Patents by Inventor Jin-Kyung Cho

Jin-Kyung Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240067668
    Abstract: The present invention relates to a heteroaryl derivative compound and a use thereof. Since the heteroaryl derivative of the present invention exhibits excellent inhibitory activity against EGFR, the heteroaryl derivative can be usefully used as a therapeutic agent for EGFR-associated diseases.
    Type: Application
    Filed: December 29, 2021
    Publication date: February 29, 2024
    Inventors: Yi Kyung Ko, Ah Reum Han, Jin Hee Park, Yeong Deok Lee, Hye Rim Im, Kyun Eun Kim, Dong Keun Hwang, Su Been Nam, Myung Hoe Heo, Se Rin Cho, Eun Hwa Ko, Sung Hwan Kim, Hwan Geun Choi
  • Patent number: 9765210
    Abstract: Disclosed herein is a thermoplastic resin composition. The thermoplastic resin composition includes: a matrix resin including a resin including a methyl methacrylate repeat unit; and an impact modifier, wherein the impact modifier includes a first core-shell type impact modifier including a butadiene rubber polymer core and a second core-shell type impact modifier including an acrylate rubber polymer core, and the second impact modifier is present in a greater amount than the first impact modifier. The thermoplastic resin composition can exhibit excellent properties in terms of weatherability, colorability, and gloss.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: September 19, 2017
    Assignee: Lotte Advanced Materials Co., Ltd.
    Inventors: Jin Kyung Cho, Kee Hae Kwon, In Chol Kim, Chang Min Hong
  • Publication number: 20170066889
    Abstract: The present invention relates to a painted molding article in which a paint composition is painted in a molding part formed of an injection molding thermoplastic resin composition, and the injection molding thermoplastic resin composition comprises: (a) a base resin including polyamide (a-1) and polyphenylene ether (a-2); (b) an impact modifier; and (c) a carbon fibril, wherein the polyamide (a-1) forms a matrix phase of the injection molding thermoplastic resin composition, the polyphenylene ether (a-2) and the impact modifier (b) form a domain phase of the injection molding thermoplastic resin composition, the carbon fibril (c) is dispersed on the domain phase and the matrix phase, the content of the carbon fibril (c) dispersed on the matrix phase is higher than the content of the carbon fibril (c) dispersed on the domain phase, and the ratio of weight of the carbon fibril (c) to weight of the polyamide (a-1) may be 0.006 to 0.03.
    Type: Application
    Filed: May 30, 2014
    Publication date: March 9, 2017
    Inventors: Chang Min HONG, Doo Young KIM, Won Young CHOI, Jin-Kyung CHO, Won KO, Jung Hun LEE
  • Publication number: 20160304711
    Abstract: Disclosed herein is a thermoplastic resin composition. The thermoplastic resin composition includes: a matrix resin including a resin including a methyl methacrylate repeat unit; and an impact modifier, wherein the impact modifier includes a first core-shell type impact modifier including a butadiene rubber polymer core and a second core-shell type impact modifier including an acrylate rubber polymer core, and the second impact modifier is present in a greater amount than the first impact modifier. The thermoplastic resin composition can exhibit excellent properties in terms of weatherability, colorability, and gloss.
    Type: Application
    Filed: April 15, 2016
    Publication date: October 20, 2016
    Inventors: Jin Kyung CHO, Kee Hae KWON, In Chol KIM, Chang Min HONG
  • Patent number: 9355754
    Abstract: An electroconductive polyamide/polyphenylene ether resin composition and a molded product for vehicle manufactured using the same includes a base resin (a) including polyphenylene ether (a-1) and polyamide (a-2); an impact modifier (b); a compatibilizer (c); and an electroconductive filler (d). The electroconductive filler (d) includes aromatic compounds having molecular weights of about 120 to about 1,000 g/mol, wherein the aromatic compounds are byproducts generated when preparing the electroconductive filler (d).
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: May 31, 2016
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Chang Min Hong, Doo Young Kim, Wonyoung Choi, Jung Hun Lee, Jin-Kyung Cho
  • Patent number: 9074094
    Abstract: A thermoplastic resin composition includes a base resin including (A) about 16 to about 73 wt % of polyphenylene ether; (B) about 18 to about 82 wt % of polyamide; and (C) about 1 to about 20 wt % of a polyethylene-based polymer; (D) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having at least two carboxyl groups and (E) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having a carboxyl group or an acid anhydride group along with a carbon-carbon double bond, based on about 100 parts by weight of the base resin.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: July 7, 2015
    Assignee: Cheil Industries Inc.
    Inventors: Doo-Young Kim, Jung-Hun Lee, Jin-Kyung Cho, Do-Hoon Chang, Chang-Min Hong
  • Publication number: 20150187458
    Abstract: An electroconductive polyamide/polyphenylene ether resin composition and a molded product for vehicle manufactured using the same includes a base resin (a) including polyphenylene ether (a-1) and polyamide (a-2); an impact modifier (b); a compatibilizer (c); and an electroconductive filler (d). The electroconductive filler (d) includes aromatic compounds having molecular weights of about 120 to about 1,000 g/mol, wherein the aromatic compounds are byproducts generated when preparing the electroconductive filler (d).
    Type: Application
    Filed: December 30, 2014
    Publication date: July 2, 2015
    Inventors: Chang Min Hong, Doo Young Kim, Wonyoung Choi, Jung Hun Lee, Jin-Kyung Cho
  • Publication number: 20150187457
    Abstract: Provided herein is an electroconductive polyamide/polyphenylene ether resin composition, a method for preparing the same, and a molded product for vehicle manufactured using the same. The composition includes a base resin (a) including polyphenylene ether (a-1) and polyamide (a-2); an impact modifier (b); a compatibilizer (c); and an electroconductive filler (d), wherein a pH of the electroconductive filler (d) is about 4 to about 8.
    Type: Application
    Filed: December 30, 2014
    Publication date: July 2, 2015
    Inventors: Chang Min Hong, Doo Young Kim, Wonyoung Choi, Jung Hun Lee, Jin-Kyung Cho
  • Patent number: 8946337
    Abstract: Provided are a thermoplastic resin composition including a thermoplastic resin and an amorphous sheet-shaped metal particle having a ratio of thickness relative to long diameter of about 1:20 to about 1:1, and a molded product using the same.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: February 3, 2015
    Assignee: Cheil Industries Inc.
    Inventors: Hyung-Tak Lee, Doo-Han Ha, Jin-Kyung Cho, Young-Chul Kwon
  • Patent number: 8835558
    Abstract: Disclosed is a polylactic acid/polycarbonate resin composition including (A) a mixed resin including (a1) a polycarbonate resin and (a2) a polylactic acid resin, and (B) a modified acrylic-based resin, and a molded product made using the same.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: September 16, 2014
    Assignee: Cheil Industries Inc.
    Inventors: Hyung-Tak Lee, Doo-Han Ha, Chang-Do Jung, Young-Chul Kwon, Jin-Kyung Cho, Young-Mi Chung, Byung-Choon Lee
  • Publication number: 20140187686
    Abstract: A thermoplastic resin composition includes a base resin including (A) about 16 to about 73 wt % of polyphenylene ether; (B) about 18 to about 82 wt % of polyamide; and (C) about 1 to about 20 wt % of a polyethylene-based polymer; (D) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having at least two carboxyl groups and (E) about 0.05 to about 1 part by weight of a multi-functional compatibilizer having a carboxyl group or an acid anhydride group along with a carbon-carbon double bond, based on about 100 parts by weight of the base resin.
    Type: Application
    Filed: December 30, 2013
    Publication date: July 3, 2014
    Applicant: Cheil Industries Inc.
    Inventors: Doo-Young KIM, Jung-Hun LEE, Jin-Kyung CHO, Do-Hoon CHANG, Chang-Min HONG
  • Patent number: 8618209
    Abstract: Disclosed are a polyamide resin composition that includes (A) a crystalline polyamide mixed resin including an aliphatic group and at least two different crystalline polyamide resins, (B) a non-crystalline polyamide resin including an aromatic group, and (C) a glass fiber, and a molded product manufacture using the same.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: December 31, 2013
    Assignee: Cheil Industries Inc.
    Inventors: Ywan-Hee Lee, Young-Seok Chang, Jin-Kyung Cho, Doo-Han Ha, Jin-Young Huh
  • Publication number: 20130231437
    Abstract: The present invention relates to a thermoplastic resin composition, comprising: a base resin comprising (A) a polyphenylene ether resin and (B) an aromatic vinyl-based resin, and (C) glass fibers, wherein the (C) glass fibers include (C1) chopped glass fibers and (C2) milled glass fibers.
    Type: Application
    Filed: April 19, 2013
    Publication date: September 5, 2013
    Applicant: Cheil Industries Inc.
    Inventors: Jin Kyung CHO, Do Hoon CHANG, Jin Young HUH, Ywan Hee LEE, Doo Han HA
  • Publication number: 20120270988
    Abstract: Provided are a thermoplastic resin composition including a thermoplastic resin and an amorphous sheet-shaped metal particle having a ratio of thickness relative to long diameter of about 1:20 to about 1:1, and a molded product using the same.
    Type: Application
    Filed: June 28, 2012
    Publication date: October 25, 2012
    Applicant: Cheil Industries Inc.
    Inventors: Hyung-Tak Lee, Doo-Han Ha, Jin-Kyung Cho, Young-Chul Kwon
  • Publication number: 20120264869
    Abstract: Provided are a thermoplastic resin composition including a thermoplastic resin and a metal particle obtained by punching that has a ratio of thickness relative to long diameter of about 1:7 to about 1:1, and a molded product using the same.
    Type: Application
    Filed: June 28, 2012
    Publication date: October 18, 2012
    Applicant: Cheil Industries Inc.
    Inventors: Hyung-Tak LEE, Doo-Han HA, Jin-Kyung CHO, Young-Chul KWON
  • Patent number: 8232343
    Abstract: An environmentally-friendly polylactic acid resin composition includes (A) a mixed resin including (a1) a polylactic acid (PLA) resin and (a2) a polycarbonate resin, and (B) a compatibilizer capable of forming a stereo-complex with the polylactic acid resin. According to the present invention, the polylactic acid resin composition is environmentally-friendly and has excellent appearance and improved welding impact strength, as well as improved mechanical strength and heat resistance. Accordingly, it can be used for manufacturing various molded products requiring heat resistance and mechanical strength, for example electronic parts, office machines, miscellaneous goods, and the like.
    Type: Grant
    Filed: May 1, 2009
    Date of Patent: July 31, 2012
    Assignee: Cheil Industries Inc.
    Inventors: Young-Mi Chung, Chang-Do Jung, Young-Jun Lee, Ji-Won Pack, Young-Chul Kwon, Hyung-Tak Lee, Jin-Kyung Cho
  • Publication number: 20120172515
    Abstract: Polyphenylene ether thermoplastic resin compositions are formed by adding a polyamide resin to a composition of a polyphenylene ether resin and a polystyrene resin. The composition can have improved heat deflection temperature while maintaining fluidity of polyphenylene ether.
    Type: Application
    Filed: November 21, 2011
    Publication date: July 5, 2012
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Jin Kyung CHO, Do Hoon CHANG, Doo Han HA, Ywan Hee LEE, Jin Young HUH
  • Publication number: 20120157606
    Abstract: Disclosed are a polyamide resin composition that includes (A) a crystalline polyamide mixed resin including an aliphatic group and at least two different crystalline polyamide resins, (B) a non-crystalline polyamide resin including an aromatic group, and (C) a glass fiber, and a molded product manufacture using the same.
    Type: Application
    Filed: December 20, 2011
    Publication date: June 21, 2012
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Ywan-Hee LEE, Young-Seok CHANG, Jin-Kyung CHO, Doo-Han HA, Jin-Young HUH
  • Patent number: 8133943
    Abstract: Disclosed is a polylactic acid/polycarbonate resin composition including (A) about 100 parts by weight of a mixed resin including: (a1)) about 10 to about 90 wt % of a polycarbonate resin and (a2) about 10 to about 90 wt % of a polylactic acid resin; (B) about 1 to about 50 parts by weight of a flame retardant based on about 100 parts by weight of the mixed resin; (C) about 1 to about 30 parts by weight of an acryl-based copolymer based on about 100 parts by weight of the mixed resin; and (D) about 1 to about 20 parts by weight of an impact-reinforcing agent based on about 100 parts by weight of the mixed resin.
    Type: Grant
    Filed: November 18, 2009
    Date of Patent: March 13, 2012
    Assignee: Cheil Industries Inc.
    Inventors: Jin-Kyung Cho, Hyung-Tak Lee, Doo-Han Ha, Chang-Do Jung
  • Publication number: 20100261844
    Abstract: A thermoplastic resin composition includes a polycarbonate resin, a low molecular weight polymethyl(meth)acrylate resin, and a core-shell graft copolymer, and the low molecular weight polymethyl(meth)acrylate resin has a weight average molecular weight ranging from 5000 to 30,000. The thermoplastic resin composition can have excellent scratch resistance, impact resistance, and transparency, and accordingly can be used in various molded products such as external parts of electronics, external materials of a car, and the like, which can simultaneously require scratch and impact resistance and transparency.
    Type: Application
    Filed: June 28, 2010
    Publication date: October 14, 2010
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Byung-Choon LEE, Tae-Uk KIM, Jin-Kyung CHO