Abstract: A heater structure includes a heating unit, a power supply holder, a second conducting element, a locking component, a docking component, a printed circuit board and an identification circuit. The heating unit includes a heating container, a first conducting element and a locking component. The power supply holder has a housing. The housing is connected with an extending wall. The housing is cooperated with the extending wall to define an inner space for accommodating the heating unit. A peripheral wall of the housing is recessed downward and sideward to form a locking groove. The second conducting element is mounted in the inner space. The second conducting element is connected with the first conducting element. The locking component is locked in the locking groove. The docking component is disposed in the inner space. The printed circuit board is mounted to a bottom of the power supply holder.

Abstract: A method of fabricating a semiconductor device is provided. The method includes forming a first metal layer over a semiconductor substrate, and forming a first layer over the first metal layer. The first layer and first metal layer are etched to expose a sidewall of the first layer and a sidewall of the first metal layer, wherein the etching disburses a portion of the first metal layer to create an accumulation of material on at least one of the sidewall of the first layer or the sidewall of the first metal layer. At least some of the accumulation is etched away using an etchant comprising fluorine.

Abstract: A method of fabricating a semiconductor device is provided. The method includes forming a first metal layer over a semiconductor substrate, and forming a first layer over the first metal layer. The first layer and first metal layer are etched to expose a sidewall of the first layer and a sidewall of the first metal layer, wherein the etching disburses a portion of the first metal layer to create an accumulation of material on at least one of the sidewall of the first layer or the sidewall of the first metal layer. At least some of the accumulation is etched away using an etchant comprising fluorine.

Abstract: A method of fabricating a semiconductor device is provided. The method includes forming a first metal layer over a semiconductor substrate, and forming a first layer over the first metal layer. The first layer and first metal layer are etched to expose a sidewall of the first layer and a sidewall of the first metal layer, wherein the etching disburses a portion of the first metal layer to create an accumulation of material on at least one of the sidewall of the first layer or the sidewall of the first metal layer. At least some of the accumulation is etched away using an etchant comprising fluorine.

Abstract: An exemplary heat sink assembly includes a heat sink, a connecting member, and a mounting member. A mounting hole and a receiving hole are defined in the heat sink and communicating with each other. The connecting member is adapted for fixing the heat sink. The connecting member includes a connecting section and an extending section extending from the connecting section. The mounting member fixes the connecting member to the heat sink. The connecting section is received in the receiving hole of the heat sink, the extending section is protruding from the heat sink, and the mounting member extends through the mounting hole and engaging with the connecting section to fix the connecting member to the heat sink.

Abstract: A heat dissipation device includes a base and a fastener. The fastener includes a neck portion, a head portion formed at one end of the neck portion, and an engaging portion formed at another opposite end of the neck portion. The base defines a receiving portion through the base. The receiving portion includes an inserting hole and a mounting hole communicating with the inserting hole. A flange extends upwardly from the base toward the mounting hole. The engaging portion extends through the inserting hole from a top of the base to make the neck portion enter the inserting hole. The neck portion is then crushed into the mounting hole from the inserting hole. A top face of the head portion abuts the flange, a bottom face of the head portion abuts the base.

Abstract: A heat dissipation device includes a base and a fastener. The fastener includes a neck portion, a head portion formed at one end of the neck portion, and an engaging portion formed at another opposite end of the neck portion. The base defines a receiving portion through the base. The receiving portion includes an inserting hole and a mounting hole communicating with the inserting hole. The engaging portion extends through the inserting hole from a top of the base to make the neck portion enter the inserting hole. The neck portion is then crushed into the mounting hole from the inserting hole. The engaging portion abuts the bottom side of the base at a periphery of the mounting hole. The head portion abuts the top side of the base at the periphery of the mounting hole.

Abstract: An exemplary heat sink assembly includes a heat sink, a connecting member, and a mounting member. A mounting hole and a receiving hole are defined in the heat sink and communicating with each other. The connecting member is adapted for fixing the heat sink. The connecting member includes a connecting section and an extending section extending from the connecting section. The mounting member fixes the connecting member to the heat sink. The connecting section is received in the receiving hole of the heat sink, the extending section is protruding from the heat sink, and the mounting member extends through the mounting hole and engaging with the connecting section to fix the connecting member to the heat sink.

Abstract: A heat dissipation device includes a base and a fastener. The fastener includes a neck portion, a head portion formed at one end of the neck portion, and an engaging portion formed at another opposite end of the neck portion. The base defines a receiving portion through the base. The receiving portion includes an inserting hole and a mounting hole communicating with the inserting hole. The engaging portion extends through the inserting hole from a top of the base to make the neck portion enter the inserting hole. The neck portion is then crushed into the mounting hole from the inserting hole. The engaging portion abuts the bottom side of the base at a periphery of the mounting hole. The head portion abuts the top side of the base at the periphery of the mounting hole.

Abstract: A heat dissipation device includes a base and a fastener. The fastener includes a neck portion, a head portion formed at one end of the neck portion, and an engaging portion formed at another opposite end of the neck portion. The base defines a receiving portion through the base. The receiving portion includes an inserting hole and a mounting hole communicating with the inserting hole. A flange extends upwardly from the base toward the mounting hole. The engaging portion extends through the inserting hole from a top of the base to make the neck portion enter the inserting hole. The neck portion is then crushed into the mounting hole from the inserting hole. A top face of the head portion abuts the flange, a bottom face of the head portion abuts the base.

Abstract: A method and system for providing network management communication between a plurality of network elements are disclosed. A method includes creating a tunnel configured for transmitting data between the network elements and transmitting network management information over the tunnel using a network management protocol. The tunnel passes through a gateway network element configured to communicate with the network elements utilizing the network management protocol.

Abstract: Disclosed is a method and associated apparatus for automatically propagating circuit information in a network. In one embodiment, a network includes multiple circuit switches that are coupled using communications links. Information relating to the communications links are automatically propagated in the network using a protocol used by routers in communicating with other routers.

Abstract: A method for automatically detecting bi-directional link switched ring link provisioning errors. The method includes receiving an opaque link state advertisement containing bi-directional link switched ring ID and link information at a local node of the ring and checking ring IDs of neighbor nodes of the local node. If the ring IDs of the local node and neighbor nodes do not match a ring ID mismatch alarm is raised.

Abstract: A method and system for providing network management communication between a plurality of network elements are disclosed. A method includes creating a tunnel configured for transmitting data between the network elements and transmitting network management information over the tunnel using a network management protocol. The tunnel passes through a gateway network element configured to communicate with the network elements utilizing the network management protocol.

Abstract: A method for generating a ring map for a bi-directional line switched ring. The method includes identifying a change in a provisioned bi-directional line switched ring and generating a ring map for both directions in the ring at a node of the ring. The generated ring maps are compared to determine if the change in the ring is a result of a link failure or a node change and the node's ring map is updated if there was a node change in the ring.

Abstract: A method for identifying and choosing a shortest path segment that has an alternate edge disjoint path segment. While routing Unidirectional Path Switched Ring (UPSR) path segments in a graph, there may be several equal distance paths to choose the shortest path from. Choosing a certain path as the shortest path may minimize or eliminate the chance of finding an alternative path segment. A method is provided such that if multiple shortest paths from the source node to a particular destination node exist, the method selects the shortest path which has an alternate edge disjoint path, and which can be used for path protection. The particular shortest path chosen by the method is not necessarily the first shortest path constructed.

Abstract: Disclosed is a method and associated apparatus for automatically propagating circuit information in a network. In one embodiment, a network includes multiple circuit switches that are coupled using communications links. Information relating to the communications links are automatically propagated in the network using a protocol used by routers in communicating with other routers.