Abstract: Disclosed are a connector, a connector system, and a connector mating method, and more particularly a technology for, during mating between connectors, a plurality of parts of a terminal being bent by pressing of a terminal and a partition wall of a mating connector, thereby forming multiple contact points and a technology for selectively determining the type of the connector through the combination and arrangement relationship of lead frame assemblies.

Abstract: A connector assembly having a receptacle connector and a plug connector coupled thereto. The plug connector includes: a signal pin having one side in electrical contact with a signal line of a cable and the other side in elastic contact with a clip pin of the receptacle connector; a shield can enclosing the signal pin; a first insulating member coupled to the signal pin; and a plug shell enclosing an upper surface and a side surface of the shield can. The receptacle connector includes: a clip pin having a lower portion contacting a signal pad of a circuit board and an upper portion in elastic contact with the other side of the signal pin; a receptacle base installed on the circuit board and providing a space for the clip pin; and a second insulating member coupled to the clip pin and enclosing the side surfaces of the clip pin.

Abstract: A pogo pin whose elastic force can be adjusted according to a contacting direction is disclosed. According to an aspect of the present invention, provided is a pogo pin with adjustable elastic force, including: a housing; plunger pins mounted on ends of the housing to directly contact a measurement object; and a spring installed inside the housing to provide elastic force so that the plunger pin contacts the measurement object, wherein a local fixing part protruding inward is formed on one side of the housing so that a first position of the spring can be pressed and fixed.

Abstract: A plug connector according to the present invention is a plug connector coupled to a receptacle connector, the plug connector comprising: a conductor for signals; a ring-shaped conductor for ground, the conductor surrounding the conductor for signals; a ring-shaped insulator surrounding the conductor for signals and being surrounded by the conductor for ground, and insulating between the conductor for signals and the conductor for ground; a lower body; and an upper body coupled onto the lower body, wherein the conductor for signals includes a lower portion protruding below a first portion on the insulator, a middle portion inserted into a hollow portion of the first portion, and an upper portion protruding above the first portion, and the conductor for ground includes a lower portion protruding below the first portion and an upper portion surrounding the first portion, and the lower body includes a lower housing having a hollow portion that is vertically opened, wherein the upper portion of the conductor for

Abstract: A semiconductor test apparatus is disclosed. The semiconductor test apparatus according to an aspect of the present disclosure may include a housing; a substrate disposed on a lower side of the housing; a plurality of contact pins mounted on the substrate; a soldering part configured to fix the plurality of contact pins to the substrate; and a cover part configured to surround the soldering part.

Abstract: A test socket is provided. According to an aspect of the present invention, provided is a test socket energizably connected to a semiconductor device to electrically test the semiconductor device, the test socket including a base on which a seating part on which the semiconductor device is seated is formed and a test pin protruding from the seating part in one direction, the test pin contactable with a conductive part of the semiconductor device; a cover capable of reciprocating a first position located at an end of the base in one direction and a second position located apart from the first position in the one direction; and a support member coupled to the base and supporting an outer surface of the cover.

Abstract: A contact pin for a test socket is provided in the test socket for testing the electrical characteristics of a semiconductor device. The contact pin includes an elastic part elastically deformable in the longitudinal direction of the contact pin; a first contact part which includes a first support part extending from one end of the elastic part and a first contact tip connected to an end of the first support part; and a second contact part which includes a second support part extending from the other end of the elastic part and a second contact tip connected to an end of the second support part, where the elastic part and the second contact part are bent in at least one direction with respect to the first contact part.

Abstract: Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.

Abstract: A test socket for testing the electrical characteristics of a semiconductor device provides a test socket, including a housing in which a plurality of first through holes are formed; a cover in which a plurality of second through holes are formed; and a plurality of contact pins inserted into the plurality of first and second through holes, wherein the plurality of contact pins include an elastic part capable of elastic deformation in the longitudinal direction; a first contact part comprising: a first support part extending from one end of the elastic part, a stroke part connected to an end of the first support part and movable in the longitudinal direction, and a first contact tip connected to an end of the stroke part and exposed in the first through hole.

Abstract: A test connector tests the electrical characteristics of a semiconductor device, the test connector including a housing; a plurality of wafers having a plurality of coupling parts arranged at regular intervals on one side and stacked standing upright on the housing; a guide part having a width smaller than that of the plurality of coupling parts and arranged on one surface of the plurality of coupling parts; connector pins provided on both sides of the guide part, wherein the guide part includes a first introduction portion and a second introduction portion inclined in the center direction on both sides of an end thereof and the positions of the first introduction portion and the second introduction portion are different.

Abstract: A connector assembly according to the present invention comprises a receptacle connector and a plug connector vertically coupled to the receptacle connector, the plug connector including: a signal pin having one side in electrical contact with a signal line of a cable and the other side in elastic contact with a clip pin of the receptacle connector; a shield can formed to enclose the signal pin such that the other side of the signal pin is exposed downwards and to be electrically spaced apart from the signal pin; a first insulating member coupled to the signal pin to insulate between the signal pin and the shield can; and a plug shell which has an open lower portion and encloses an upper surface and a side surface of the shield can to expose the other side of the signal pin downwards, the receptacle connector including: a clip pin which has a lower portion in contact with a signal pad of a circuit board and an upper portion in elastic contact with the other side of the signal pin; a receptacle base which is f

Abstract: Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.

Abstract: Disclosed is a cable adaptor comprising a first member which is conductive and comes into contact with a signal pin of the cable, a second member disposed outside the first member and coupled to the first member, a third member which is conductive and disposed outside the second member, and a contact pin fixed to the first member. Here, the first member includes a first body coupled to the second member and a first contact portion which extends from the first body and comes into contact with the signal pin. The third member includes a second body coupled to the second member and a second contact portion which extends from the second body and comes into contact with the outer conductor. A plurality of first contact points of the signal pin and the first contact portion are arranged at same intervals along a circumferential direction of the signal pin.

Abstract: The connector assembly, according to the present invention, comprises: a receptacle arranged on a substrate; and a plug coupled to the receptacle, wherein the plug includes: a pin having one side electrically connected to a cable and having a contact portion arranged on the other side; a dielectric arranged on the outside of the pin; a shield can arranged on the outside of the dielectric; and a plug shell arranged on the outside of the shield can, wherein the receptacle comprises a first hole, the dielectric comprises a second hole in which the pin is arranged, the pin is arranged in the second hole such that the contact portion protrudes farther than the outer surface of the dielectric, and the dielectric is positioned in the first hole so that the contact portion is directly and elastically in contact with a contact point of the substrate.

Abstract: Disclosed is a cable adaptor which is connected to a cable including an outer conductor. The adaptor includes a contact pin which comes into contact with a signal pin of the cable, a first member which is conductive and disposed inside and coupled to the contact pin, a second member disposed outside and coupled to the contact pin, and a third member which is conductive and disposed outside the second member. Here, the contact pin includes a first body coupled to the second member, a first contact portion which is conductive and extends from one side of the first body to come into contact with the signal pin, and a second contact portion which extends from the other side of the first body and comes into contact with an object being tested. The third member includes a second body coupled to the second member and a third contact portion.

Abstract: A pogo pin whose elastic force can be adjusted according to a contacting direction is disclosed. According to an aspect of the present invention, provided is a pogo pin with adjustable elastic force, including: a housing; plunger pins mounted on ends of the housing to directly contact a measurement object; and a spring installed inside the housing to provide elastic force so that the plunger pin contacts the measurement object, wherein a local fixing part protruding inward is formed on one side of the housing so that a first position of the spring can be pressed and fixed.

Abstract: Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.

Abstract: A plug connector coupled to a receptacle connector is presented, comprising: a conductor for signals; a ring-shaped conductor for ground, the conductor for ground surrounding the conductor for signals; a ring-shaped insulator surrounding the conductor for signals and being surrounded by the conductor for ground, and insulating between the conductor for signals and the conductor for ground; a lower body; and an upper body coupled onto the lower body. The conductor for signals includes a lower portion protruding below a first portion of the top of the insulator, a middle portion inserted into a hollow portion of the first portion, and an upper portion protruding above the first portion. The conductor for ground includes a lower portion protruding below the first portion and an upper portion surrounding the first portion. The lower body includes a lower housing, such that the upper portion is accommodated in the hollow portion.

Abstract: A test socket is provided. According to an aspect of the present invention, provided is a test socket energizably connected to a semiconductor device to electrically test the semiconductor device, the test socket including a base on which a seating part on which the semiconductor device is seated is formed and a test pin protruding from the seating part in one direction, the test pin contactable with a conductive part of the semiconductor device; a cover capable of reciprocating a first position located at an end of the base in one direction and a second position located apart from the first position in the one direction; and a support member coupled to the base and supporting an outer surface of the cover.

Abstract: Provided is a magnetic collet. The magnetic collet includes adsorption rubber including a plurality of individual holes passing therethrough from a contact surface, which is one surface of the adsorption rubber, coming into contact with a semiconductor chip to the other surface thereof, and a metal plate including a common hole which passes therethrough from one surface of the metal plate to the other surface thereof and provides a common passage connected to the individual holes and stacked on the adsorption rubber.