Patents by Inventor Jin JISONG

Jin JISONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11508726
    Abstract: A semiconductor structure and a method for forming the same are provided.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: November 22, 2022
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
    Inventor: Jin Jisong
  • Patent number: 11309183
    Abstract: A semiconductor structure and a forming method thereof are provided.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: April 19, 2022
    Assignees: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventor: Jin Jisong
  • Publication number: 20210183701
    Abstract: A semiconductor structure and a method for forming the same are provided.
    Type: Application
    Filed: March 2, 2021
    Publication date: June 17, 2021
    Applicants: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventor: Jin JISONG
  • Publication number: 20210175080
    Abstract: A semiconductor structure and a forming method thereof are provided.
    Type: Application
    Filed: April 30, 2020
    Publication date: June 10, 2021
    Applicants: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventor: Jin JISONG
  • Patent number: 11011416
    Abstract: A semiconductor structure and a method for forming a semiconductor structure are provided.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: May 18, 2021
    Assignees: Semiconductor Manufacturing (Shanghai) International Corporation, Semiconductor Manufacturing (Beijing) International Corporation
    Inventor: Jin Jisong
  • Patent number: 11011608
    Abstract: A semiconductor structure and a method for forming the same are provided.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: May 18, 2021
    Assignees: Semiconductor Manufacturing (Shanghai) International Corporation, Semiconductor Manufacturing (Beijing) International Corporation
    Inventor: Jin Jisong
  • Patent number: 10991596
    Abstract: A semiconductor structure and a method for forming the same are provided.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: April 27, 2021
    Assignees: Semiconductor Manufacturing (Shanghai) International Corporation, Semiconductor Manufacturing (Beijing) International Corporation
    Inventor: Jin Jisong
  • Patent number: 10964593
    Abstract: A semiconductor structure and a method for forming the same are provided.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: March 30, 2021
    Assignees: Semiconductor Manufacturing (Shanghai) International Corporation, Semiconductor Manufacturing (Beijing) International Corporation
    Inventor: Jin Jisong
  • Publication number: 20200343348
    Abstract: A semiconductor structure and a method for forming the same are provided.
    Type: Application
    Filed: August 2, 2019
    Publication date: October 29, 2020
    Applicants: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventor: Jin JISONG
  • Publication number: 20200343132
    Abstract: A semiconductor structure and a method for forming a semiconductor structure are provided.
    Type: Application
    Filed: August 2, 2019
    Publication date: October 29, 2020
    Applicants: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventor: Jin JISONG
  • Publication number: 20200343138
    Abstract: A semiconductor structure and a method for forming the same are provided.
    Type: Application
    Filed: August 9, 2019
    Publication date: October 29, 2020
    Applicants: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventor: Jin JISONG
  • Publication number: 20200251348
    Abstract: A semiconductor structure and a method for forming the same are provided.
    Type: Application
    Filed: August 9, 2019
    Publication date: August 6, 2020
    Applicants: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventor: Jin JISONG