Abstract: The invention disclose a pixel in an image sensor capable of detecting infrared light and associated fabrication method. The image sensor includes a semiconductor substrate having a first photodiode and a second photodiode adjacent to the first photodiode. A planarized dielectric layer having a recessed region is disposed on a first side of the semiconductor substrate. A first color filter is disposed on the planarized dielectric layer aligned with the first photodiode and configured to transmit light of a first wavelength range. A second color filter is disposed in the recessed region and on the planarized dielectric layer. The second color filter is aligned with the second photodiode, and configured to transmit light of a second wavelength range that is different from the first wavelength range. A first depth-wise thickness of the first color filter is less than a second depth-wise thickness of the second color filter.

Abstract: An electrical machine is provided, in particular a dual three-phase fractional slot synchronous machine, including: a stator providing plural slots between plural teeth; a first multi-phase winding set; and a second multi-phase winding set, wherein the first winding set and the second winding set are both provided as star-delta connection and at least partially arranged in the slots and wound around the teeth.

Abstract: Use of 6-phosphogluconic acid and a derivative thereof in preparing a medicament for preventing or treating glycometabolism disorder diseases. The 6-phosphogluconic acid and the derivative thereof are a type of cell glycometabolism regulators and diabetes treatment agents, have a remarkable regulation effect on islet alpha cells, and can be further prepared into a medicament for preventing or treating diabetes and other glycometabolism disorder diseases.

Abstract: A charging device configured to be operably mechanically and electrically connected with a plurality of battery packs to transmit power to battery packs or to allow the battery packs to transmit power to the charging device, wherein the charging device comprises: a first battery pack engaging portion arranged on a first surface for mechanically and electrically connecting with a first battery pack; a second battery pack engaging portion arranged on a second surface for mechanically and electrically connecting with a second battery pack; and an output port arranged on a third surface and configured to transmit power to the external device. The charging device controls, in a predetermined manner, the charging/discharging operations of the battery pack(s)/external device connected to the charging device in a case where the charging device is connected to the power grid or not connected to the power grid.

Abstract: A corrugated pipe connection device for a continuous section at the top of a continuous T-shaped beam bridge pier. The connection device includes a combined steel pipe telescopic device and a corrugated pipe connector, the interiors being hollow; the connector includes a first clamping member for clamping a wall surface of a corrugated pipe; one end of the telescopic device is a second clamping member with the same structure as the first; the other end is a telescopic steel pipe which is telescopic in the length direction; and the telescopic steel pipe is connected to the connector. The device replaces a corrugated pipe between two T-shaped beams, thereby avoiding problems such as breakage and slurry leakage caused by an original construction mode. The device can stretch out and draw back according to a distance between the T-shaped beams, and steel strands can be stranded by means of a stranding machine.

Abstract: A cathode for rare earth molten salt electrolysis is provided. The cathode includes a column. The bottom of the column includes a cone. The peak of the cone includes a sharp tip or a flat surface. When the peak of the cone is the sharp tip, an opening angle of the sharp tip is between 5 degree and 175 degree. An electrolysis system having a cathode is also provided.

Abstract: A semiconductor component includes a semiconductor substrate, conductive vias in the substrate having terminal portions, a polymer layer on the substrate and back side conductors formed by the terminal portions of the conductive vias embedded in the polymer layer. A stacked semiconductor component includes a plurality of components having aligned conductive vias in electrical communication with one another.

Abstract: An electrolysis device, a stirring deposition equipment, a circulating deposition system, and an electrolysis method are provided. The electrolysis device is configured to electro-precipitate a magnetic deposition from a working fluid. The electrolysis device includes an anode plate, a cathode plate, and a magnetic component. The cathode plate and the anode plate are disposed correspondingly, and the magnetic component is disposed on a side of the cathode plate relatively away from the anode plate. The working fluid flows between the anode plate and the cathode plate, and an oxidation-reduction reaction occurs between the anode plate and the cathode plate. The magnetic component attaches the magnetic deposition resolved from the working fluid onto a surface of the cathode plate facing the anode plate. The magnetic deposition includes a product and a half-reactant.

Abstract: The present invention belongs to the technical field of electrical appliances, especially relates to a heating unit, a heating inner chamber and a hanging ironing machine, wherein the heating unit comprises an integrated heating tube, the integrated heating tube is in a continuous and double-layers stacked shape, and a single-layer structure of the integrated heating tube is configured to include at least two sections of straight tubes that extend along a length direction. Through reasonable spatial structure, a total length of a single tube is increased as much as possible in the range of small space, thereby increasing the maximum power of the whole heating tube, thus to prevent damage and safety hazards caused by excessive currents and powers due to unstable control voltages.

Abstract: A contact center service is configured, deployed, and operated for a limited term in connection with an event. Configurations to provide a contact center service for an event are defined according to a term of the event and one or more service features available for attendees of the event to use. The contact center service is deployed at or prior to the start of the term of the event according to the configurations. Responsive to deploying the contact center service, the service features are facilitated via the contact center service, such as to enable contact center engagements between agents and users as event attendees. The contact center service is eventually terminated based on an expiration of the term. Contact center as a service software used to configure, deploy, and operate the contact center service may be integrated with an event system used to implement the event.

Abstract: An electronic component cleaning method for performing cleaning on a surface of a wafer includes: a wet cleaning process of performing wet cleaning on the surface of the wafer by hydrogen water and pure water; a dry cleaning process of performing dry cleaning on the surface of an electronic component by atmospheric-pressure plasma after the wet cleaning; and a hydrogen water treatment process of performing cleaning on the surface of the wafer using hydrogen water obtained by dissolving hydrogen gas into water, after the dry cleaning process.

Abstract: A semiconductor package structure includes a package substrate. The package substrate includes a first core structure, a plurality of first dielectric layers, a plurality of first metal layers, a plurality of second dielectric layers, and a plurality of second metal layers. The first core structure has a first surface and a second surface opposite the first surface. The first dielectric layers and the first metal layers are alternatingly stacked on the first surface of the first core structure. The second dielectric layers and the second metal layers are alternatingly stacked on the second surface of the first core structure. A number of second dielectric layers is less than a number of first dielectric layers.

Abstract: A semiconductor package includes a package substrate, an interposer disposed on the package substrate, a central logic die and peripheral function dies disposed on the interposer, and at least one dummy die disposed between the central logic die and the peripheral function dies so as to form a rectangular shaped die arrangement. The at least one dummy die is disposed at a corner position of the rectangular shaped die arrangement. An underfill fills a gap between the interposer and the package substrate. A stress-reducing buffer structure is disposed on a bottom surface of the interposer.

Abstract: The present invention provides a method of treating a cancer in an individual using activated T cells or PBMCs induced by antigen presenting cells (such as dendritic cells) loaded with a plurality of tumor antigen peptides. The method may further comprise administration of the antigen presenting cells loaded with the plurality of tumor antigen peptides to the individual. The methods may be used singly or in combination with an immune checkpoint inhibitor. Precision therapy methods customized for the individual using neoantigen peptides or based on the mutation load in the tumor of the individual are provided. Methods of preparing the activated T cells, methods of monitoring the treatment, and methods of cloning tumor-specific T cell receptors are further disclosed. An isolated population of cells comprising the activated T cells, as well as compositions and kits useful for cancer immunotherapy are also provided.

Abstract: A high-power high-frequency electric heating system for a laser optical pump atomic magnetometer is provided, including an oscillation generating module, a temperature detecting module, a control module, a power output module and a coil heating module; wherein the oscillation generating module is used for transmitting 1 MHz oscillation signals; the temperature detecting module is used for measuring temperature of the alkali metal gas chamber to obtain differential voltage; the control module performs an amplitude modulation on the 1 MHz oscillation signals based on the differential voltage to obtain 1 MHz oscillation signals after the amplitude modulation; the power output module is used for performing voltage amplifying on the 1 MHz oscillation signals after the amplitude modulation and inputting the 1 MHz oscillation signals after the amplitude modulation to the coil heating module; the coil heating module is used for heating alkali metal gas chamber based on received voltage.

Abstract: A compound of the following formula: which is capable of binding to an E3 ubiquitin ligase cereblon (CRBN). An application of the compound, or a stereoisomer, a deuterated compound or a pharmaceutically acceptable salt thereof in the preparation of drugs for the treatment of diseases associated with abnormal cell proliferation and targeted protein degradation is also provided.

Abstract: A combined fixture for automatic production of a micro coaxial cable harness is provided, including a fixing mold arranged on a workbench, a fixing assembly positioned and arranged on the fixing mold and a positioning and cutting assembly. The fixing assembly includes a first fixing piece and a second fixing piece arranged in up-and-down correspondence, and the first fixing piece is provided with multiple first cable harness grooves arranged side by side for fixing a coaxial cable harness. The positioning and cutting assembly includes two copper sheet welding pads symmetrically arranged on the fixing mold, the two copper sheet welding pads are respectively arranged on two sides of the fixing assembly, and each of the copper sheet welding pads is provided with second cable harness grooves corresponding to the first cable harness grooves.

Abstract: A host device acting as a wireless hotspot can suffer poor network performance when many client devices are connected simultaneously, particularly devices with a poor connection speed. To improve network performance, the host device can identify a client device with the worst network connectivity based on wireless signal strength, a peer-to-peer (P2P) packet drop rate, and a P2P ping response time, and instruct the client device to scan the other client devices to identify the best candidate to serve as a new host device for the client device. The hotspot functionality can then be offloaded to the new host device with respect to the client device, thereby reducing the number of client devices connected directly to the main host device and improving the network performance of the client device.

Abstract: A device capability discovery method and a P2P device are provided, and relate to the communications field and the distributed hardware field, to shorten time consumed to obtain capability information of a discovered device. A P2P device receives a probe request frame from another device. The P2P device returns a probe response frame including capability information of the P2P device. A device that receives the probe response frame can obtain a capability of the device in a device discovery phase. Alternatively, a P2P device sends a probe request frame including capability information of the P2P device to another device, so that the another device can obtain a capability of the device in a device discovery phase.