Patents by Inventor Jin Hyuk Cho

Jin Hyuk Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120224
    Abstract: A semiconductor manufacturing equipment may include a process chamber for treating a substrate; a front-end module including a first transfer robot, wherein the first transfer robot may be configured to transport the substrate received in a container; a transfer chamber between the front-end module and the process chamber, wherein the transfer chamber may be configured to load or unload the substrate into or out of the process chamber; and a cassette capable of receiving a replaceable component capable of being used in the process chamber. The front-end module may include a seat plate configured to move in a sliding manner so as to retract or extend into or from the front-end module. The cassette may be configured to be loaded into the front-end module while the cassette is seated on the seat plate.
    Type: Application
    Filed: September 12, 2023
    Publication date: April 11, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jin Hyuk CHOI, Beom Soo HWANG, Kong Woo LEE, Myung Ki SONG, Ja-Yul KIM, Kyu Sang LEE, Hyun Joo JEON, Nam Young CHO
  • Patent number: 11941637
    Abstract: Disclosed is a method of processing item sales information by an electronic apparatus including acquiring a purchase request including item information related to an item selected by a user and information related to a payment means, providing a purchase response including approval information corresponding to the purchase request before proceeding with payment through the payment means in response to the purchase request when the information related to the payment means satisfies a first condition, transmitting a release request for the item to a first server; and requesting payment for at least some of an amount corresponding to one or more purchase requests related to the payment means according to an arrival of settlement timing corresponding to the payment means.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: March 26, 2024
    Assignee: Coupang Corp.
    Inventors: Zee Young Min, Ki Hyun Jeong, Il Hyun Seo, Hyun Ju Cho, Jin Hwan Kim, Hyun Yong Jung, Min Yong Yuk, Ho Hyun Lim, Jin Hyuk Kim
  • Publication number: 20240001348
    Abstract: The present invention relates to a ternary catalyst for carbon dioxide reduction, the catalyst including Au and Cu, and further including In or Mo, wherein the content of In or Mo is 0.1 at % to 3 at %.
    Type: Application
    Filed: November 19, 2021
    Publication date: January 4, 2024
    Applicant: LOTTE CHEMICAL CORPORATION
    Inventors: Myung Gi Seo, Sang Sun Park, Eo Jin Lee, Seung Hee Kang, Hyung Ki Min, Jin Hyuk Cho, Sung Hyun Hong, Soo Young Kim, Sang Hyun Ahn
  • Publication number: 20240003026
    Abstract: The present invention relates to: a carbon dioxide reduction catalyst comprising a modified ZIF (zeolitic imidazolate framework)-based compound in which copper (Cu) is doped on a ZIF-based compound having a structure in which zinc (Zn) and an imidazole-based organic material are bound; and a carbon dioxide reduction electrode comprising same.
    Type: Application
    Filed: December 3, 2021
    Publication date: January 4, 2024
    Applicant: LOTTE CHEMICAL CORPORATION
    Inventors: Sang Sun Park, Myung Gi Seo, Sung Joon Park, Seon He Kang, Hyung Ki Min, Jin Hyuk Cho, Sung Hyun Hong, Soo Young Kim, Sang Hyun Ahn