Abstract: In some examples, the system may include a parametric system matrix coupled one or more test and measurement instruments. Also, the system may include an adapter circuit coupled to the parametric system matrix, the adapter circuit having a voltage clamping circuit coupled to the parametric system matrix. Furthermore, the system may include a probe circuit coupled to the adapter circuit and to the power device, where the power device is disposed on a wafer.

Abstract: Methods and systems of testing microelectromechanical (MEMS) devices are disclosed. A method includes mechanically coupling a wafer including MEMS devices to a test system and electrically coupling one of the MEMS devices through a probe card to a pulse measure unit (PMU) of the test system. The method includes driving, through the PMU, drive nodes of the MEMS device with an applied time-varying electrical signal to cause a resonance condition of the MEMS device, and sensing, through the PMU, an electrical signal generated across sense nodes of the MEMS device responsive to the resonance condition. A resonance frequency and quality factor of the MEMS device are determined based on the sensed electrical signals across the sense nodes of the MEMS device, and whether the MEMS device passes a quality factor test is made based on the calculated quality factor.

Abstract: An apparatus for testing a DUT includes a pulsed signal source; a hard current-limiter adapted to be operated in series relationship between the pulsed signal source and the DUT; and a voltage sensor adapted to sense a voltage across the DUT in response to the pulsed signal source.