Abstract: Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.

Abstract: A contact pin for a test socket is provided in the test socket for testing the electrical characteristics of a semiconductor device. The contact pin includes an elastic part elastically deformable in the longitudinal direction of the contact pin; a first contact part which includes a first support part extending from one end of the elastic part and a first contact tip connected to an end of the first support part; and a second contact part which includes a second support part extending from the other end of the elastic part and a second contact tip connected to an end of the second support part, where the elastic part and the second contact part are bent in at least one direction with respect to the first contact part.

Abstract: Disclosed is a cable adaptor which is connected to a cable including an outer conductor. The adaptor includes a contact pin which comes into contact with a signal pin of the cable, a first member which is conductive and disposed inside and coupled to the contact pin, a second member disposed outside and coupled to the contact pin, and a third member which is conductive and disposed outside the second member. Here, the contact pin includes a first body coupled to the second member, a first contact portion which is conductive and extends from one side of the first body to come into contact with the signal pin, and a second contact portion which extends from the other side of the first body and comes into contact with an object being tested. The third member includes a second body coupled to the second member and a third contact portion.

Abstract: Disclosed is a cable adaptor comprising a first member which is conductive and comes into contact with a signal pin of the cable, a second member disposed outside the first member and coupled to the first member, a third member which is conductive and disposed outside the second member, and a contact pin fixed to the first member. Here, the first member includes a first body coupled to the second member and a first contact portion which extends from the first body and comes into contact with the signal pin. The third member includes a second body coupled to the second member and a second contact portion which extends from the second body and comes into contact with the outer conductor. A plurality of first contact points of the signal pin and the first contact portion are arranged at same intervals along a circumferential direction of the signal pin.

Abstract: Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.

Abstract: There is provided a probe pin for performing an electrical inspection between a contact pad of a test apparatus and a conductive ball of a semiconductor device, the probe pin including a cylinder-type bottom plunger connected to the contact pad and configured to slide vertically, a piston-type top plunger connected to the conductive ball and configured to slide vertically, and an outer spring configured to provide an elastic force between the bottom plunger and the top plunger. According to the configuration of the present invention, it is possible to perform a stable inspection process by using the outer spring despite pin miniaturization.

Abstract: A three-layer micro electro mechanical system (MEMS) spring pin includes a lower-layer spring pin in which a lower-layer wave is disposed between and connected to a lower-layer top plunger and a lower-layer bottom plunger, an upper-layer spring pin in which an upper-layer wave is disposed between and connected to an upper-layer top plunger and an upper-layer bottom plunger, a middle-layer top tip interposed between the upper-layer top plunger and the lower-layer top plunger, and a middle-layer bottom tip interposed between the upper-layer bottom plunger and the lower-layer bottom plunger. According to the above-described structure, effects are expected in which bending is prevented, a stroke is stabilized due to the multi-layer spring, and contact characteristics are enhanced due to the multi-layer plunger.

Abstract: A microelectromechanical system (MEMS) film for a test socket is arranged between a semiconductor device and a test apparatus for performing an electrical test of the semiconductor device and includes a flexible bare film and a plurality of round-type MEMS bumps on the bare film, each of the MEMS bumps being formed on the bare film by using a MEMS processing technique, having an electrical contact with an electrode pad of the test apparatus or a conductive ball of the semiconductor device, and having a contact surface rounded from an edge side toward a center side in a convex manner in a direction toward the electrode pad or the conductive ball.

Abstract: A method of manufacturing a test socket includes preparing a printed circuit board (PCB) on which a bonding pad is disposed, bonding a conductive wire on the bonding pad, mounting, on an upper surface of the PCB, a space through which the bonding pad is exposed, mounting, on an upper surface of the space, a base through which the bonding pad is exposed, mounting, on an upper surface of the base, a jig which covers the bonding pad, and injecting a liquid silicone rubber into a jig assembly by using the jig assembly as a mold, the jig assembly including the PCB, the space, the base, and the jig.

Abstract: A microelectromechanical system (MEMS) film for a test socket is arranged between a semiconductor device and a test apparatus for performing an electrical test of the semiconductor device and includes a flexible bare film and a plurality of round-type MEMS bumps on the bare film, each of the MEMS bumps being formed on the bare film by using a MEMS processing technique, having an electrical contact with an electrode pad of the test apparatus or a conductive ball of the semiconductor device, and having a contact surface rounded from an edge side toward a center side in a convex manner in a direction toward the electrode pad or the conductive ball.

Abstract: An inspecting method using an electro-optical detecting device is disclosed. The electro-optical detecting device includes: an upper substrate and a lower substrate; a nematic liquid crystal layer interposed between the upper substrate and the lower substrate; a transparent electrode interposed between the nematic liquid crystal layer and the upper substrate, the transparent electrode connected to a device under test (DUT) via a power supply; a polarizing plate located over the nematic liquid crystal layer; and a reflecting plate located under the nematic liquid crystal layer.

Abstract: An electro-optical detecting device is disclosed. The electro-optical detecting device includes: an upper substrate and a lower substrate; a nematic liquid crystal layer interposed between the upper substrate and the lower substrate; a transparent electrode interposed between the nematic liquid crystal layer and the upper substrate, the transparent electrode connected to a device under test (DUT) via a power supply; a polarizing plate located over the nematic liquid crystal layer; and a reflecting plate located under the nematic liquid crystal layer. A method using the electro-optical detecting device includes applying a voltage between the transparent electrode and the BUT to generate an electric field across the liquid crystal layer; illuminating the detector and capturing an image of the detector using the light reflected from the detector: and determining the DUT has some defects from the image of the detector by an abnormal electric field generated between the transparent electrode and the DUT.

Abstract: An inspecting method using an electro-optical detecting device is disclosed. The electro-optical detecting device includes: an upper substrate and a lower substrate; a nematic liquid crystal layer interposed between the upper substrate and the lower substrate; a transparent electrode interposed between the nematic liquid crystal layer and the upper substrate, the transparent electrode connected to a device under test (DUT) via a power supply; a polarizing plate located over the nematic liquid crystal layer; and a reflecting plate located under the nematic liquid crystal layer.