Patents by Inventor Jin-Ji Shen

Jin-Ji Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding pad with separate bonding and probing areas
    Patent number: 6765228
    Abstract: A new and improved bonding pad having separate areas for probe needle contact and wire bonding in semiconductor packaging technology. The bonding pad typically has a generally elongated, rectangular configuration with a wire bonding area at one end and a probe needle contact area at the other end of the pad. At least one notch mark may be provided on or adjacent to the bonding pad between the wire bonding area and the probe needle contact area for demarcating these areas during chip production.
    Type: Grant
    Filed: October 11, 2002
    Date of Patent: July 20, 2004
    Assignee: Taiwan Semiconductor Maunfacturing Co., Ltd.
    Inventors: Kuan-Min Lin, Jin-Ji Shen
  • Bonding pad with separate bonding and probing areas
    Publication number: 20040069988
    Abstract: A new and improved bonding pad having separate areas for probe needle contact and wire bonding in semiconductor packaging technology. The bonding pad typically has a generally elongated, rectangular configuration with a wire bonding area at one end and a probe needle contact area at the other end of the pad. At least one notch mark may be provided on or adjacent to the bonding pad between the wire bonding area and the probe needle contact area for demarcating these areas during chip production.
    Type: Application
    Filed: October 11, 2002
    Publication date: April 15, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co. Ltd.
    Inventors: Kuan-Min Lin, Jin-Ji Shen