Patents by Inventor Jinkyu IM

Jinkyu IM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11573490
    Abstract: The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises a nonpolar organic solvent, thereby suppressing the reactivity of the epoxy group in the composition to reduce the production of diol compounds. When a cured film is prepared from the composition, an appropriate level of developability can be maintained to further enhance the pattern adhesiveness, resolution, and sensitivity. Further, since the composition of the present invention has a small difference in the film retention rates at room temperature and low temperatures, the composition may have stable stability over time.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: February 7, 2023
    Inventors: Ji Ung Kim, Geun Huh, Ju-Young Jung, JinKyu Im, Yeonok Kim
  • Publication number: 20200407510
    Abstract: The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition introduces a multifunctional monomer into a positive-type photosensitive resin composition comprising a mixed binder in which a siloxane copolymer is added to an acrylic copolymer, whereby the penetration of a developer into the binder can be facilitated at the time of development of a pre-baked film to increase the solubility in the developer, thereby further enhancing the pattern developability and sensitivity. Further, a cured film prepared from the composition has excellent appearance characteristics without a rough surface of the film and a scum or the like at the bottom of the film during development.
    Type: Application
    Filed: May 20, 2020
    Publication date: December 31, 2020
    Inventors: Yeonok KIM, Geun HUH, Ju-Young JUNG, JinKyu IM, Ji Ung KIM
  • Publication number: 20200409266
    Abstract: The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises a nonpolar organic solvent, thereby suppressing the reactivity of the epoxy group in the composition to reduce the production of diol compounds. When a cured film is prepared from the composition, an appropriate level of developability can be maintained to further enhance the pattern adhesiveness, resolution, and sensitivity. Further, since the composition of the present invention has a small difference in the film retention rates at room temperature and low temperatures, the composition may have stable stability over time.
    Type: Application
    Filed: May 20, 2020
    Publication date: December 31, 2020
    Inventors: Ji Ung KIM, Geun HUH, Ju-Young JUNG, JinKyu IM, Yeonok KIM
  • Publication number: 20150367277
    Abstract: The present invention relates to the use of an aqueous solution as a carbon dioxide absorbent, the aqueous solution containing a tertiary dialkylalkanolamine as a primary absorbent, a secondary alkanolamine as a rate enhancer, and polyalkylene glycol monomethyl ether as a regeneration promoter. The alkanolamine-based carbon dioxide absorbent containing polyalkylene glycol monomethyl ether and the carbon dioxide absorption method and separation method using same, according to the present invention, not only have an excellent carbon dioxide absorption capacity and a rapid carbon dioxide absorption rate, but also have a remarkably low absorbent regeneration temperature compared with a conventional alkanolamine-based absorbent and thus can significantly reduce the entire energy consumption required for an absorption process, and can also prevent recovered carbon dioxide from being contaminated with moisture and absorbent vapor, owing to the low regeneration temperature.
    Type: Application
    Filed: December 27, 2013
    Publication date: December 24, 2015
    Inventors: Hoon Sik KIM, Minserk CHEONG, Jinkyu IM, Sung Yun HONG