is electrically connected to the respective wiring lines, and a molding member is disposed in the first and second regions and covers the semiconductor chip.

Abstract: A solar cell and a method of fabricating the same are provided. The solar cell includes a substrate, a back electrode layer on the substrate, a light absorbing layer on the back electrode layer, and a buffer layer on the light absorbing layer. The back electrode layer, the light absorbing layer, and the buffer layer are formed therein with a first through hole formed through the back electrode layer, the light absorbing layer, and the buffer layer, and an insulating member is deposited in the first through hole.

Abstract: A solar cell includes a substrate; a back electrode layer on the substrate; a light absorbing layer on the back electrode layer; and a buffer layer on the light absorbing layer. A first through hole is formed through the back electrode layer, a second through hole is formed through the buffer layer and the light absorbing layer, and the first through hole is overlapped with the second through hole.

Abstract: A semiconductor package includes a substrate having a substrate body possessing a first region, a second region which is defined around the first region and a third region which is defined around the second region. Wiring lines are placed on the substrate body, and the wiring lines have first ends that extend to the third region. Connection patterns are placed in the third region and are electrically connected to the first ends of the wiring lines. A to semiconductor chip is disposed in the first region and is electrically connected to the respective wiring lines, and a molding member is disposed in the first and second regions and covers the semiconductor chip.

Abstract: A semiconductor package includes a substrate having a substrate body possessing a first region, a second region which is defined around the first region and a third region which is defined around the second region. Wiring lines are placed on the substrate body, and the wiring lines have first ends that extend to the third region. Connection patterns are placed in the third region and are electrically connected to the first ends of the wiring lines. A semiconductor chip is disposed in the first region and is electrically connected to the respective wiring lines, and a molding member is disposed in the first and second regions and covers the semiconductor chip.

Abstract: A semiconductor package includes a substrate having a substrate body possessing a first region, a second region which is defined around the first region and a third region which is defined around the second region. Wiring lines are placed on the substrate body, and the wiring lines have first ends that extend to the third region. Connection patterns are placed in the third region and are electrically connected to the first ends of the wiring lines. A semiconductor chip is disposed in the first region and is electrically connected to the respective wiring lines, and a molding member is disposed in the first and second regions and covers the semiconductor chip.

Abstract: A substrate for a semiconductor package having a reinforcing member that prevents or minimizes distortions is presented. The substrate for the semiconductor package includes a substrate body, an insulation layer, and a reinforcing member. The substrate body has a first region having a plurality of chip mount regions, a second region disposed along a periphery of the first region, a circuit pattern disposed in each chip mount region and a dummy pattern disposed along the second region. The insulation layer covers the first and second regions and has an opening exposing some portion of each circuit pattern. The reinforcing member is disposed in the second region and prevents deflection of the substrate body.

Abstract: A substrate for a semiconductor package having a reinforcing member that prevents or minimizes distortions is presented. The substrate for the semiconductor package includes a substrate body, an insulation layer, and a reinforcing member. The substrate body has a first region having a plurality of chip mount regions, a second region disposed along a periphery of the first region, a circuit pattern disposed in each chip mount region and a dummy pattern disposed along the second region. The insulation layer covers the first and second regions and has an opening exposing some portion of each circuit pattern. The reinforcing member is disposed in the second region and prevents deflection of the substrate body.

Abstract: A semiconductor package includes a substrate having a substrate body possessing a first region, a second region which is defined around the first region and a third region which is defined around the second region. Wiring lines are placed on the substrate body, and the wiring lines have first ends that extend to the third region. Connection patterns are placed in the third region and are electrically connected to the first ends of the wiring lines. A semiconductor chip is disposed in the first region and is electrically connected to the respective wiring lines, and a molding member is disposed in the first and second regions and covers the semiconductor chip.