Abstract: A method of producing an adhesive tape which can bond electronic parts at the environs of a lead frame, such as leads, diepads and radiant plates, semiconductor chips, to each other and which is superior in adhesiveness, thermal resistance and electrical properties. The adhesive tape is produced by coating on one side or both sides of a thermally resistant film an adhesive composition comprising a carboxylic group-containing acrylonitrile-butadiene copolymer ranging, in weight average molecular weight, from 5,000 to 10,000 with an acrylonitrile content of 5-50 weight %, a mixed epoxy resin selected from a set of bisphenol A-type epoxy and cresol novolak epoxy and a set of bisphenol A-type epoxy and phenol novolak epoxy, a compound having at least two intramolecular maleimide groups, an aromatic diamine compound, an epoxy-containing liquid silicon resin, a filler and a solvent and drying it.