Patents by Inventor Jin-kwon Bok
Jin-kwon Bok has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10678117Abstract: An optical phased array (OPA) may be included in a light detection and ranging (LiDAR) system and may be configured to perform beam steering. The OPA may include a cascading structure of splitters configured to enable a branch operation to be performed M times. Each splitter may split an input optical signal in a ratio of 1:1 and output the split input optical signal. The OPA may include a plurality of sets of first phase shifters (PSs), each set of first PSs located exclusively on one output end of a separate splitter, each set of first PSs including a particular quantity of first PSs based on a branch position at which the separate splitter is located. The OPA may be included in a LiDAR system that is further included in a vehicle that is configured to enable navigation of the vehicle, including autonomous navigation, through an environment.Type: GrantFiled: March 17, 2017Date of Patent: June 9, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Dong-jae Shin, Hyun-il Byun, Kyoung-ho Ha, Seong-gu Kim, Jin-kwon Bok, Jung-ho Cha, Dong-hyun Kim, Yong-sang Park, Min-kyung Kim
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Patent number: 10230473Abstract: An optical transmitter includes photonic integrated circuits configured to respectively output optical transmission signals in different wavelength ranges. A photonic integrated circuit may include emitters configured to emit beams having different wavelengths; drivers configured to respectively provide power to the emitters, and a wavelength division multiplexer configured to transmit the beams emitted by the emitters. A photonic integrated circuit may include a switch device that controls the drivers, and light detectors configured to detect intensities of the beams emitted from the emitters. The switch device may selectively operate at least one driver of the plurality of drivers based on information associated with intensities of the beams. The switch device may selectively operate a driver connected to an emitter, based on a determination that an intensity of a beam emitted by another emitter is less than a threshold intensity value.Type: GrantFiled: February 8, 2017Date of Patent: March 12, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Dong-jae Shin, Kyoung-ho Ha, Seong-gu Kim, Jin-kwon Bok, Jung-ho Cha, Dong-hyun Kim
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Publication number: 20180052378Abstract: An optical phased array (OPA) may be included in a light detection and ranging (LiDAR) system and may be configured to perform beam steering. The OPA may include a cascading structure of splitters configured to enable a branch operation to be performed M times. Each splitter may split an input optical signal in a ratio of 1:1 and output the split input optical signal. The OPA may include a plurality of sets of first phase shifters (PSs), each set of first PSs located exclusively on one output end of a separate splitter, each set of first PSs including a particular quantity of first PSs based on a branch position at which the separate splitter is located. The OPA may be included in a LiDAR system that is further included in a vehicle that is configured to enable navigation of the vehicle, including autonomous navigation, through an environment.Type: ApplicationFiled: March 17, 2017Publication date: February 22, 2018Applicant: Samsung Electronics Co., Ltd.Inventors: Dong-jae SHIN, Hyun-il Byun, Kyoung-ho Ha, Seong-gu Kim, Jin-kwon Bok, Jung-ho Cha, Dong-hyun Kim, Yong-sang Park, Min-kyung Kim
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Patent number: 9897753Abstract: An optical device includes a substrate; a trench in a portion of the substrate; a clad layer arranged in the trench; a first structure arranged on the clad layer to have a first depth; and a second structure arranged on the clad layer to have a second depth different from the first depth.Type: GrantFiled: December 22, 2016Date of Patent: February 20, 2018Assignee: Samsung Electronics Co., Ltd.Inventors: Jin-Kwon Bok, Kyoung-Ho Ha, Dong-Jae Shin, Seong-Gu Kim, Kwan-Sik Cho, Beom-Suk Lee, Jung-Ho Cha, Hyun-Il Byun, Dong-Hyun Kim, Yong-Hwack Shin, Jung-Hye Kim
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Publication number: 20170366272Abstract: An optical transmitter includes photonic integrated circuits configured to respectively output optical transmission signals in different wavelength ranges. A photonic integrated circuit may include emitters configured to emit beams having different wavelengths; drivers configured to respectively provide power to the emitters, and a wavelength division multiplexer configured to transmit the beams emitted by the emitters. A photonic integrated circuit may include a switch device that controls the drivers, and light detectors configured to detect intensities of the beams emitted from the emitters. The switch device may selectively operate at least one driver of the plurality of drivers based on information associated with intensities of the beams. The switch device may selectively operate a driver connected to an emitter, based on a determination that an intensity of a beam emitted by another emitter is less than a threshold intensity value.Type: ApplicationFiled: February 8, 2017Publication date: December 21, 2017Applicant: Samsung Electronics Co., Ltd.Inventors: Dong-jae SHIN, Kyoung-ho HA, Seong-gu KIM, Jin-kwon BOK, Jung-ho CHA, Dong-hyun KIM
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Publication number: 20170184786Abstract: An optical device includes a substrate; a trench in a portion of the substrate; a clad layer arranged in the trench; a first structure arranged on the clad layer to have a first depth; and a second structure arranged on the clad layer to have a second depth different from the first depth.Type: ApplicationFiled: December 22, 2016Publication date: June 29, 2017Inventors: JIN-KWON BOK, KYOUNG-HO HA, DONG-JAE SHIN, SEONG-GU KIM, KWAN-SIK CHO, BEOM-SUK LEE, JUNG-HO CHA, HYUN-IL BYUN, DONG-HYUN KIM, YONG-HWACK SHIN, JUNG-HYE KIM
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Publication number: 20160178847Abstract: An optical coupler includes a tapered portion and a grating portion. The tapered portion has a width in a second direction increasing along a first direction substantially perpendicular to the second direction. The tapered portion includes first and second ends opposed to each other in the first direction. The first end has a first width, and the second end has a second width greater than the first width. The grating portion is connected to the second end of the tapered portion, and has a curvature radius greater than a distance to the first end of the tapered portion.Type: ApplicationFiled: December 8, 2015Publication date: June 23, 2016Inventors: Seong-Gu Kim, Dong-Hyun KIM, Jin-Kwon BOK, Dong-Jae SHIN, In-Sung JOE, Kyoung-Ho HA
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Patent number: 8842942Abstract: An optical modulator comprises a bulk-silicon substrate comprising a trench having a predetermined width and a predetermined depth. A bottom cladding layer is formed in the trench, and a plurality of waveguides and a phase modulation unit are formed on the bottom cladding layer. A top cladding layer is formed on the plurality of waveguides and the phase modulation unit.Type: GrantFiled: January 24, 2011Date of Patent: September 23, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Dong-jae Shin, Kyoung-won Na, Sung-dong Suh, Kyoung-ho Ha, Seong-gu Kim, Ho-chul Ji, In-sung Joe, Jin-kwon Bok, Pil-kyu Kang
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Patent number: 8791405Abstract: Optical waveguide and coupler devices and methods include a trench formed in a bulk semiconductor substrate, for example, a bulk silicon substrate. A bottom cladding layer is formed in the trench, and a core region is formed on the bottom cladding layer. A reflective element, such as a distributed Bragg reflector can be formed under the coupler device and/or the waveguide device. Because the optical devices are integrated in a bulk substrate, they can be readily integrated with other devices on a chip or die in accordance with silicon photonics technology. Specifically, for example, the optical devices can be integrated in a DRAM memory circuit chip die.Type: GrantFiled: October 25, 2010Date of Patent: July 29, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Ho-chul Ji, Ki-nam Kim, Yong-woo Hyung, Kyoung-won Na, Kyoung-ho Ha, Yoon-dong Park, Dae-lok Bae, Jin-kwon Bok, Pil-kyu Kang, Sung-dong Suh, Seong-gu Kim, Dong-jae Shin, In-sung Joe
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Publication number: 20140144380Abstract: A gas supply pipe and a chemical vapor deposition (CVD) apparatus including the gas supply pipe. The gas supply pipe includes: a first pipe connected to a gas storage apparatus via a gas supply line to supply a reacting gas into a reacting furnace; and a second pipe thermally contacting the first pipe to cool the first pipe, wherein a first end of the second pipe is connected to a cooling medium supplying unit via a cooling medium line such that a cooling medium circulates inside the second pipe, and a second, opposite end of the second pipe is connected to a cooling medium collecting unit.Type: ApplicationFiled: November 28, 2012Publication date: May 29, 2014Inventors: Sung-ho Kang, Bong-jin Kuh, Ki-chul Kim, Jin-kwon Bok, Yong-kyu Joo, Sang-cheol Ha
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Publication number: 20140139900Abstract: A wavelength tunable optical transmitter includes a first waveguide receiving incident light through an input port and outputting the incident light to a first output port, a resonant modulator adjacent to the first waveguide and whose resonant wavelength is variable, and a second waveguide disposed optically in parallel to the first waveguide and outputting emitted light to a second output port. The resonant modulator includes a silicon resonator constituted by a crystallized silicon film in the form of a closed loop between the first and second waveguides, a first electrode within the silicon resonator and constituted by a silicon film of a first conductivity type, and a second electrode extending alongside part of the outer circumferential surface of the silicon resonator and constituted by a silicon film of a second conductivity type.Type: ApplicationFiled: August 21, 2013Publication date: May 22, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dong-Jae SHIN, Jin-Kwon BOK, Beom-Suk LEE, Kwan-Sik CHO, Ho-Chul JI, Sang-Hun CHOI, Kyoung-Ho HA
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Publication number: 20110243492Abstract: A silicon based optical modulator apparatus can include a lateral slab on an optical waveguide, the lateral slab protruding beyond side walls of the optical waveguide so that a portion of the optical waveguide protrudes from the lateral slab towards a substrate.Type: ApplicationFiled: March 16, 2011Publication date: October 6, 2011Inventors: Kyoung-won NA, Sung-dong Suh, Kyoung-ho Ha, Seong-gu Kim, Jin-kwon Bok, Dong-jae Shin, Ho-chul Ji, Pil-kyu Kang, In-sung Joe
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Publication number: 20110194803Abstract: An optical modulator comprises a bulk-silicon substrate comprising a trench having a predetermined width and a predetermined depth. A bottom cladding layer is formed in the trench, and a plurality of waveguides and a phase modulation unit are formed on the bottom cladding layer. A top cladding layer is formed on the plurality of waveguides and the phase modulation unit.Type: ApplicationFiled: January 24, 2011Publication date: August 11, 2011Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dong-jae SHIN, Kyoung-won NA, Sung-dong SUH, Kyoung-ho HA, Seong-gu KIM, Ho-chul JI, In-sung JOE, Jin-kwon BOK, Pil-kyu KANG
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Publication number: 20110133063Abstract: Optical waveguide and coupler devices and methods include a trench formed in a bulk semiconductor substrate, for example, a bulk silicon substrate. A bottom cladding layer is formed in the trench, and a core region is formed on the bottom cladding layer. A reflective element, such as a distributed Bragg reflector can be formed under the coupler device and/or the waveguide device. Because the optical devices are integrated in a bulk substrate, they can be readily integrated with other devices on a chip or die in accordance with silicon photonics technology. Specifically, for example, the optical devices can be integrated in a DRAM memory circuit chip die.Type: ApplicationFiled: October 25, 2010Publication date: June 9, 2011Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ho-chul Ji, Ki-nam Kim, Yong-woo Hyung, Kyoung-won Na, Kyoung-ho Ha, Yoon-dong Park, Dae-lok Bae, Jin-kwon Bok, Pil-kyu Kang, Sung-dong Suh, Seong-gu Kim, Dong-jae Shin, In-sung Joe