Patents by Inventor JIN-JUN RAO

JIN-JUN RAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110048679
    Abstract: A heat dissipation apparatus includes a flat heat pipe and a plurality of fins stacked together. Each fin defines a substantially rectangular-shaped receiving hole therein for receiving a condenser section of the flat heat pipe and a small-sized accommodating hole therein for accommodating a solder paste. A combining sidewall extends from an edge of the receiving hole, and includes elongated top and bottom planar plates, and a short plate extending from one end of the bottom planar plate towards the top planar plate. The accommodating hole is located at a junction of the top planar plate and the short plate. The solder paste accommodated in the accommodating hole is melted to flow into the receiving hole to fill up a clearance between the flat heat pipe and the combining sidewall to combine the flat heat pipe and the fins together.
    Type: Application
    Filed: October 19, 2009
    Publication date: March 3, 2011
    Applicants: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: YI-SHIH HSIEH, JIN-JUN RAO
  • Publication number: 20090133855
    Abstract: A heat dissipation device includes a heat pipe having a condenser section and a layer of solid-state solder film on an exterior surface of the condenser section, a heat sink having a plurality of spaced fins, each of which has an aperture. The condenser section of the heat pipe fits into the apertures of the fins. The heat sink with the condensing section received therein is heated and the solid-state solder film melts, filling gaps between the heat pipe and the fins. A method of assembling the device is also provided.
    Type: Application
    Filed: November 19, 2008
    Publication date: May 28, 2009
    Applicants: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: YI-SHIH HSIEH, JIN-JUN RAO