Patents by Inventor Jin-Ho Nam

Jin-Ho Nam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11931978
    Abstract: An anti-icing honeycomb core composite manufactured by forming an electromagnetic wave absorption layer by using dielectric fiber, molding the electromagnetic wave absorption layer into a honeycomb core structure by using a molded part including a first base, a second base, and an inner block, hardening the honeycomb core structure, and removing the molded part. The molding step includes first stacking, on the first base including a plurality of grooves in which the inner blocks each having a hexagonal column shape are able to be seated, a plurality of the inner blocks and a plurality of the electromagnetic wave absorption layers as the honeycomb core structure so that the electromagnetic wave absorption layer is disposed between the plurality of inner blocks, and second stacking covering the inner blocks and the electromagnetic wave absorption layers stacked on the first base with the second base having the same shape as the first base.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: March 19, 2024
    Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION GYEONGSANG NATIONAL UNIVERSITY
    Inventors: Young Woo Nam, Hyeon Seok Choe, Jin Hwe Kweon, Rho Shin Myong, Won Ho Choi
  • Publication number: 20240076224
    Abstract: A molding method for a cover window includes: locally heating a peripheral portion of a glass substrate around a central portion of the glass substrate to a temperature of about 610° C. to about 670° C., forming a cover window by pressing the glass substrate, and annealing and cooling the cover window. Accordingly, a cover window in which each of edges has an outwardly convex curved surface through a glass substrate may be formed. In addition, the surface roughness of a cover window formed through a glass substrate may be improved.
    Type: Application
    Filed: August 25, 2023
    Publication date: March 7, 2024
    Inventors: HYUNSEUNG SEO, Young Ki PARK, Jong Soo BAEK, JIHYUN KO, SEUNGHO KIM, Jin Su NAM, Oh Joo PARK, JUN HO LEE
  • Publication number: 20230377768
    Abstract: Provided is an ultra-high-voltage direct-current (DC) power cable. Specifically, the present invention relates to an ultra-high-voltage DC power cable capable of simultaneously preventing or minimizing electric field distortion, a decrease in DC dielectric strength, and a decrease in impulse breakdown strength due to accumulation of space charge in an insulator.
    Type: Application
    Filed: December 4, 2017
    Publication date: November 23, 2023
    Inventors: Hyun Jung JUNG, Jin Ho NAM, Jung Suk YOO, Yi Seul YANG, Min Sang CHO, Sung Ik HEO
  • Publication number: 20210118593
    Abstract: Provided is a direct-current (DC) power cable. Specifically, the present invention relates to a DC power cable capable of preventing both a decrease in DC dielectric strength and a decrease in impulse breakdown strength due to space charge accumulation, and reducing manufacturing costs without lowering the extrudability of an insulating layer and the like.
    Type: Application
    Filed: December 7, 2017
    Publication date: April 22, 2021
    Inventors: Young Eun CHO, Jin Ho NAM, Gi Joon NAM
  • Publication number: 20200185122
    Abstract: Disclosed are an insulation composition that is capable of simultaneously preventing reductions in volume resistance, direct-current dielectric strength, and dielectric breakdown strength due to accumulation of space charges and in which the extent of extrusion of an insulating layer is not reduced, and a direct-current power cable having an insulating layer formed from the same.
    Type: Application
    Filed: February 22, 2019
    Publication date: June 11, 2020
    Inventors: Yi Seul YANG, Jin Ho NAM, Jung Suk YOO, Hyun Jung JUNG, Sung IK HEO
  • Publication number: 20200185123
    Abstract: Disclosed is an ultra-high-voltage direct-current power cable that is capable of simultaneously preventing or minimizing field enhancement and reductions in high-temperature volume resistance and direct-current dielectric strength due to accumulation of space charges in an insulator.
    Type: Application
    Filed: February 22, 2019
    Publication date: June 11, 2020
    Inventors: Hyun Jung JUNG, Jin Ho NAM, Jung Suk YOO, Yi Seul YANG, Sung IK HEO
  • Publication number: 20200143960
    Abstract: Provided is a direct-current (DC) power cable. Specifically, the present invention relates to a DC power cable capable of preventing both a decrease in DC dielectric strength and a decrease in impulse breakdown strength due to space charge accumulation, and reducing manufacturing costs without lowering the extrudability of an insulating layer and the like.
    Type: Application
    Filed: December 7, 2017
    Publication date: May 7, 2020
    Inventors: Hyun Jung JUNG, Jin Ho NAM, Gi Joon NAM, Young Eun CHO
  • Patent number: 10438716
    Abstract: Provided is an insulation composition having a low dielectric constant and a cable including an insulation layer formed of the insulation composition. More particularly, the present invention relates to an insulation composition for reducing a space charge to increase superimposed impulse breakdown strength when impulse voltages overlap during application of a direct-current (DC) voltage, having a low dielectric constant, and improving impulse breakdown strength, and a cable including an insulation layer formed of the insulation composition.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: October 8, 2019
    Assignee: LS CABLE & SYSTEM LTD.
    Inventors: Jin Ho Nam, Won Suck Lee, Ik Hyun Ryu, Yi Seul Yang, Hyun Jung Jung, Tae Hyun Lee
  • Publication number: 20190080816
    Abstract: Provided is an insulation composition having a low dielectric constant and a cable including an insulation layer formed of the insulation composition. More particularly, the present invention relates to an insulation composition for reducing a space charge to increase superimposed impulse breakdown strength when impulse voltages overlap during application of a direct-current(DC) voltage, having a low dielectric constant, and improving impulse breakdown strength, and a cable including an insulation layer formed of the insulation composition.
    Type: Application
    Filed: February 27, 2017
    Publication date: March 14, 2019
    Inventors: Jin Ho NAM, Won Suck LEE, Ik Hyun RYU, Yi Seul YANG, Hyun Jung JUNG, Tae Hyun LEE
  • Patent number: 9183969
    Abstract: The present invention relates to an insulation composition for a DC power cable and the DC power cable prepared using the same. Specifically, the present invention relates to an improved insulation composition for a DC power cable, which can prevent decrease of DC dielectric strength and decrease of impulse strength caused by accumulation of space charges, and the DC power cable prepared using the same.
    Type: Grant
    Filed: April 18, 2013
    Date of Patent: November 10, 2015
    Assignee: LS CABLE & SYSTEM LTD.
    Inventors: Yoon Jin Kim, Jin Ho Nam, Young Ho Park, Son Tung Ha
  • Patent number: 9076566
    Abstract: Provided is a DC power cable including a conductor, an inner semiconductive layer, an insulation and an outer semiconductive layer. In particular, the inner semiconductive layer or the outer semiconductive layer may be formed from a semiconductive composition containing a polypropylene base resin or a low-density polyethylene base resin and carbon nano tubes; and the insulation may be formed from an insulation composition containing a polypropylene base resin or a low-density polyethylene base resin and inorganic nano particles. The resulting power cable may have improved properties such as volume resistivity, hot set, and so on, and excellent space charge reducing effect.
    Type: Grant
    Filed: September 21, 2010
    Date of Patent: July 7, 2015
    Assignee: LS Cable Ltd.
    Inventors: Yoon-Jin Kim, Jin-Ho Nam, Ho-Souk Cho, Young-Ho Park, Son Tung Ha
  • Publication number: 20140076609
    Abstract: The present invention relates to an insulation composition for a DC power cable and the DC power cable prepared using the same. Specifically, the present invention relates to an improved insulation composition for a DC power cable, which can prevent decrease of DC dielectric strength and decrease of impulse strength caused by accumulation of space charges, and the DC power cable prepared using the same.
    Type: Application
    Filed: April 18, 2013
    Publication date: March 20, 2014
    Applicant: LS Cable & System Ltd.
    Inventors: Yoon Jin KIM, Jin Ho NAM, Young Ho PARK, Son Tung HA
  • Patent number: 8648257
    Abstract: An insulation material composition for a direct current (DC) power cable and the DC power cable using the same are provided. A direct current (DC) power cable insulation material composition includes 0.5 to 5 parts by weight of surface-modified nano-sized cubic magnesium oxide, per 100 parts by weight of a polyethylene base resin.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: February 11, 2014
    Assignee: LS Cable & System Ltd.
    Inventors: Yoon-Jin Kim, Chang-Mo Ko, Jin-Ho Nam, Ho-Souk Cho, Young-Ho Park
  • Publication number: 20120012362
    Abstract: Provided is a DC power cable including a conductor, an inner semiconductive layer, an insulation and an outer semiconductive layer. In particular, the inner semiconductive layer or the outer semiconductive layer may be formed from a semiconductive composition containing a polypropylene base resin or a low-density polyethylene base resin and carbon nano tubes; and the insulation may be formed from an insulation composition containing a polypropylene base resin or a low-density polyethylene base resin and inorganic nano particles. The resulting power cable may have improved properties such as volume resistivity, hot set, and so on, and excellent space charge reducing effect.
    Type: Application
    Filed: September 21, 2010
    Publication date: January 19, 2012
    Applicant: LS Cable Ltd.
    Inventors: Yoon-Jin KIM, Jin-Ho Nam, Ho-Souk Cho, Young-Ho Park, Son Tung Ha
  • Publication number: 20120000694
    Abstract: An insulation material composition for a direct current (DC) power cable and the DC power cable using the same are provided. A direct current (DC) power cable insulation material composition includes 0.5 to 5 parts by weight of surface-modified nano-sized cubic magnesium oxide, per 100 parts by weight of a polyethylene base resin.
    Type: Application
    Filed: September 9, 2011
    Publication date: January 5, 2012
    Applicant: LS CABLE & SYSTEM LTD.
    Inventors: Yoon-Jin Kim, Chang-Mo Ko, Jin-Ho Nam, Ho-Souk Cho, Young-Ho Park
  • Publication number: 20110214899
    Abstract: Disclosed is an insulation resin composition resistant to thermal deformation comprising an ethylene copolymer base resin having crystallinity between 1% and 30%, not including 30%; and 0.5 to 20 parts by weight of an organic peroxide-based crosslinking agent per 100 parts by weight of the base resin, and a cable using the same. The insulation is resistant to thermal deformation that may occur after a crosslinking process under high temperature and high pressure subsequently to extrusion of a sheath.
    Type: Application
    Filed: September 2, 2010
    Publication date: September 8, 2011
    Applicant: LS Cable Ltd.
    Inventors: Min-Su JUNG, Jin-Ho Nam, Ung Kim
  • Publication number: 20100307788
    Abstract: The present invention relates to a peelable and water-crosslinked semiconductive resin composition. The peelable and water-crosslinked semiconductive resin composition includes 100 parts by weight of a basic resin; 20 to 80 parts by weight of carbon black based on weight of the basic resin; and 0.05 to 5.0 parts by weight of an amide-based lubricant based on weight of the basic resin, wherein the basic resin is a mixed resin including 60 to 80 weight % of an ethylene-based copolymer resin that is bonded with an unsaturated organic silane and has a melting point of 80° C. or above; 5 to 20 weight % of an ethylene-acrylic acid copolymer or its alkali metal salt; and 5 to 40 parts by weight of an ethylene propylene copolymer containing 5 to 20 weight % of ethylene, or a propylene rein.
    Type: Application
    Filed: June 26, 2008
    Publication date: December 9, 2010
    Inventors: Ung Kim, Hwa-Joon Lim, Yong-Sun Lee, Jin-Ho Nam
  • Publication number: 20080283273
    Abstract: The present invention relates to a semiconductive composition and a power cable using the same. The semiconductive composition according to the present invention constituting a semi-conductive layer of a power cable includes 100 parts by weight of a base resin composed of an ethylene-based copolymer resin; 45 to 70 parts by weight of a carbon black; and 0.2 to 5.0 parts by weight of a nonionic surfactant. The semiconductive composition according to the present invention has an improved interfacial smoothness in the semiconductive layer and the insulation layer of the power cable and an increased dielectric breakdown strength of the insulation layer. Also, the semiconductive composition according to the present invention may be useful to ensure an easy cleaning property of a mold upon extruding/molding a power cable.
    Type: Application
    Filed: February 6, 2006
    Publication date: November 20, 2008
    Inventors: Jin-Ho Nam, Dae-Hee Cho
  • Publication number: 20080182923
    Abstract: The present invention relates to a composition for manufacturing insulation materials of an electrical wire and an electrical wire manufactured using the same. The composition for manufacturing insulation materials of an electrical wire according to the present invention includes 100 parts by weight of a base resin, made by blending 20 to 70 weight % of any one resin of an unsaturated organosilane grafted polyethylene and an unsaturated organosilane grafted ethylene alpha olefine copolymer, and 30 to 80 weight % of an unsaturated organosilane grafted ethylene copolymer; 10 to 25 parts by weight of a brominated flame retardant; 10 to 50 parts by weight of an inorganic flame retardant; and 0.2 to 5 parts by weight of compound, as a crosslink retardant, represented as a general formula of XnSi(OR)4-n (X is a phenyl group, R is a methyl group and n is an integer of 1 to 3).
    Type: Application
    Filed: November 8, 2007
    Publication date: July 31, 2008
    Inventors: Do-Hyun Park, Jin-Ho Nam, Ung Kim, Yong-Sun Lee
  • Publication number: 20080161466
    Abstract: Disclosed is a composition for producing a halogen-free flame-retardant insulating material using nano-technology. The present invention provides a composition for producing a halogen-free flame-retardant insulating material using nano-technology, including metal hydroxide treated with nanoboric acid; nano clay which is a compatibility enhancer of a base resin; a metal compound which is a flame-retardant formulation; and an antioxidant, based on the total weight of the polyolefin resin.
    Type: Application
    Filed: May 27, 2005
    Publication date: July 3, 2008
    Inventors: Oh-Young Kim, Jin-Ho Nam, Hwa-Joon Lim