Abstract: The present invention provides a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition includes a mixture of two or more siloxane polymers having different dissolution rates with respect to an aqueous solution of tetramethylammonium hydroxide. The composition keeps high transparency and high sensitivity, which are advantages of a composition containing a siloxane polymer, and has excellent chemical resistance, thereby providing a cured film having excellent stability in a post-processing.

Abstract: The present invention relates to a long hole saw for a composite material insulation panel for easily cutting a steel sheet of a hard material and a heat insulator such as Styrofoam or urethane of a soft material in one direction, wherein it is possible to reduce shaking vibrations generated during the cutting and to easily, precisely, and stably drill holes when drilling holes for the installation of pipes, conduits, etc. into a composite material insulation panel used for wall or roof construction of a building.

Abstract: The present invention provides a photosensitive resin composition capable of forming a cured film having excellent resolution and chemical resistance upon curing at low temperatures and to a cured film prepared therefrom. In the photosensitive resin composition of the present invention, the first copolymer and the second copolymer are used as a binder to introduce appropriate amounts of a succinate group and an epoxy group to the composition. Thus, it is possible to prepare a cured film that can be sufficiently cured even at low temperatures by enhancing the degree of curing and that has excellent resolution through the control of the developability and enhancements in the crosslinking reaction. Further, the composition has enhanced chemical resistance to chemical solvents or cleaning solvents, whereby deformation of the cured film can be prevented.

Abstract: The present invention relates to a photosensitive resin composition and an insulation film prepared therefrom. Since the photosensitive resin composition comprises a blocked isocyanate-based compound, it can form a transparent insulation film while it maintains excellent film retention rate, hardness, and resolution.

Abstract: The present invention relates to a photosensitive resin composition and an insulation film prepared therefrom. The photosensitive resin composition is capable of preparing a colored insulation film without a dye. In addition, the photosensitive resin composition is capable of being cured at a low temperature and preparing an insulation film that is excellent in all of such characteristics as film strength, hardness, and resolution.

Abstract: The present invention relates to a photosensitive resin composition and to a cured film formed therefrom, wherein the photosensitive resin composition can improve the sensitivity by using an alcoholic solvent, along with a siloxane polymer and a quinone diazide compound conventionally used, which enhances the solubility in a developer through an interaction between the alcohol and the diazonaphthoquinone (DNQ) group in the quinone diazide compound, as well as can form a cure film having excellent film retention rate even after post-bake.

Abstract: The present invention relates to a long hole saw for a composite material insulation panel for easily cutting a steel sheet of a hard material and a heat insulator such as Styrofoam or urethane of a soft material in one direction, wherein it is possible to reduce shaking vibrations generated during the cutting and to easily, precisely, and stably drill holes when drilling holes for the installation of pipes, conduits, etc. into a composite material insulation panel used for wall or roof construction of a building.

Abstract: Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition introduces a siloxane polymer containing a fluorine atom which has strong water-repellency into a composition including a common siloxane polymer and an epoxy compound, and fluorine groups may be present in the whole region of the cured film so that the water-repellency due to a fluorine component may be maintained even after removing the surface of the cured film is removed via a dry etching process. As a result, the resistance (chemical resistance) to chemicals used in a post-processing can be maximizes to provide a cured film having excellent stability.

Abstract: The present invention relates to a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition additionally includes a thermal acid generator in addition to a conventional siloxane polymer, and an 1,2-quinonediazide compound, and a hydrogen bond between the diazonaphthoquinone group (DNQ) of the quinonediazide compound and the siloxane polymer may be cleaved by an acid generated from the thermal acid generator even if a photobleaching process is not performed during the preparation of a cured film. Accordingly, when the photosensitive resin composition is used a cured film having high transmittance and high resolution may be provided efficiently without any restrictions on a process equipment. In addition, the increase of the transmittance of the cured film may be maximized when acid groups generated from the thermal acid generator is a strong acid having a pKa value of ?5 or less.

Abstract: The present invention provides a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition includes a mixture of two or more siloxane polymers having different dissolution rates with respect to an aqueous solution of tetramethylammonium hydroxide. The composition keeps high transparency and high sensitivity, which are advantages of a composition containing a siloxane polymer, and has excellent chemical resistance, thereby providing a cured film having excellent stability in a post-processing.

Abstract: Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition introduces a siloxane polymer containing a fluorine atom which has strong water-repellency into a composition including a common siloxane polymer and an epoxy compound, and fluorine groups may be present in the whole region of the cured film so that the water-repellency due to a fluorine component may be maintained even after removing the surface of the cured film is removed via a dry etching process. As a result, the resistance (chemical resistance) to chemicals used in a post-processing can be maximizes to provide a cured film having excellent stability.

Abstract: Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition includes a siloxane polymer, a 1,2-quinonediazide compound, an epoxy compound and at least one silane compound represented by formula 1. The silane compound together with the epoxy compound in the resin composition further reduces the number of highly reactive silanol group present in the siloxane polymer. As a result, the resistance (chemical resistance) to chemicals used in a post-processing can be maximized to provide a cured film having excellent stability.

Abstract: The present invention relates to a photosensitive resin composition and to a cured film formed therefrom, wherein the photosensitive resin composition can improve the sensitivity by using an alcoholic solvent, along with a siloxane polymer and a quinone diazide compound conventionally used, which enhances the solubility in a developer through an interaction between the alcohol and the diazonaphthoquinone (DNQ) group in the quinone diazide compound, as well as can form a cure film having excellent film retention rate even after post-bake.

Abstract: An vertical positioning unit for an image display unit includes an elastic member having a biasing part extended in a length direction of the vertical positioning unit to constantly exert an elastic force in a direction across a moving direction of a sliding member which is mounted to a stand member to be movable up and down. Accordingly, a slim structure of the stand member may be achieved.