Patents by Inventor Jin Hwan SONG

Jin Hwan SONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package substrate with band stop filter and semiconductor package including the same
    Patent number: 9231286
    Abstract: According to one embodiment, a semiconductor package includes a band stop filter, which includes: a transmission line pattern arranged on a package substrate; and a conductive stub pattern arranged along the transmission line pattern in a state of being separated from the transmission line pattern.
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: January 5, 2016
    Assignee: SK Hynix Inc.
    Inventors: Byung Jun Bang, Sang Joon Lim, Ju Il Eom, Bok Kyu Choi, Jin Hwan Song
  • PACKAGE SUBSTRATE WITH BAND STOP FILTER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
    Publication number: 20140176262
    Abstract: According to one embodiment, a semiconductor package includes a band stop filter, which includes: a transmission line pattern arranged on a package substrate; and a conductive stub pattern arranged along the transmission line pattern in a state of being separated from the transmission line pattern.
    Type: Application
    Filed: May 23, 2013
    Publication date: June 26, 2014
    Inventors: Byung Jun BANG, Sang Joon LIM, Ju Il EOM, Bok Kyu CHOI, Jin Hwan SONG
  • SYSTEM TO TRANSMIT AND RECEIVE WIRELESS POWER, TERMINAL DEVICE, MANAGEMENT SERVER, AND WIRELESS POWER TRANSMISSION APPARATUS
    Publication number: 20110184888
    Abstract: A system to transmit and receive wireless power, a terminal device, a management server, and a wireless power transmission apparatus may use non-radial wireless energy transmission technology to generate a resonant frequency in resonators and charge a device. The terminal device may receive the wireless power to perform charging by non-contact energy transmission.
    Type: Application
    Filed: August 26, 2010
    Publication date: July 28, 2011
    Applicant: PANTECH CO., LTD.
    Inventors: Jeong Man LEE, Seyoung MOON, Jin Hwan SONG, Hyung Jun YOON, Kyu Sun LEE, In Bum LEE, Jae Hun LEE, Zooyoung LEE, Jin Suk LEE, Hyoung Seok LEE, Kyung Kook LIM, Hyukjae CHOI