Patents by Inventor Jin Hwa CHANG

Jin Hwa CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961775
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Patent number: 10604615
    Abstract: A rigid polyurethane foam which is a polymerization product of a composition including a concentrated acid hydrolytic lignin, a polyol, and an isocyanate, and a method of preparing the rigid polyurethane foam.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: March 31, 2020
    Assignee: CJ CHEILJEDANG CORPORATION
    Inventors: Sun Joo Moon, Da Eun Kim, Jeung Yil Park, Sang Mok Lee, Min Ho Jung, Young Ran Kim, Jung Min Kim, Jin Hwa Chang
  • Patent number: 10100073
    Abstract: A method of preparing a low-molecular lignin derivative comprises the step of: preparing lignin by hydrolyzing lignocellulosic biomass with an acid; preparing a first mixture by mixing 100 parts by weight of the lignin and 500 parts or more by weight of a phenolic compound; preparing a second mixture by mixing the first mixture with a solvent including the hydrophobic polar solvent; and recovering a low-molecular lignin derivative from the second mixture.
    Type: Grant
    Filed: May 22, 2014
    Date of Patent: October 16, 2018
    Assignee: CJ CHEILJEDANG CORP.
    Inventors: Min Ho Jung, Sun Joo Moon, Jeung Yil Park, Sang Mok Lee, Da Eun Kim, Young Ran Kim, Jung Min Kim, Jin Hwa Chang
  • Publication number: 20170253689
    Abstract: A rigid polyurethane foam which is a polymerization product of a composition including a concentrated acid hydrolytic lignin, a polyol, and an isocyanate, and a method of preparing the rigid polyurethane foam.
    Type: Application
    Filed: November 5, 2015
    Publication date: September 7, 2017
    Inventors: Sun Joo MOON, Da Eun KIM, Jeung Yil PARK, Sang Mok LEE, Min Ho JUNG, Young Ran KIM, Jung Min KIM, Jin Hwa CHANG
  • Publication number: 20160102114
    Abstract: A method of preparing a low-molecular lignin derivative comprises the step of: preparing lignin by hydrolyzing lignocellulosic biomass with an acid; preparing a first mixture by mixing 100 parts by weight of the lignin and 500 parts or more by weight of a phenolic compound; preparing a second mixture by mixing the first mixture with a solvent including the hydrophobic polar solvent; and recovering a low-molecular lignin derivative from the second mixture.
    Type: Application
    Filed: May 22, 2014
    Publication date: April 14, 2016
    Inventors: Min Ho JUNG, Sun Joo MOON, Jeung Yil PARK, Sang Mok LEE, Da Eun KIM, Young Ran KIM, Jung Min KIM, Jin Hwa CHANG