Patents by Inventor Jin-kwon Bae
Jin-kwon Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11688897Abstract: A battery apparatus for a vehicle of the present disclosure includes a battery module including a plurality of battery cells having a battery cell, a surface of which includes powder coated thereon, a cooling path which is positioned under the battery module and into which a gas generated from the powder is introduced when the surface of the batter cell reaches a specific temperature, an outlet duct which is connected to the cooling path and discharges the gas introduced from the cooling path to an outside through an outlet port, a gas sensor which is installed in the outlet duct and detects the gas introduced into the outlet duct to generate a gas detection result, a vehicle controller which receives the gas detection result and processes the gas detection result into information indicating a possibility of thermal runaway of the battery cell, and a peripheral device which receives the processed information and outputs the possibility of the thermal runaway of the battery cell as visual information or auditoType: GrantFiled: July 21, 2021Date of Patent: June 27, 2023Assignee: HYUNDAI MOBIS Co., Ltd.Inventors: Sang Woo Kim, Jin Kwon Bae
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Publication number: 20220029216Abstract: A battery apparatus for a vehicle of the present disclosure includes a battery module including a plurality of battery cells having a battery cell, a surface of which includes powder coated thereon, a cooling path which is positioned under the battery module and into which a gas generated from the powder is introduced when the surface of the batter cell reaches a specific temperature, an outlet duct which is connected to the cooling path and discharges the gas introduced from the cooling path to an outside through an outlet port, a gas sensor which is installed in the outlet duct and detects the gas introduced into the outlet duct to generate a gas detection result, a vehicle controller which receives the gas detection result and processes the gas detection result into information indicating a possibility of thermal runaway of the battery cell, and a peripheral device which receives the processed information and outputs the possibility of the thermal runaway of the battery cell as visual information or auditoType: ApplicationFiled: July 21, 2021Publication date: January 27, 2022Inventors: Sang Woo KIM, Jin Kwon BAE
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Patent number: 10658266Abstract: A method for managing a temperature of a device includes determining a temperature of a circuit or a package including the circuit, and selectively operating a thermoelectric semiconductor based on the determined temperature to adjust the temperature of the circuit or the package.Type: GrantFiled: April 24, 2017Date of Patent: May 19, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae Choon Kim, Jichul Kim, Jin-Kwon Bae, Eunseok Cho
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Publication number: 20170229373Abstract: A method for managing a temperature of a device includes determining a temperature of a circuit or a package including the circuit, and selectively operating a thermoelectric semiconductor based on the determined temperature to adjust the temperature of the circuit or the package.Type: ApplicationFiled: April 24, 2017Publication date: August 10, 2017Inventors: JAE CHOON KIM, JICHUL KIM, Jin-Kwon BAE, EUNSEOK CHO
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Patent number: 9679874Abstract: A semiconductor device includes a substrate, a first semiconductor package disposed on the substrate, and a second semiconductor package spaced apart from the first semiconductor package on the substrate. The second semiconductor package includes a semiconductor chip stacked on the substrate, an adhesion part covering the semiconductor chip, and a heat-blocking structure disposed between the substrate and the semiconductor chip. Heat generated from the first semiconductor package and transmitted to the second semiconductor package through the substrate is blocked by the heat-blocking structure.Type: GrantFiled: November 11, 2015Date of Patent: June 13, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin-Kwon Bae, Jae Choon Kim, Jichul Kim, Kyol Park, Chajea Jo
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Patent number: 9671141Abstract: A device includes a first board having a first area and a second area not overlapping the first area; and a thermoelectric semiconductor disposed between the first board and the second board at the first area of the first board configured to supply a voltage to the thermoelectric semiconductor; a package disposed at the second area of the first board.Type: GrantFiled: December 7, 2015Date of Patent: June 6, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae Choon Kim, Jichul Kim, Jin-Kwon Bae, Eunseok Cho
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Patent number: 9651431Abstract: A semiconductor package includes a first package including a first substrate and a first semiconductor chip mounted on the first substrate and a second package facing and spaced apart from the first package. The second package includes a second substrate on which a second semiconductor chip is mounted. The semiconductor package also includes a connection structure electrically connecting the first and second packages to each other, a first temperature sensor connected to the first substrate, a second temperature sensor connected to the first semiconductor chip, and a third temperature sensor connected to the second semiconductor chip.Type: GrantFiled: December 20, 2013Date of Patent: May 16, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae Choon Kim, Jichul Kim, Jin-Kwon Bae, Eunho Jung
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Patent number: 9391009Abstract: According to example embodiments, a semiconductor package includes a lower package, upper packages on the lower package and laterally spaced apart from each other, a lower heat exhaust part between the lower package and the upper packages, an intermediate heat exhaust part between the upper packages and connected to the lower heat exhaust part, and an upper heat exhaust part on the upper packages and connected to the intermediate heat exhaust part.Type: GrantFiled: May 29, 2014Date of Patent: July 12, 2016Assignee: Samsung Electronics Co., Ltd.Inventors: Eon Soo Jang, Kyol Park, Jongwoo Park, Jin-Kwon Bae, Yunhyeok Im, Jichul Kim, Soojae Park
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Publication number: 20160133605Abstract: A semiconductor device includes a substrate, a first semiconductor package disposed on the substrate, and a second semiconductor package spaced apart from the first semiconductor package on the substrate. The second semiconductor package includes a semiconductor chip stacked on the substrate, an adhesion part covering the semiconductor chip, and a heat-blocking structure disposed between the substrate and the semiconductor chip. Heat generated from the first semiconductor package and transmitted to the second semiconductor package through the substrate is blocked by the heat-blocking structure.Type: ApplicationFiled: November 11, 2015Publication date: May 12, 2016Inventors: Jin-Kwon BAE, Jae Choon KIM, Jichul KIM, Kyol PARK, Chajea JO
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Publication number: 20160084542Abstract: A device includes a first board having a first area and a second area not overlapping the first area; and a thermoelectric semiconductor disposed between the first board and the second board at the first area of the first board configured to supply a voltage to the thermoelectric semiconductor; a package disposed at the second area of the first board.Type: ApplicationFiled: December 7, 2015Publication date: March 24, 2016Inventors: JAE CHOON KIM, JICHUL KIM, Jin-Kwon BAE, EUNSEOK CHO
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Patent number: 9228763Abstract: Provided are thermoelectric cooling packages and thermal management methods thereof. The method may include measuring a temperature of the thermoelectric cooling package including a semiconductor chip and a thermoelectric cooler, comparing the temperature of the thermoelectric cooling package with a target temperature, operating the thermoelectric cooler when the temperature of the thermoelectric cooling package is higher than the target temperature, and stopping the operation of the thermoelectric cooler when the temperature of the thermoelectric cooling package becomes lower than the target temperature.Type: GrantFiled: December 3, 2012Date of Patent: January 5, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae Choon Kim, Jichul Kim, Jin-Kwon Bae, Eunseok Cho
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Patent number: 9202773Abstract: Provided is a semiconductor module. The semiconductor module includes a substrate including a first surface and a second surface opposite to the first surface. A semiconductor device is disposed on the first surface of the substrate. An airflow guide is disposed on the second surface of the substrate. The airflow guide includes a plate including an end portion distantly from the second surface.Type: GrantFiled: July 12, 2012Date of Patent: December 1, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin-Kwon Bae, Eun-Seok Cho
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Patent number: 8994169Abstract: A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.Type: GrantFiled: August 29, 2012Date of Patent: March 31, 2015Assignee: SAMSUNG Electronics Co., Ltd.Inventors: Ji-Chul Kim, Jin-Kwon Bae, Mi-Na Choi, Hee-Jung Hwang
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Publication number: 20150054148Abstract: According to example embodiments, a semiconductor package includes a lower package, upper packages on the lower package and laterally spaced apart from each other, a lower heat exhaust part between the lower package and the upper packages, an intermediate heat exhaust part between the upper packages and connected to the lower heat exhaust part, and an upper heat exhaust part on the upper packages and connected to the intermediate heat exhaust part.Type: ApplicationFiled: May 29, 2014Publication date: February 26, 2015Inventors: Eon-Soo JANG, Kyol PARK, Jongwoo PARK, Jin-Kwon BAE, Yun-Hyeok IM, Ji-Chul KIM, Soojae PARK
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Publication number: 20140247859Abstract: A semiconductor package includes a first package including a first substrate and a first semiconductor chip mounted on the first substrate and a second package facing and spaced apart from the first package. The second package includes a second substrate on which a second semiconductor chip is mounted. The semiconductor package also includes a connection structure electrically connecting the first and second packages to each other, a first temperature sensor connected to the first substrate, a second temperature sensor connected to the first semiconductor chip, and a third temperature sensor connected to the second semiconductor chip.Type: ApplicationFiled: December 20, 2013Publication date: September 4, 2014Inventors: Jae Choon KIM, Jichul KIM, Jin-Kwon BAE, Eunho JUNG
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Publication number: 20140239434Abstract: According to example embodiments, a semiconductor package may include a first package substrate, a first semiconductor chip on the first package substrate, and a thermistor array film on the first semiconductor chip. The thermistor array film may include a variable resistive film that covers the first semiconductor chip, and an array of electrode patterns that are connected to the variable resistive film. The array of electrode patterns may be connected to at least one of the upper and lower surfaces of the variable resistive film.Type: ApplicationFiled: December 19, 2013Publication date: August 28, 2014Inventors: Jae Choon KIM, Jin-Kwon BAE, Eunho JUNG
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Publication number: 20130139524Abstract: Provided are thermoelectric cooling packages and thermal management methods thereof. The method may include measuring a temperature of the thermoelectric cooling package including a semiconductor chip and a thermoelectric cooler, comparing the temperature of the thermoelectric cooling package with a target temperature, operating the thermoelectric cooler when the temperature of the thermoelectric cooling package is higher than the target temperature, and stopping the operation of the thermoelectric cooler when the temperature of the thermoelectric cooling package becomes lower than the target temperature.Type: ApplicationFiled: December 3, 2012Publication date: June 6, 2013Inventors: Jae Choon KIM, Jichul KIM, Jin-Kwon BAE, Eunseok CHO
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Publication number: 20130135823Abstract: A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow.Type: ApplicationFiled: August 29, 2012Publication date: May 30, 2013Applicant: Samsung Electronics Co., Ltd.Inventors: Ji-Chul Kim, Jin-Kwon Bae, Mi-Na Choi, Hee-Jung Hwang
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Publication number: 20130077239Abstract: Provided is a semiconductor module. The semiconductor module includes a substrate including a first surface and a second surface opposite to the first surface. A semiconductor device is disposed on the first surface of the substrate. An airflow guide is disposed on the second surface of the substrate. The airflow guide includes a plate including an end portion distantly from the second surface.Type: ApplicationFiled: July 12, 2012Publication date: March 28, 2013Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin-Kwon BAE, Eun-Seok CHO
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Patent number: 8184439Abstract: A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal energy received from the heat collecting member and package to the outside, and a thermoelectric device transferring thermal energy through the heat collection area to the heat radiating member via the thermoelectric effect. The heat collecting member and heat radiating member may be otherwise insulated so thermal energy is transferred and controlled by the thermoelectric device. The package may be a dynamic random access memory (DRAM), microprocessor, central processing unit (CPU), graphic processing unit (GPU), or flash memory. The heat radiating member may be an external case of a solid state disk (SSD), and the thermoelectric device may be a Peltier cooler controlled through a power line.Type: GrantFiled: July 9, 2010Date of Patent: May 22, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Joong-hyun Baek, Hee-jin Lee, Jin-kwon Bae