Patents by Inventor Jin-Hong CAI

Jin-Hong CAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoelectric cooling module
    Patent number: 9781821
    Abstract: A thermoelectric cooling module includes a first circuit board, a second circuit board, first conducting members, second conducting members and TED chips. The first circuit board includes first circuit regions, each having a first conducting layer and first penetrating holes; the second circuit board includes second circuit regions, each having a second conducting layer and second penetrating holes; each first conducting member is passed and fixed into each respective first penetrating hole; each second conducting member is passed and fixed into each respective second penetrating hole; each TED chip is clamped between the first circuit board and the second circuit board, and each first conducting member has an end attached to the TED chip and the other end attached to the first conducting layer, and each second conducting member has an end attached to the TED chip and the other end attached to the second conducting layer.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: October 3, 2017
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Lee-Lung Chen, Ching-Shun Wang, Jin-Hong Cai
  • THERMOELECTRIC COOLING MODULE
    Publication number: 20170223817
    Abstract: A thermoelectric cooling module includes a first circuit board, a second circuit board, first conducting members, second conducting members and TED chips. The first circuit board includes first circuit regions, each having a first conducting layer and first penetrating holes; the second circuit board includes second circuit regions, each having a second conducting layer and second penetrating holes; each first conducting member is passed and fixed into each respective first penetrating hole; each second conducting member is passed and fixed into each respective second penetrating hole; each TED chip is clamped between the first circuit board and the second circuit board, and each first conducting member has an end attached to the TED chip and the other end attached to the first conducting layer, and each second conducting member has an end attached to the TED chip and the other end attached to the second conducting layer.
    Type: Application
    Filed: March 18, 2016
    Publication date: August 3, 2017
    Inventors: Lee-Lung CHEN, Ching-Shun WANG, Jin-Hong CAI