Patents by Inventor Jin Hyun JEON

Jin Hyun JEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240163466
    Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. Coding decision information of a representative channel of a target block is shared as coding decision information of a target channel of the target block, and decoding of the target block is performed using the coding decision information of the target channel. Since the coding decision information of the representative channel is shared with an additional channel, repeated signaling of identical coding decision information may be prevented. By means of this prevention, the efficiency of encoding and decoding of the target block or the like may be improved.
    Type: Application
    Filed: December 27, 2023
    Publication date: May 16, 2024
    Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, RESEARCH AND BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Dong-San JUN, Jung-Won Kang, Hyunsuk Ko, Sung-Chang Lim, Jin-Ho Lee, Ha-Hyun Lee, Byeung-Woo Jeon, Hui-Yong Kim, Jee-Yoon Park
  • Patent number: 11984264
    Abstract: A multilayer electronic component includes: a body including a capacitance forming portion in which dielectric layers and internal electrodes are alternately disposed in a first direction, and cover portions disposed on an upper surface and a lower surface of the capacitance forming portion, respectively, in the first direction; and external electrodes disposed on the body, wherein the cover portion includes a plurality of dielectric grains and a plurality of pores, and Gn/Pn is more than 10 and less than 30, in which Gn is the number of dielectric grains included in the cover portion and Pn is the number of pores included in the cover portion.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: May 14, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Bok Shin, Yu Ra Shin, Seung Yong Lee, Jung Hyun An, Yong Hwa Lee, Da Hyeon Go, Choong Seop Jeon, Min Soo Kim
  • Patent number: 11974469
    Abstract: Disclosed is a display device and a method of manufacturing the same having improved reliability. In the display device, at least one of a plurality of dielectric films disposed between an oxide semiconductor layer and a light-emitting device includes a lower region disposed on the oxide semiconductor layer and an upper region disposed on the lower region, the upper region including a trap element configured to trap hydrogen, whereby reliability of a thin film transistor including the oxide semiconductor layer is improved.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: April 30, 2024
    Assignee: LG Display Co., Ltd.
    Inventors: Jae Hyun Kim, Jin Chae Jeon, Sun Young Choi, Mi Jin Jeong, Jeoung In Lee
  • Publication number: 20240128022
    Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.
    Type: Application
    Filed: December 6, 2023
    Publication date: April 18, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Kim, Chang Hak Choi, Seok Hyun Yoon, Ki Yong Lee, Jong Myeong Jeon
  • Publication number: 20240073416
    Abstract: The present invention relates to an apparatus and method for encoding and decoding an image by skip encoding. The image-encoding method by skip encoding, which performs intra-prediction, comprises: performing a filtering operation on the signal which is reconstructed prior to an encoding object signal in an encoding object image; using the filtered reconstructed signal to generate a prediction signal for the encoding object signal; setting the generated prediction signal as a reconstruction signal for the encoding object signal; and not encoding the residual signal which can be generated on the basis of the difference between the encoding object signal and the prediction signal, thereby performing skip encoding on the encoding object signal.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicants: Electronics and Telecommunications Research Institute, Kwangwoon University Industry-Academic Collaboration Foundation, Universily-lndustry Cooperation Group of Kyung Hee University
    Inventors: Sung Chang LIM, Ha Hyun LEE, Se Yoon JEONG, Hui Yong KIM, Suk Hee CHO, Jong Ho KIM, Jin Ho LEE, Jin Soo CHOI, Jin Woong KIM, Chie Teuk AHN, Dong Gyu SIM, Seoung Jun OH, Gwang Hoon PARK, Sea Nae PARK, Chan Woong JEON
  • Patent number: 11655923
    Abstract: A pipe coupler is capable of preventing a fluid flowing along pipes from coming into direct contact with the pipes made of metal materials, a body, and tie rings, thereby preventing corrosion of the pipes. The pipe coupler is also capable of preventing pipes, even if the pipes made of different kinds of materials are connected, from being indirectly connected to each other by way of a fluid flowing along the inside of the pipes, thereby preventing electric corrosion of the pipes caused by the micro current contained in the fluid. The pipe coupler is also capable of absorbing dimensional differences between the pipes having different sizes.
    Type: Grant
    Filed: July 2, 2019
    Date of Patent: May 23, 2023
    Assignee: JUNSUNGENC CO., LTD.
    Inventors: Jun Woo Park, Sung Woo Park, Jae Won Choe, Sang Won Kwon, Young Bum Son, Jin Hyun Jeon
  • Publication number: 20210317936
    Abstract: The present invention relates to a pipe coupler that is capable of avoiding a fluid flowing along pipes from coming into direct contact with the pipes made of metal materials, a body, and tie rings, thereby preventing their corrosion, avoiding pipes, even if the pipes made of different kinds of materials are connected, from being indirectly connected to each other by means of a fluid flowing along the insides thereof, thereby preventing electric corrosion caused by the micro current contained in the fluid, and absorbing a dimensional tolerance between the pipes having different sizes, thereby ensuring simple installation.
    Type: Application
    Filed: July 2, 2019
    Publication date: October 14, 2021
    Inventors: Jun Woo PARK, Sung Woo PARK, Jae Won CHOE, Sang Won KWON, Young Bum SON, Jin Hyun JEON