Patents by Inventor Jin-Hwan Cho
Jin-Hwan Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240140078Abstract: A textile fabric includes a textile fabric layer, a transparent film layer provided on the textile fabric layer, and a surface layer disposed on the transparent film layer. The transparent film layer has a two-layer structure including a first film layer having a first polyetherester-based copolymer and a second film layer having a second polyetherester-based copolymer disposed on the first film layer. The second film layer is provided on the textile fabric layer. A method of manufacturing the fabric includes preparing the textile fabric layer, forming the transparent film layer on the fabric layer, and laminating the textile fabric and transparent film layers through heat treatment.Type: ApplicationFiled: June 16, 2023Publication date: May 2, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, TKG ECO MATERIAL CO., LTD.Inventors: Hyun Dae Cho, Myoung Ryoul Lee, Seul Yi, Gu Hwan Kim, Jin Hun Cha
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Publication number: 20240145346Abstract: A semiconductor device includes a substrate with a conductive pattern. A semiconductor die is electrically connected to the substrate and both the semiconductor die and the substrate are at least partially covered by a package body. In some examples, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In some examples, through-mold vias are included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. In some examples, an interposer is electrically connected to the through-mold vias and may be covered by the package body and/or disposed in spaced relation thereto. In some examples, the interposer may not be electrically connected to the through-mold vias but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.Type: ApplicationFiled: January 8, 2024Publication date: May 2, 2024Applicant: Amkor Technology Singapore Holding Pte. LtdInventors: Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM, Jae Dong KIM, Yeon Soo JUNG, Sung Hwan CHO
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Publication number: 20240136488Abstract: A pixel may include: an emission area and a non-emission area; a first bank in the non-emission area, the first bank including an opening corresponding to the emission area; a first electrode, a second electrode, and an intermediate electrode that are spaced from each other; light emitting elements in the emission area, each of the light emitting elements including one end portion electrically connected to one of the first electrode, the second electrode, or the intermediate electrode and an other end portion electrically connected to another one of the first electrode, the second electrode, or the intermediate electrode; and a sub-bank located in the opening of the first bank, the sub-bank being spaced from the first bank. The intermediate electrode may be around at least a portion of the sub-bank.Type: ApplicationFiled: October 16, 2023Publication date: April 25, 2024Inventors: Jin Taek KIM, Veidhes BASRUR, Ki Nyeng KANG, Ock Soo SON, Yong Tae CHO, Jong Hwan CHA
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Patent number: 11963439Abstract: The present disclosure relates to an organic electroluminescent compound and an organic electroluminescent device comprising the same. By comprising the compound according to the present disclosure, it is possible to produce an organic electroluminescent device having improved driving voltage, power efficiency, and/or lifetime properties compared to the conventional organic electroluminescent devices.Type: GrantFiled: August 24, 2022Date of Patent: April 16, 2024Assignee: Rohm and Haas Electronic Materials Korea Ltd.Inventors: Eun-Joung Choi, Young-Kwang Kim, Su-Hyun Lee, So-Young Jung, YeJin Jeon, Hong-Se Oh, Dong-Hyung Lee, Jin-Man Kim, Hyun-Woo Kang, Mi-Ja Lee, Hee-Ryong Kang, Hyo-Nim Shin, Jeong-Hwan Jeon, Sang-Hee Cho
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Patent number: 11961775Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.Type: GrantFiled: November 8, 2022Date of Patent: April 16, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
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Publication number: 20240114719Abstract: A display device includes a first substrate including at least one first opening part defined, a pixel disposed on the first substrate, at least one first heat dissipation layer disposed in the at least one first opening part, an insulation layer disposed under the first substrate and including at least one second opening part overlapping the at least one first opening part, and a second heat dissipation layer disposed in the at least one second opening part.Type: ApplicationFiled: December 1, 2023Publication date: April 4, 2024Applicant: Samsung Display Co., LTD.Inventors: DAEHWAN JANG, SUNGHOON KIM, HYUK-HWAN KIM, SEOKHYUN NAM, HAENGWON PARK, JIN HO CHO
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Publication number: 20240109398Abstract: Provided is a vehicle thermal management system, including: an HVAC subsystem thermally connected to a passenger compartment; and a powertrain cooling subsystem thermally connected to a powertrain component.Type: ApplicationFiled: March 8, 2023Publication date: April 4, 2024Inventors: Ki Hyun Kim, Jin Hwan Lee, Wan Je Cho, Jung Ha Park
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Patent number: 11941637Abstract: Disclosed is a method of processing item sales information by an electronic apparatus including acquiring a purchase request including item information related to an item selected by a user and information related to a payment means, providing a purchase response including approval information corresponding to the purchase request before proceeding with payment through the payment means in response to the purchase request when the information related to the payment means satisfies a first condition, transmitting a release request for the item to a first server; and requesting payment for at least some of an amount corresponding to one or more purchase requests related to the payment means according to an arrival of settlement timing corresponding to the payment means.Type: GrantFiled: March 23, 2021Date of Patent: March 26, 2024Assignee: Coupang Corp.Inventors: Zee Young Min, Ki Hyun Jeong, Il Hyun Seo, Hyun Ju Cho, Jin Hwan Kim, Hyun Yong Jung, Min Yong Yuk, Ho Hyun Lim, Jin Hyuk Kim
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Patent number: 11926310Abstract: Controlling a speed limit includes determining a virtual vehicle speed as being a lower one of a vehicle speed and a target limit speed, determining a virtual APS value as being a larger one of a first APS value and a second APS value, transitioning to a second mode at a point in time at which an actual APS value and the second APS value become different, when it is expected to transition to the second mode, among a first mode for sustaining a SOC of a battery at the target limit speed and the second mode for depleting the SOC, and determining a transmission gear position by applying the determined virtual vehicle speed and the determined virtual APS value to one of a first shifting pattern and a second shifting pattern.Type: GrantFiled: September 28, 2020Date of Patent: March 12, 2024Assignees: Hyundai Motor Company, Kia Motors CorporationInventors: Hui Un Son, Sang Joon Kim, Kyu Hwan Jo, Sung Bae Jeon, Sung Hoon Yu, Joo Young Kim, Jin Kyeom Cho
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Publication number: 20240067079Abstract: A brake lamp control method of a vehicle is provided. The method includes determining whether a deceleration of the vehicle based on regenerative brake through the electric motor is present in a hysteresis period between an off threshold as a reference for turning off a brake lamp and an on threshold as a reference for turning on the brake lamp. When the deceleration of the vehicle is present in the hysteresis period, the method includes determining a state of the brake lamp before the deceleration of the vehicle enters the hysteresis period. In response to determining that the brake lamp is turned on or off for a reason except for the regenerative brake before the deceleration of the vehicle enters the hysteresis period, a request for turning on the brake lamp is set or reset based on the regenerative brake in response to the determined state of the brake lamp.Type: ApplicationFiled: November 2, 2023Publication date: February 29, 2024Inventors: Hui Un Son, Sang Joon Kim, Kyu Hwan Jo, Sung Bae Jeon, Sung Hoon Yu, Joo Young Kim, Jin Kyeom Cho
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Publication number: 20240067668Abstract: The present invention relates to a heteroaryl derivative compound and a use thereof. Since the heteroaryl derivative of the present invention exhibits excellent inhibitory activity against EGFR, the heteroaryl derivative can be usefully used as a therapeutic agent for EGFR-associated diseases.Type: ApplicationFiled: December 29, 2021Publication date: February 29, 2024Inventors: Yi Kyung Ko, Ah Reum Han, Jin Hee Park, Yeong Deok Lee, Hye Rim Im, Kyun Eun Kim, Dong Keun Hwang, Su Been Nam, Myung Hoe Heo, Se Rin Cho, Eun Hwa Ko, Sung Hwan Kim, Hwan Geun Choi
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Patent number: 8317380Abstract: A heat-dissipating apparatus for a vehicle lamp includes: a light source unit comprising at least one LED; a housing which houses the light source unit therein and is formed with an opening in a rear portion thereof; a dust cover coupled to the housing at or near the position of the opening; and a cooling fan coupled to the dust cover for dissipating heat generated by the light source unit.Type: GrantFiled: December 18, 2008Date of Patent: November 27, 2012Assignee: SL LightingInventors: Jin-Hwan Cho, Hak-Bong Kim
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Patent number: 8201976Abstract: A heat-dissipating apparatus for a vehicle lamp includes: a heat-dissipating apparatus including: an LED-mounting block having an LED mounted thereon; a thermally conductive material disposed adjacent to the LED-mounting block for transmitting heat generated by the LED; and a heat sink disposed adjacent to the thermally conductive material for dissipating the heat transmitted by the thermally conductive material, wherein at least one concave portion is formed in one side of the LED-mounting block which is adjacent to the thermally conductive material, one side of the heat sink which is adjacent to the thermally conductive material, or both. The thermally conductive material is inserted in the concave portion or portions.Type: GrantFiled: December 18, 2008Date of Patent: June 19, 2012Assignee: SL SeobongInventors: Jin-Hwan Cho, Hak-Bong Kim
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Publication number: 20090154189Abstract: A heat-dissipating apparatus for a vehicle lamp includes: a light source unit comprising at least one LED; a housing which houses the light source unit therein and is formed with an opening in a rear portion thereof; a dust cover coupled to the housing at or near the position of the opening; and a cooling fan coupled to the dust cover for dissipating heat generated by the light source unit.Type: ApplicationFiled: December 18, 2008Publication date: June 18, 2009Applicant: SL LIGHTINGInventors: Jin-Hwan CHO, Hak-Bong KIM
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Publication number: 20090154180Abstract: A heat-dissipating apparatus for a vehicle lamp includes: a heat-dissipating apparatus including: an LED-mounting block having an LED mounted thereon; a thermally conductive material disposed adjacent to the LED-mounting block for transmitting heat generated by the LED; and a heat sink disposed adjacent to the thermally conductive material for dissipating the heat transmitted by the thermally conductive material, wherein at least one concave portion is formed in one side of the LED-mounting block which is adjacent to the thermally conductive material, one side of the heat sink which is adjacent to the thermally conductive material, or both. The thermally conductive material is inserted in the concave portion or portions.Type: ApplicationFiled: December 18, 2008Publication date: June 18, 2009Applicant: SL SeobongInventors: Jin-Hwan CHO, Hak-Bong KIM