Abstract: An inkjet head unit capable of performing high-resolution pixel printing on a large-size substrate and a substrate treatment apparatus including the inkjet head unit are provided. The substrate treatment apparatus includes: a processing unit supporting and moving a substrate; an inkjet head unit performing pixel printing on the substrate; and a gantry unit moving the inkjet head unit over the substrate, wherein the inkjet head unit includes head packs, which include a plurality of nozzles ejecting a substrate treatment liquid onto the substrate, and a head base, in which the head packs are installed and the head packs are disposed in a single row in the head base.

Abstract: Memory array structures, and methods of their formation, might include a first memory cell having a first control gate and an adjacent first portion of a charge-blocking structure, a second memory cell having a second control gate and an adjacent second portion of the charge-blocking structure, and a first dielectric material between the first control gate and the second control gate, and adjacent to a third portion of the charge-blocking structure that is between the first and second portions of the charge-blocking structure. The third portion of the charge-blocking structure might include a second dielectric material and a third dielectric material different than the second dielectric material, and the first portion of the charge-blocking structure and the second portion of the charge-blocking structure might each include the third dielectric material and a fourth dielectric material different than the second dielectric material. Apparatus might include such memory array structures.

Abstract: An inverter protection device is disclosed. An inverter protection device, which determines whether or not a pulse-width modulation (PWM) control signal provided to an inverter unit of an inverter is blocked in accordance with a voltage signal received from first and second switches of a safety relay which are parallelly connected, comprises: a first power switch which is switched to an on-state by means of a first voltage signal applied from the first switch; a second power switch which is switched to an on-state by means of a second voltage signal applied from the second switch; and a buffer unit which is on-off controlled in accordance with an output current of the first and second power switches and provides the PWM control signal to the inverter unit.

Abstract: An inverter protection device is disclosed. An inverter protection device, which determines whether or not a pulse-width modulation (PWM) control signal provided to an inverter unit of an inverter is blocked in accordance with a voltage signal received from first and second switches of a safety relay which are parallelly connected, comprises: a first power switch which is switched to an on-state by means of a first voltage signal applied from the first switch; a second power switch which is switched to an on-state by means of a second voltage signal applied from the second switch; and a buffer unit which is on-off controlled in accordance with an output current of the first and second power switches and provides the PWM control signal to the inverter unit.

Abstract: A device for protecting an inverter include a first power switch configured to be turned on when a first voltage signal from a first switch of a safety relay is applied thereto; a second power switch connected in series with the first power switch, wherein the second power switch is configured to be turned on when a second voltage signal from a second switch of a safety relay is applied thereto; and a power line for connecting the first power switch and the second power switch to each other in series and for connecting the series of the first power switch and the second power switch to a buffer of the inverter, wherein a third voltage signal is applied via the power line to the buffer.

Abstract: A device for protecting an inverter include a first power switch configured to be turned on when a first voltage signal from a first switch of a safety relay is applied thereto; a second power switch connected in series with the first power switch, wherein the second power switch is configured to be turned on when a second voltage signal from a second switch of a safety relay is applied thereto; and a power line for connecting the first power switch and the second power switch to each other in series and for connecting the series of the first power switch and the second power switch to a buffer of the inverter, wherein a third voltage signal is applied via the power line to the buffer.

Abstract: A parameter determining apparatus for estimating temperature of a switching element of an inverter is disclosed. The parameter determining apparatus of the present disclosure includes an inverter unit including a power semiconductor module configured with at least one or more switching elements, and a control unit configured to determine an initial collector-emitter voltage of each of the switching elements and collector-emitter resistance of each thereof by linearizing a collector-emitter voltage of each of the switching elements at a certain temperature.

Abstract: Disclosed herein are a method and an apparatus for generating a random PWM voltage reference signal for driving an inverter, which can more simply generate random position PWM (RPPWM) in which a position of an active vector is changed to achieve the same effect as when a switching frequency is changed.

Abstract: A parameter determining apparatus for estimating temperature of a switching element of an inverter is disclosed. The parameter determining apparatus of the present disclosure includes an inverter unit including a power semiconductor module configured with at least one or more switching elements, and a control unit configured to determine an initial collector-emitter voltage of each of the switching elements and collector-emitter resistance of each thereof by linearizing a collector-emitter voltage of each of the switching elements at a certain temperature.

Abstract: Disclosed herein are a method and an apparatus for generating a random PWM voltage reference signal for driving an inverter, which can more simply generate random position PWM (RPPWM) in which a position of an active vector is changed to achieve the same effect as when a switching frequency is changed.

Abstract: The present disclosure relates to an apparatus for diagnosing a DC link capacitor. A DC voltage provided from a power supplier to a motor is controlled to have a predetermined level (or magnitude). When a voltage of the DC link reaches a predetermined voltage, the ratio of change of capacitance values of the DC link capacitor is estimated, by considering power consumption of a resistor of the motor (i.e., power consumption of a load), power consumption of the power supplier and a switching loss of an inverter part, and a deteriorated level of the DC link capacitor is diagnosed using the estimated ratio.

Abstract: The present disclosure relates to an apparatus for diagnosing a DC link capacitor. A DC voltage provided from a power supplier to a motor is controlled to have a predetermined level (or magnitude). When a voltage of the DC link reaches a predetermined voltage, the ratio of change of capacitance values of the DC link capacitor is estimated, by considering power consumption of a resistor of the motor (i.e., power consumption of a load), power consumption of the power supplier and a switching loss of an inverter part, and a deteriorated level of the DC link capacitor is diagnosed using the estimated ratio.

Abstract: A polarizer includes a base and a plurality of grids arranged on a surface of the base parallel to one another. Each of the grids comprises an intermediate layer and a semi-transmissive metal layer that reflects a part of external light incident thereon and transmits a part of the external light incident thereon. The semi-transmissive metal layer and the intermediate layer are alternately deposited to include at least two semi-transmissive metal layers. The thicknesses of the semi-transmissive metal layers increases in a direction in which the semi-transmissive metal layer is disposed away from the external light. An organic light emitting display apparatus includes the polarizer and has improved contrast and brightness.

Abstract: Provided are a passive device of a semiconductor module, a semiconductor module having the passive device, an electronic circuit board and electronic system having the passive device or semiconductor module, and methods of fabricating and inspecting the semiconductor module. The passive device of the semiconductor module includes a main body and at least two real electrodes disposed on one lateral surface of the main body.

Abstract: A heat sink includes first and second base plates to contact with first and second surfaces of a heat source, respectively. The first base plate includes a support unit protruding from a first surface and a first dissipating unit to dissipate heat from the heat source. The second base plate includes a penetrating hole spaced apart from an edge portion to hold the support unit and a second dissipating unit to dissipate the heat from the heat source. A coupling member is positioned on an upper surface of the support unit and applies a force to the first and second base plates to thereby combine the first and second base plates to the heat source. The base plates are combined to the memory module without any loss of the surface area of the dissipating fin, to thereby improve the dissipation efficiency of the heat sink.

Abstract: An image forming apparatus includes a main body unit which has an image forming unit; a door unit which couples with the main body unit to open and close the main body unit, and has a projection at one side thereof; a mid-transfer unit which couples with the door unit; a coupling knob which is provided in the main body unit and rotates in cooperation with pressure of the projection when the door unit is closed; and a coupling apparatus which is provided in the main body and transmits a driving force from the main body unit to the mid-transfer unit in cooperation with the rotation of the coupling knob.

Abstract: A heat sink includes a base plate and at least one elastic plate. The base plate is connected to a heat generator such as a semiconductor chip. One end portion of the elastic plate is connected to the base plate and the elastic plate has a zigzag structure to ensure desired elasticity. The elastic plate dissipates the heat generated from the heat generator.

Abstract: Disclosed is an apparatus for manufacturing an electrolytic metal foil, which includes an electrolytic cell containing electrolyte; an upper drum installed in an upper portion of the electrolytic cell to be rotatable and to which a negative potential is applied; a lower drum soaked in the electrolyte of the electrolytic cell and installed to be rotatable together with the upper drum; a cathode belt mounted around outer circumferences of the upper and lower drums to move along an endless track and electrically connected to the upper drum so that the negative potential is applied thereto; and an anode unit installed to form a space from a metal electroplating surface of the cathode belt soaked in the electrolytic cell so that a positive potential is applied thereto, the anode unit having a slit for supplying the electrolytic to the space. This apparatus may increase a production rate of electrolytic metal foils.

Abstract: A semiconductor package and associated methods, the semiconductor package including a substrate including a socket, and connection terminals including a solder ball and a supporting portion extending from the solder ball into the socket.

Abstract: A heat sink includes first and second base plates to contact with first and second surfaces of a heat source, respectively. The first base plate includes a support unit protruding from a first surface and a first dissipating unit to dissipate heat from the heat source. The second base plate includes a penetrating hole spaced apart from an edge portion to hold the support unit and a second dissipating unit to dissipate the heat from the heat source. A coupling member is positioned on an upper surface of the support member and applies a force to the first and second base plates to thereby combine the first and second base plates to the heat source. The base plates are combined to the memory module without any loss of the surface area of the dissipating fin, to thereby improve the dissipation efficiency of the heat sink.