Patents by Inventor Jin-Hwan Kang
Jin-Hwan Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145346Abstract: A semiconductor device includes a substrate with a conductive pattern. A semiconductor die is electrically connected to the substrate and both the semiconductor die and the substrate are at least partially covered by a package body. In some examples, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In some examples, through-mold vias are included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. In some examples, an interposer is electrically connected to the through-mold vias and may be covered by the package body and/or disposed in spaced relation thereto. In some examples, the interposer may not be electrically connected to the through-mold vias but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.Type: ApplicationFiled: January 8, 2024Publication date: May 2, 2024Applicant: Amkor Technology Singapore Holding Pte. LtdInventors: Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM, Jae Dong KIM, Yeon Soo JUNG, Sung Hwan CHO
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Publication number: 20240136488Abstract: A pixel may include: an emission area and a non-emission area; a first bank in the non-emission area, the first bank including an opening corresponding to the emission area; a first electrode, a second electrode, and an intermediate electrode that are spaced from each other; light emitting elements in the emission area, each of the light emitting elements including one end portion electrically connected to one of the first electrode, the second electrode, or the intermediate electrode and an other end portion electrically connected to another one of the first electrode, the second electrode, or the intermediate electrode; and a sub-bank located in the opening of the first bank, the sub-bank being spaced from the first bank. The intermediate electrode may be around at least a portion of the sub-bank.Type: ApplicationFiled: October 16, 2023Publication date: April 25, 2024Inventors: Jin Taek KIM, Veidhes BASRUR, Ki Nyeng KANG, Ock Soo SON, Yong Tae CHO, Jong Hwan CHA
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Patent number: 11962022Abstract: Disclosed is a miniaturized battery module in which a space except for a space of a battery cell is minimized and the number of components is reduced. The miniaturized battery module includes a cell assembly configured by assembling a plurality of battery cells, an upper frame inserted into an outer upper surface of the cell assembly, a lower frame inserted into an outer lower surface of the cell assembly and fastened to the upper frame, and first and second endplates fastened to two opposite ends of the cell assembly and configured to fix the plurality of battery cells. In this case, at least two or more of the plurality of the battery cells are arranged side by side, and the upper frame and the lower frame are fastened by welding.Type: GrantFiled: September 23, 2021Date of Patent: April 16, 2024Assignee: HL GREENPOWER INC.Inventors: Jae-Yeon Ryu, Gil-Sup Kim, Sung-Joo Kang, Jae-Nyeon Kim, Jin-Su Han, Jung-Hwan Kim
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Patent number: 11961775Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.Type: GrantFiled: November 8, 2022Date of Patent: April 16, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
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Patent number: 11963439Abstract: The present disclosure relates to an organic electroluminescent compound and an organic electroluminescent device comprising the same. By comprising the compound according to the present disclosure, it is possible to produce an organic electroluminescent device having improved driving voltage, power efficiency, and/or lifetime properties compared to the conventional organic electroluminescent devices.Type: GrantFiled: August 24, 2022Date of Patent: April 16, 2024Assignee: Rohm and Haas Electronic Materials Korea Ltd.Inventors: Eun-Joung Choi, Young-Kwang Kim, Su-Hyun Lee, So-Young Jung, YeJin Jeon, Hong-Se Oh, Dong-Hyung Lee, Jin-Man Kim, Hyun-Woo Kang, Mi-Ja Lee, Hee-Ryong Kang, Hyo-Nim Shin, Jeong-Hwan Jeon, Sang-Hee Cho
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Patent number: 11955124Abstract: An example electronic device includes a housing; a touchscreen display; a microphone; at least one speaker; a button disposed on a portion of the housing or set to be displayed on the touchscreen display; a wireless communication circuit; a processor; and a memory. When a user interface is not displayed on the touchscreen display, the electronic device enables a user to receive a user input through the button, receives user speech through the microphone, and then provides data on the user speech to an external server. An instruction for performing a task is received from the server. When the user interface is displayed on the touchscreen display, the electronic device enables the user to receive the user input through the button, receives user speech through the microphone, and then provides data on the user speech to the external server.Type: GrantFiled: January 10, 2022Date of Patent: April 9, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-Ki Kang, Jang-Seok Seo, Kook-Tae Choi, Hyun-Woo Kang, Jin-Yeol Kim, Chae-Hwan Li, Kyung-Tae Kim, Dong-Ho Jang, Min-Kyung Hwang
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Publication number: 20240092060Abstract: Provided is an unconstrained vibration damping metal sheet with foam pores. The unconstrained vibration damping metal sheet of the present invention comprises: a metal sheet; an organic-inorganic pretreatment layer containing an acrylic resin formed on the metal sheet; and a foam resin layer formed on the pretreatment layer, the foam resin layer containing, based on weight % thereof, a thermoplastic polyvinyl chloride resin: 40-80%, a plasticizer: 5-40%, a foaming agent: 0.1-10%, an oxide-based crosslinker: 1-4%, and spherical silica: 1-10%.Type: ApplicationFiled: November 30, 2021Publication date: March 21, 2024Applicant: POSCO Co., LtdInventors: Jin-Tae Kim, Dae-Gyu Kang, Yang-Ho Choi, Jung-Hwan Lee
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Patent number: 9379922Abstract: In order to generate multiple-access signals, each transmitter transmits information by using all or a part of channel resources. The signal of each transmitter is mapped to an OFDM time-frequency resource space as a trellis modulation path. A mobile communication system maps trellis modulation paths of a plurality of transmitters to the same resource space. In order to effectively detect and distinguish signals of a plurality of transmitters transmitted through the same channel resource space, a receiver uses a message passing method between symbols and a path connection method. The receiver uses a state space expansion method, a backward pre-decoding method, and a successive interference cancellation method to more efficiently reconstruct a discovery signal.Type: GrantFiled: November 8, 2013Date of Patent: June 28, 2016Assignees: Samsung Electronics Co., Ltd., Research & Business Foundation Sungkyunkwan UniversityInventors: Chi-Woo Lim, Sang-Hyo Kim, Min Jang, Jin-Hwan Kang, Kyung-Kyu Kim, Dae-Gyun Kim, Hyun-Seok Ryu, Seung-Hoon Park, Seung-Sik Shin
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Publication number: 20140133593Abstract: In order to generate multiple-access signals, each transmitter transmits information by using all or a part of channel resources. The signal of each transmitter is mapped to an OFDM time-frequency resource space as a trellis modulation path. A mobile communication system maps trellis modulation paths of a plurality of transmitters to the same resource space. In order to effectively detect and distinguish signals of a plurality of transmitters transmitted through the same channel resource space, a receiver uses a message passing method between symbols and a path connection method. The receiver uses a state space expansion method, a backward pre-decoding method, and a successive interference cancellation method to more efficiently reconstruct a discovery signal.Type: ApplicationFiled: November 8, 2013Publication date: May 15, 2014Applicants: Research & Business Foundation Sungkyunkwan University, Samsung Electronics Co., LtdInventors: Chi-Woo Lim, Sang-Hyo Kim, Min Jang, Jin-Hwan Kang, Kyung-Kyu Kim, Dae-Gyun Kim, Hyun-Seok Ryu, Seung-Hoon Park, Seung-Sik Shin