Patents by Inventor JIN KWEON CHUNG

JIN KWEON CHUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor light emitting element package including solder bump
    Patent number: 10361351
    Abstract: A semiconductor light-emitting diode (LED) package is provided and includes a semiconductor LED chip having a surface on which a first electrode and a second electrode are formed; a first solder bump formed on the first electrode and a second solder bump formed on the second electrode, the first solder bump and the second solder bump protruding from the surface of the semiconductor LED chip; and a resin layer having a bottom portion that surrounds a first side surface of the first solder bump and a second side surface of the second solder bump and covers the surface of the semiconductor LED chip.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: July 23, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang Hoon Kwak, Sung Jin Ahn, Hak Hwan Kim, Jin Hwan Kim, Jin Kweon Chung, Min Jung Kim
  • SEMICONDUCTOR LIGHT EMITTING ELEMENT PACKAGE INCLUDING SOLDER BUMP
    Publication number: 20190067539
    Abstract: A semiconductor light-emitting diode (LED) package is provided and includes a semiconductor LED chip having a surface on which a first electrode and a second electrode are formed; a first solder bump formed on the first electrode and a second solder bump formed on the second electrode, the first solder bump and the second solder bump protruding from the surface of the semiconductor LED chip; and a resin layer having a bottom portion that surrounds a first side surface of the first solder bump and a second side surface of the second solder bump and covers the surface of the semiconductor LED chip.
    Type: Application
    Filed: March 15, 2018
    Publication date: February 28, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: CHANG HOON KWAK, SUNG JIN AHN, HAK HWAN KIM, JIN HWAN KIM, JIN KWEON CHUNG, MIN JUNG KIM