Abstract: A display device includes a display panel, a filler layer, a reflection control layer, a plurality of light-blocking patterns, and an encapsulation substrate. The low reflection layer is disposed on the display panel. The filler layer is disposed on the display panel. The reflection control layer includes a first catalyst and is disposed on the filler layer. The plurality of light-blocking patterns is disposed between the filler layer and the reflection control layer. The encapsulation substrate is disposed on the reflection control layer.

Abstract: A method for manufacturing a display module includes preparing a display module comprising a plurality of layers and forming a through-hole in the display module. The forming the through-hole includes performing a first irradiation process of irradiating a first laser beam along a first boundary defining the through-hole, performing a second irradiation process of irradiating a second laser beam along a second boundary after the first irradiation process, and performing a third irradiation process of irradiating a third laser beam along a third boundary after the second irradiation process. A time interval between the first irradiation process and the second irradiation process may be different from a time interval between the second irradiation process and the third irradiation process.

Abstract: A semiconductor device includes: at least one signal pad including power metal rings and configured to exchange an input/output signal with an input/output circuit; and a dummy power pad disposed adjacent to the at least one signal pad, wherein the dummy power pad includes a first clamp circuit connected to at least one of the power metal rings.

Abstract: A semiconductor device includes bumps and a plurality of input/output areas on a substrate. Each of the input/output areas include semiconductor elements on the substrate, lower wiring patterns connected to the semiconductor elements, and input/output pins above and connected to the lower wiring patterns. The semiconductor elements provide a logic circuit and a protection circuit. The bumps are above the lower wiring patterns and connected to the input/output pins by upper wiring patterns. The input/output areas include a first input/output area and a second input/output area. The input/output areas includes a first circuit area including the electrostatic discharge protection circuit and a second circuit area including the logic circuit. In the first input/output area, the input/output pin is in the first circuit area. In the second input/output area, the input/output pin is in the second circuit area.

Abstract: A method for manufacturing a display module includes preparing a display module comprising a plurality of layers and forming a through-hole in the display module. The forming the through-hole includes performing a first irradiation process of irradiating a first laser beam along a first boundary defining the through-hole, performing a second irradiation process of irradiating a second laser beam along a second boundary after the first irradiation process, and performing a third irradiation process of irradiating a third laser beam along a third boundary after the second irradiation process. A time interval between the first irradiation process and the second irradiation process may be different from a time interval between the second irradiation process and the third irradiation process.

Abstract: A method for manufacturing a display module includes preparing a display module comprising a plurality of layers and forming a through-hole in the display module. The forming the through-hole includes performing a first irradiation process of irradiating a first laser beam along a first boundary defining the through-hole, performing a second irradiation process of irradiating a second laser beam along a second boundary after the first irradiation process, and performing a third irradiation process of irradiating a third laser beam along a third boundary after the second irradiation process. A time interval between the first irradiation process and the second irradiation process may be different from a time interval between the second irradiation process and the third irradiation process.

Abstract: A semiconductor device includes bumps and a plurality of input/output areas on a substrate. Each of the input/output areas include semiconductor elements on the substrate, lower wiring patterns connected to the semiconductor elements, and input/output pins above and connected to the lower wiring patterns. The semiconductor elements provide a logic circuit and a protection circuit. The bumps are above the lower wiring patterns and connected to the input/output pins by upper wiring patterns. The input/output areas include a first input/output area and a second input/output area. The input/output areas includes a first circuit area including the electrostatic discharge protection circuit and a second circuit area including the logic circuit. In the first input/output area, the input/output pin is in the first circuit area. In the second input/output area, the input/output pin is in the second circuit area.

Abstract: A semiconductor device includes a substrate, input/output areas in a first direction and a second direction, parallel to an upper surface of the substrate and intersecting to each other, the input/output areas each including semiconductor elements providing an input/output circuit, lower wiring patterns connected to the semiconductor elements, and input/output pins connected to the lower wiring patterns, and bumps connected to the input/output pins by upper wiring patterns on the same layer as the input/output pins. The input/output areas include a first input/output area and a second input/output area, and each of the first input/output area and the second input/output area includes a first area and a second area sequentially in the first direction, and in the first input/output area, the input/output pin is in the first area, and in the second input/output area, the input/output pin is in the second area.

Abstract: A method for testing a display module may include providing light to the display module, obtaining an image of the display module, measuring a first center of a hole in the display module, measuring a first distance from the first center to an edge of the hole, measuring a second center of a closed line formed by a signal line of the display module, measuring a second distance from the second center to the signal line, calculating a third distance between the first center and the second center, and comparing the second distance with a sum of the first distance and the third distance.

Abstract: In a method for manufacturing a display device, the method includes: providing a display panel divided into a cutting area and a body part surrounding the cutting area; attaching a dummy film on a bottom surface of the display panel; cutting the cutting area by irradiating laser light toward a cutting line defined as a boundary between the cutting area and the body part; irradiating the laser light to a groove line of the dummy film, which overlaps the cutting line, to define a groove in the dummy film along the groove line; and separating the dummy film from the body part.

Abstract: A method for manufacturing a display module includes preparing a display module comprising a plurality of layers and forming a through-hole in the display module. The forming the through-hole includes performing a first irradiation process of irradiating a first laser beam along a first boundary defining the through-hole, performing a second irradiation process of irradiating a second laser beam along a second boundary after the first irradiation process, and performing a third irradiation process of irradiating a third laser beam along a third boundary after the second irradiation process. A time interval between the first irradiation process and the second irradiation process may be different from a time interval between the second irradiation process and the third irradiation process.

Abstract: A method for testing a display module may include providing light to the display module, obtaining an image of the display module, measuring a first center of a hole in the display module, measuring a first distance from the first center to an edge of the hole, measuring a second center of a closed line formed by a signal line of the display module, measuring a second distance from the second center to the signal line, calculating a third distance between the first center and the second center, and comparing the second distance with a sum of the first distance and the third distance.

Abstract: In a method for manufacturing a display device, the method includes: providing a display panel divided into a cutting area and a body part surrounding the cutting area; attaching a dummy film on a bottom surface of the display panel; cutting the cutting area by irradiating laser light toward a cutting line defined as a boundary between the cutting area and the body part; irradiating the laser light to a groove line of the dummy film, which overlaps the cutting line, to define a groove in the dummy film along the groove line; and separating the dummy film from the body part.

Abstract: Disclosed is a solid oxide fuel cell system with enhanced thermal efficiency. Accordingly, provided is a solid oxide fuel cell system with enhanced thermal efficiency, which is capable of heating and using fuel, air, or water supplied to a hot box at a room temperature by a heat exchanger in the hot box and minimizing heat discharged to the outside of the hot box.

Abstract: Disclosed is a boiler system using a fuel cell including a boiler installed in a home, a building, or the like, a fuel cell for generating electricity and reaction heat by electrochemical reaction between a fuel and oxygen, a storage tank for recovering and storing the reaction heat generated by the fuel cell with a fluid, a room heating line buried beneath a room floor of the home, the building, or the like, a warm water line connected to supply warm water to a washroom or a kitchen of the home or the building through the boiler or the storage tank when water is supplied thereto from the outside, and a suction and exhaust integrated pipe having at least two of at least one first exhaust line, at least one first suction line of the boiler, at least one second exhaust line, and at least one second suction line of the fuel cell connected thereto to be used in common.