Patents by Inventor Jin-Hwan Kim
Jin-Hwan Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145346Abstract: A semiconductor device includes a substrate with a conductive pattern. A semiconductor die is electrically connected to the substrate and both the semiconductor die and the substrate are at least partially covered by a package body. In some examples, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In some examples, through-mold vias are included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. In some examples, an interposer is electrically connected to the through-mold vias and may be covered by the package body and/or disposed in spaced relation thereto. In some examples, the interposer may not be electrically connected to the through-mold vias but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.Type: ApplicationFiled: January 8, 2024Publication date: May 2, 2024Applicant: Amkor Technology Singapore Holding Pte. LtdInventors: Dong Joo PARK, Jin Seong KIM, Ki Wook LEE, Dae Byoung KANG, Ho CHOI, Kwang Ho KIM, Jae Dong KIM, Yeon Soo JUNG, Sung Hwan CHO
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Publication number: 20240140078Abstract: A textile fabric includes a textile fabric layer, a transparent film layer provided on the textile fabric layer, and a surface layer disposed on the transparent film layer. The transparent film layer has a two-layer structure including a first film layer having a first polyetherester-based copolymer and a second film layer having a second polyetherester-based copolymer disposed on the first film layer. The second film layer is provided on the textile fabric layer. A method of manufacturing the fabric includes preparing the textile fabric layer, forming the transparent film layer on the fabric layer, and laminating the textile fabric and transparent film layers through heat treatment.Type: ApplicationFiled: June 16, 2023Publication date: May 2, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, TKG ECO MATERIAL CO., LTD.Inventors: Hyun Dae Cho, Myoung Ryoul Lee, Seul Yi, Gu Hwan Kim, Jin Hun Cha
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Patent number: 11971564Abstract: A decoration element is described. The decoration element includes a light reflective layer; a light absorbing layer provided on the light reflective layer; and a color developing layer comprising a color film, wherein the color developing layer is provided: on a surface of the light reflective layer opposite to a surface of the light reflective layer facing the light absorbing layer; between the light reflective layer and the light absorbing layer; or on a surface of the light absorbing layer opposite to a surface of the light absorbing layer facing the light reflective layer.Type: GrantFiled: July 4, 2018Date of Patent: April 30, 2024Assignee: LG CHEM, LTD.Inventors: Pilsung Jo, Song Ho Jang, Yong Chan Kim, Jeong Woo Shon, Jin Suk Song, Ki Hwan Kim
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Publication number: 20240136488Abstract: A pixel may include: an emission area and a non-emission area; a first bank in the non-emission area, the first bank including an opening corresponding to the emission area; a first electrode, a second electrode, and an intermediate electrode that are spaced from each other; light emitting elements in the emission area, each of the light emitting elements including one end portion electrically connected to one of the first electrode, the second electrode, or the intermediate electrode and an other end portion electrically connected to another one of the first electrode, the second electrode, or the intermediate electrode; and a sub-bank located in the opening of the first bank, the sub-bank being spaced from the first bank. The intermediate electrode may be around at least a portion of the sub-bank.Type: ApplicationFiled: October 16, 2023Publication date: April 25, 2024Inventors: Jin Taek KIM, Veidhes BASRUR, Ki Nyeng KANG, Ock Soo SON, Yong Tae CHO, Jong Hwan CHA
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LITHIUM COMPOSITE OXIDE AND POSITIVE ELECTRODE ACTIVE MATERIAL FOR SECONDARY BATTERY CONTAINING SAME
Publication number: 20240136510Abstract: A positive electrode active material including a first lithium composite oxide particle including a secondary particle formed by aggregation of one or more primary particles, and a coating oxide occupying at least a part of at least one of surfaces of the secondary particle, grain boundaries between the primary particles, or surfaces of the primary particles, the positive electrode active material satisfying an equation of 1.3?a/b?3.0, wherein a represents a max peak intensity at 2theta=44.75° to 44.80° and b represents a max peak intensity at 2theta=45.3° to 45.6° in X-ray diffraction (XRD) analysis using Cu K? radiation.Type: ApplicationFiled: May 21, 2023Publication date: April 25, 2024Inventors: Yu Gyeong CHUN, Moon Ho CHOI, Yoon Young CHOI, Jong Seung SHIN, Yong Hwan GWON, Jin Ho BAE, Ji Won KIM, Sang Hyeok KIM -
Publication number: 20240129460Abstract: An image encoding/decoding method and apparatus are provided. An image decoding method performed by an image decoding apparatus may include identifying a prediction mode of a current block, determining a candidate intra prediction mode for the current block, based on a prediction mode of a neighboring block located around the current block, based on the intra prediction mode of the current block being an intra prediction mode, generating a candidate intra prediction mode list of the current block based on the candidate intra prediction mode, and determine an intra prediction mode of the current block based on the candidate intra prediction mode list. In this case, the candidate intra prediction mode may be determined to be a predetermined intra prediction mode, based on the prediction mode of the neighboring block being an MIP mode.Type: ApplicationFiled: November 30, 2023Publication date: April 18, 2024Inventors: Jangwon CHOI, Jin HEO, Sunmi YOO, Jungah CHOI, Seung Hwan KIM
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Patent number: 11962022Abstract: Disclosed is a miniaturized battery module in which a space except for a space of a battery cell is minimized and the number of components is reduced. The miniaturized battery module includes a cell assembly configured by assembling a plurality of battery cells, an upper frame inserted into an outer upper surface of the cell assembly, a lower frame inserted into an outer lower surface of the cell assembly and fastened to the upper frame, and first and second endplates fastened to two opposite ends of the cell assembly and configured to fix the plurality of battery cells. In this case, at least two or more of the plurality of the battery cells are arranged side by side, and the upper frame and the lower frame are fastened by welding.Type: GrantFiled: September 23, 2021Date of Patent: April 16, 2024Assignee: HL GREENPOWER INC.Inventors: Jae-Yeon Ryu, Gil-Sup Kim, Sung-Joo Kang, Jae-Nyeon Kim, Jin-Su Han, Jung-Hwan Kim
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Patent number: 11963439Abstract: The present disclosure relates to an organic electroluminescent compound and an organic electroluminescent device comprising the same. By comprising the compound according to the present disclosure, it is possible to produce an organic electroluminescent device having improved driving voltage, power efficiency, and/or lifetime properties compared to the conventional organic electroluminescent devices.Type: GrantFiled: August 24, 2022Date of Patent: April 16, 2024Assignee: Rohm and Haas Electronic Materials Korea Ltd.Inventors: Eun-Joung Choi, Young-Kwang Kim, Su-Hyun Lee, So-Young Jung, YeJin Jeon, Hong-Se Oh, Dong-Hyung Lee, Jin-Man Kim, Hyun-Woo Kang, Mi-Ja Lee, Hee-Ryong Kang, Hyo-Nim Shin, Jeong-Hwan Jeon, Sang-Hee Cho
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Patent number: 11961775Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.Type: GrantFiled: November 8, 2022Date of Patent: April 16, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
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Publication number: 20240118781Abstract: A method for processing contents at an electronic device is provided. The method includes generating a first content corresponding to a user input applied to content via the electronic device, and displaying a floating user interface (UI), which displays first scrap information on the first content, on a screen of the electronic device.Type: ApplicationFiled: December 14, 2023Publication date: April 11, 2024Inventors: Kyung-Hwan KIM, Dong-Jeon KIM, Jin-Hong JEONG, Hye-Soon JEONG, Se-Jun SONG, Yo-Han LEE
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Publication number: 20240121948Abstract: A semiconductor device and a method of fabricating the same are provided. According to the present invention, a semiconductor device comprises an active region formed in a substrate, and including flat surfaces and hole-shaped recess portions; upper-level plugs disposed over the flat surfaces; a spacer disposed between the upper-level plugs and providing a trench exposing the hole-shaped recess portions; a lower-level plug filling the hole-shaped recess portions; and a buried conductive line disposed over the lower-level plug and partially filling the trench.Type: ApplicationFiled: December 18, 2023Publication date: April 11, 2024Inventors: Jae Man YOON, Jin Hwan JEON, Tae Kyun KIM, Jung Woo PARK, Su Ock CHUNG, Jae Won HA
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Patent number: 11955124Abstract: An example electronic device includes a housing; a touchscreen display; a microphone; at least one speaker; a button disposed on a portion of the housing or set to be displayed on the touchscreen display; a wireless communication circuit; a processor; and a memory. When a user interface is not displayed on the touchscreen display, the electronic device enables a user to receive a user input through the button, receives user speech through the microphone, and then provides data on the user speech to an external server. An instruction for performing a task is received from the server. When the user interface is displayed on the touchscreen display, the electronic device enables the user to receive the user input through the button, receives user speech through the microphone, and then provides data on the user speech to the external server.Type: GrantFiled: January 10, 2022Date of Patent: April 9, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-Ki Kang, Jang-Seok Seo, Kook-Tae Choi, Hyun-Woo Kang, Jin-Yeol Kim, Chae-Hwan Li, Kyung-Tae Kim, Dong-Ho Jang, Min-Kyung Hwang
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Patent number: 11955531Abstract: An integrated circuit device includes a fin-type active region protruding from a top surface of a substrate and extending in a first direction parallel to the top surface of the substrate, a gate structure intersecting with the fin-type active region and extending on the substrate in a second direction perpendicular to the first direction, a source/drain region on a first side of the gate structure, a first contact structure on the source/drain region, and a contact capping layer on the first contact structure. A top surface of the first contact structure has a first width in the first direction, a bottom surface of the contact capping layer has a second width greater than the first width stated above in the first direction, and the contact capping layer includes a protruding portion extending outward from a sidewall of the first contact structure.Type: GrantFiled: February 27, 2023Date of Patent: April 9, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Dae-young Kwak, Ji-ye Kim, Jung-hwan Chun, Min-chan Gwak, Dong-hyun Roh, Jin-wook Lee, Sang-jin Hyun
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Publication number: 20240109398Abstract: Provided is a vehicle thermal management system, including: an HVAC subsystem thermally connected to a passenger compartment; and a powertrain cooling subsystem thermally connected to a powertrain component.Type: ApplicationFiled: March 8, 2023Publication date: April 4, 2024Inventors: Ki Hyun Kim, Jin Hwan Lee, Wan Je Cho, Jung Ha Park
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Patent number: 11941637Abstract: Disclosed is a method of processing item sales information by an electronic apparatus including acquiring a purchase request including item information related to an item selected by a user and information related to a payment means, providing a purchase response including approval information corresponding to the purchase request before proceeding with payment through the payment means in response to the purchase request when the information related to the payment means satisfies a first condition, transmitting a release request for the item to a first server; and requesting payment for at least some of an amount corresponding to one or more purchase requests related to the payment means according to an arrival of settlement timing corresponding to the payment means.Type: GrantFiled: March 23, 2021Date of Patent: March 26, 2024Assignee: Coupang Corp.Inventors: Zee Young Min, Ki Hyun Jeong, Il Hyun Seo, Hyun Ju Cho, Jin Hwan Kim, Hyun Yong Jung, Min Yong Yuk, Ho Hyun Lim, Jin Hyuk Kim
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Publication number: 20240092060Abstract: Provided is an unconstrained vibration damping metal sheet with foam pores. The unconstrained vibration damping metal sheet of the present invention comprises: a metal sheet; an organic-inorganic pretreatment layer containing an acrylic resin formed on the metal sheet; and a foam resin layer formed on the pretreatment layer, the foam resin layer containing, based on weight % thereof, a thermoplastic polyvinyl chloride resin: 40-80%, a plasticizer: 5-40%, a foaming agent: 0.1-10%, an oxide-based crosslinker: 1-4%, and spherical silica: 1-10%.Type: ApplicationFiled: November 30, 2021Publication date: March 21, 2024Applicant: POSCO Co., LtdInventors: Jin-Tae Kim, Dae-Gyu Kang, Yang-Ho Choi, Jung-Hwan Lee
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Publication number: 20240097061Abstract: The present invention discloses a back contact solar cell. The back contact solar cell includes a semiconductor substrate having a front surface and a rear surface; a first conductive type semiconductor region having a first conductive type and a second conductive type semiconductor region having a second conductive type at an interval on the rear surface of the semiconductor substrate. Furthermore, the rear surface of the semiconductor substrate has a texturing structure at the interval between the first conductive type semiconductor region and the second conductive type semiconductor region.Type: ApplicationFiled: November 7, 2023Publication date: March 21, 2024Inventors: Hwa Nyeon Kim, Ju Hwan Yun, Jong Hwan Kim, Bum Sung Kim, II Hyoung Jung, Jin Ah Kim
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Patent number: 11937476Abstract: A display device comprises a substrate; a circuit array layer comprising pixel drivers, data lines, first dummy lines, and second dummy lines; and a light emitting array layer. The display area comprises middle, first side, and second side regions. The data lines comprise first, second, and third data lines disposed in the middle, first side, and second side regions, respectively. The first dummy lines comprise a first data detour line disposed in the first side region and adjacent to a part of the second data line, and auxiliary lines. The second dummy lines comprise a second data detour line configured to connect the first data detour line to the third data line, and additional lines. The auxiliary lines comprise a bias auxiliary line to which a bias power is applied; and a second power auxiliary line to which a second power is applied.Type: GrantFiled: May 4, 2023Date of Patent: March 19, 2024Assignee: Samsung Display Co., Ltd.Inventors: Jin Sung An, Sung Ho Kim, Yong Jae Kim, Yun Hwan Park, Yoon Jee Shin, Sug Woo Jung, Hyun Wook Choi
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Publication number: 20240083595Abstract: A landing guide system using an energy analysis of a UAM air vehicle is disclosed. A UAM air vehicle consists of a UAM air vehicle landing guide device for guiding a landing by analyzing a movement of the UAM air vehicle in a descent and approach section of the UAM air vehicle to a vertiport, and a remote control terminal that monitors the descent and approach section of the UAM air vehicle in real time through the UAM air vehicle landing guide device. The UAM air vehicle is configured to output a warning for safe descent and access according to a predetermined standard in accordance with the guide of the above UAM air vehicle landing guide device in the descent and approach section.Type: ApplicationFiled: September 15, 2022Publication date: March 14, 2024Applicant: RUDA SYS Co., Ltd.Inventors: Jin Ho KIM, Jl Hwan KIM, Woo Choon MOON
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Patent number: RE49963Abstract: A semiconductor device includes first and second active patterns protruding upward from a substrate, a gate electrode crossing the first and second active patterns and extending in a first direction, a first source/drain region on the first active pattern and on at least one side of the gate electrode, and a second source/drain region on the second active pattern and on at least one side of the gate electrode. The first and second source/drain regions have a conductivity type different from each other, and the second source/drain region has a bottom surface in contact with a top surface of the second active pattern and at a lower level than that of a bottom surface of the first source/drain region in contact with a top surface of the first active pattern. The first active pattern has a first width smaller than a second width of the second active pattern.Type: GrantFiled: January 22, 2021Date of Patent: May 7, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Ki Hwan Kim, Gigwan Park, Junggun You, DongSuk Shin, Jin-Wook Kim