Patents by Inventor Jin-Kwon JEONG

Jin-Kwon JEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11949881
    Abstract: The present invention discloses an encoding apparatus using a Discrete Cosine Transform (DCT) scanning, which includes a mode selection means for selecting an optimal mode for intra prediction; an intra prediction means for performing intra prediction onto video inputted based on the mode selected in the mode selection means; a DCT and quantization means for performing DCT and quantization onto residual coefficients of a block outputted from the intra prediction means; and an entropy encoding means for performing entropy encoding onto DCT coefficients acquired from the DCT and quantization by using a scanning mode decided based on pixel similarity of the residual coefficients.
    Type: Grant
    Filed: April 1, 2021
    Date of Patent: April 2, 2024
    Assignees: Electronics and Telecommunications Research Institute, Kwangwoon University Research Institute for Industry Cooperation, Industry-Academia Cooperation Group of Sejong University
    Inventors: Se-Yoon Jeong, Hae-Chul Choi, Jeong-Il Seo, Seung-Kwon Beack, In-Seon Jang, Jae-Gon Kim, Kyung-Ae Moon, Dae-Young Jang, Jin-Woo Hong, Jin-Woong Kim, Yung-Lyul Lee, Dong-Gyu Sim, Seoung-Jun Oh, Chang-Beom Ahn, Dae-Yeon Kim, Dong-Kyun Kim
  • Patent number: 10557066
    Abstract: The present invention relates to an adhesive composition capable of improving adhesion force between two interfaces through thermal crosslinking and photo-crosslinking of a substrate and a resin, or a resin and a resin, in processes for optical devices and electronic devices, and a preparation method thereof. Specifically, the present invention relates to an adhesive composition capable of adhering an interface between a substrate and a photocurable resin, and a method of adhering an interface using the same.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: February 11, 2020
    Assignee: Chem Optics Inc.
    Inventors: Hyung-Jong Lee, Nam Seob Baek, Jonghwi Lee, Yun Jung Seo, Jin-Kwon Jeong
  • Publication number: 20180201816
    Abstract: The present invention relates to an adhesive composition capable of improving adhesion force between two interfaces through thermal crosslinking and photo-crosslinking of a substrate and a resin, or a resin and a resin, in processes for optical devices and electronic devices, and a preparation method thereof. Specifically, the present invention relates to an adhesive composition capable of adhering an interface between a substrate and a photocurable resin, and a method of adhering an interface using the same.
    Type: Application
    Filed: October 6, 2016
    Publication date: July 19, 2018
    Inventors: Hyung-Jong LEE, Nam Seob BAEK, Jonghwi LEE, Yun Jung SEO, Jin-Kwon JEONG