Abstract: An image encoding/decoding method, device and recording medium based on accumulation of a region of interest of the present disclosure may include partitioning a current image to acquire a region of interest, cumulatively expressing the region of interest in a reference image of the current image and decoding the current image based on a reference image in which the region of interest is cumulatively expressed.

Abstract: The present invention discloses an encoding apparatus using a Discrete Cosine Transform (DCT) scanning, which includes a mode selection means for selecting an optimal mode for intra prediction; an intra prediction means for performing intra prediction onto video inputted based on the mode selected in the mode selection means; a DCT and quantization means for performing DCT and quantization onto residual coefficients of a block outputted from the intra prediction means; and an entropy encoding means for performing entropy encoding onto DCT coefficients acquired from the DCT and quantization by using a scanning mode decided based on pixel similarity of the residual coefficients.

Abstract: Provided a semiconductor device comprises, a plurality of semiconductor patterns spaced in a first direction; a plurality of mold insulating layers between the plurality of semiconductor patterns, a plurality of silicide patterns contacting the plurality of semiconductor patterns; and a plurality of first metal conductive films between the plurality of mold insulating layers and connected to each of the silicide patterns, wherein each of the silicide patterns includes a first sidewall that faces the semiconductor pattern, and a second sidewall which faces the first metal conductive film, the first sidewall of the silicide pattern and the second sidewall of the silicide pattern extends in the first direction, and the first sidewall of the silicide pattern and the second sidewall of the silicide pattern are curved surfaces.

Abstract: A resist material is combined with a ligand containing four or more fluorine atoms and is represented by the following formula: [(R1M)iOjXk(OH)m] (OH)nR2p, wherein one of “R1” and “R2” is CaFbHc, CaFbHcNd, CaFbHcPd, CaFbHcSd, CaFbHcOd, CaFbHcNdSe, CaFbHcPdSe, CaFbHcNdOe, or CaFbHcPdOe, the other of “R1” and “R2” is CaHc, CaFbHc, CaFbHcNd, CaFbHcPd, CaFbHcSd, CaFbHcOd, CaFbHcNdSe, CaFbHcPdSe, CaFbHcNdOe, or CaFbHcPdOe, “a” and “c” are each independently an integer of 0 to 20, “b” is an integer of 4 to 30, “d” and “e” are each independently an integer of 0 to 5, “M” is one metal selected from a specified list, “i” is an integer from 1 to 12, “j” is an integer of 1 to 14, “X” is a halogen selected from a specified list, “k” and “m” are each independently an integer of 0 to 6, and “n” and “p” are each independently an integer of 0 to 2.

Abstract: Provided is a resist compound, a method for forming a pattern using the same, and a method for manufacturing a semiconductor device. According to the present disclosure, the compound may be represented by Formula 1.

Abstract: Provided are a resist compound, a method of forming a pattern by using the same, and a method of manufacturing a semiconductor device using the same.

Abstract: An object of the present invention is to provide forceps for removing a dental implant fixture, in which pinching portions securely hold a fixture to remove the fixture implanted in an alveolar bone, and thus to prevent the pinching portions from slipping out of the fixture. Forceps for removing a dental implant fixture according to the exemplary embodiment of the present invention include: a pair of handles; coupling portions extended from the handles, crossed, and hingedly coupled; pinching portions connected to the coupling portions; and holding pieces protruding from ends of the pinching portions in a direction toward a center of a dental implant fixture and each having an arc corresponding to at least a part of an outer circumference of the fixture so that the holding pieces are inserted into a trough of a threaded portion formed on the outer circumference of the fixture.

Abstract: Provided is a resist compound, a method for forming a pattern using the same, and a method for manufacturing a semiconductor device. According to the present disclosure, the compound may be represented by Formula 1.

Abstract: The present invention relates to a polymer-based superabsorbent coating composition and a use thereof. The superabsorbent coating composition comprises: (i) an absorbent material; and (ii) a binder comprising a polymerizable absorbent polymer and a crosslinking agent, wherein the absorbent material contains at least one functional group for chemically binding to the binder, thereby chemically bonding to the binder, and the absorbent polymer and the crosslinking agent chemically bond together within the binder.

Abstract: Disclosed is a tooth-attach wearable device. The tooth-attach wearable device includes a body configured to attach to a tooth; a sensor device provided to the body, and configured to sense biometric information of a patient; and a communication controller provided to the body, and configured to store the biometric information sensed at the sensor device as data, and to transmit the stored data.

Abstract: An object of the present invention is to provide forceps for removing a dental implant fixture, in which pinching portions securely hold a fixture to remove the fixture implanted in an alveolar bone, and thus to prevent the pinching portions from slipping out of the fixture. Forceps for removing a dental implant fixture according to the exemplary embodiment of the present invention include: a pair of handles; coupling portions extended from the handles, crossed, and hingedly coupled; pinching portions connected to the coupling portions; and holding pieces protruding from ends of the pinching portions in a direction toward a center of a dental implant fixture and each having an arc corresponding to at least a part of an outer circumference of the fixture so that the holding pieces are inserted into a trough of a threaded portion formed on the outer circumference of the fixture.

Abstract: The present invention relates to a polymer-based superabsorbent coating composition and a use thereof. The superabsorbent coating composition comprises: (i) an absorbent material; and (ii) a binder comprising a polymerizable absorbent polymer and a crosslinking agent, wherein the absorbent material contains at least one functional group for chemically binding to the binder, thereby chemically bonding to the binder, and the absorbent polymer and the crosslinking agent chemically bond together within the binder.

Abstract: Disclosed is a tooth-attach wearable device. The tooth-attach wearable device includes a body configured to attach to a tooth; a sensor device provided to the body, and configured to sense biometric information of a patient; and a communication controller provided to the body, and configured to store the biometric information sensed at the sensor device as data, and to transmit the stored data.

Abstract: A method for manufacturing an organic memory device is disclosed. According to one embodiment, the method comprises the steps of: forming a first electrode on a substrate; forming an organic active layer on the first electrode; and forming a second electrode on the organic active layer through an orthogonal photolithography technique using a fluorinated material.

Abstract: An orthogonal process for photolithographic patterning organic structures is disclosed. The disclosed process utilizes fluorinated solvents or supercritical CO2 as the solvent so that the performance of the organic conductors and semiconductors would not be adversely affected by other aggressive solvent. One disclosed method may also utilize a fluorinated photoresist together with the HFE solvent, but other fluorinated solvents can be used. In one embodiment, the fluorinated photoresist is a resorcinarene, but various fluorinated polymer photoresists and fluorinated molecular glass photoresists can be used as well. For example, a copolymer perfluorodecyl methacrylate (FDMA) and 2-nitrobenzyl methacrylate (NBMA) is a suitable orthogonal fluorinated photoresist for use with fluorinated solvents and supercritical carbon dioxide in a photolithography process.

Abstract: A method for forming patterns of organic polymer materials. The method can be used to form a layer with two patterned organic polymer materials. The photoresist and solvents used in the photoresist deposition and removal steps do not substantially affect the organic polymer materials.

Abstract: An orthogonal process for photolithographic patterning organic structures is disclosed. The disclosed process utilizes fluorinated solvents or supercritical CO2 as the solvent so that the performance of the organic conductors and semiconductors would not be adversely affected by other aggressive solvent. One disclosed method may also utilize a fluorinated photoresist together with the HFE solvent, but other fluorinated solvents can be used. In one embodiment, the fluorinated photoresist is a resorcinarene, but various fluorinated polymer photoresists and fluorinated molecular glass photoresists can be used as well. For example, a copolymer perfluorodecyl methacrylate (FDMA) and 2-nitrobenzyl methacrylate (NBMA) is a suitable orthogonal fluorinated photoresist for use with fluorinated solvents and supercritical carbon dioxide in a photolithography process.

Abstract: A method for patterning biomaterials is presented. The biomaterials exhibit biological activity after patterning. The use of bio-compatible imaging materials and solvents allows conventional lithographic patterning methods to be applied to patterning biomolecules. The method allows deposition of multiple layers without subsequent layers affecting earlier laid deposits and can pattern multiple different biomolecules on a single surface.

Abstract: A method is provided for forming a multi-color OLED device that includes providing a substrate, coating the substrate with a fluorinated photoresist solution to form a first photo-patternable layer and exposing it to produce a first pattern of exposed fluorinated photoresist material and a second pattern of unexposed fluorinated photoresist material, developing the photo-patternable layer with a fluorinated solvent to remove the second pattern of unexposed fluorinated photoresist material without removing the first pattern of exposed fluorinated photoresist material, depositing a first organic light-emitting material over the substrate to form a first organic light-emitting layer for emitting a first color of light and applying the first pattern of exposed fluorinated photoresist material to control the removal of a portion of the first organic light-emitting layer.

Abstract: An orthogonal process for photolithographic patterning organic structures is disclosed. The disclosed process utilizes fluorinated solvents or supercritical CO2 as the solvent so that the performance of the organic conductors and semiconductors would not be adversely affected by other aggressive solvent. One disclosed method may also utilize a fluorinated photoresist together with the HFE solvent, but other fluorinated solvents can be used. In one embodiment, the fluorinated photoresist is a resorcinarene, but various fluorinated polymer photoresists and fluorinated molecular glass photoresists can be used as well. For example, a copolymer perfluorodecyl methacrylate (FDMA) and 2-nitrobenzyl methacrylate (NBMA) is a suitable orthogonal fluorinated photoresist for use with fluorinated solvents and supercritical carbon dioxide in a photolithography process.