Abstract: A conductive connection structure for a conductive wiring layer of a flexible circuit board includes a first through hole and a second through hole formed in a lamination structure including a conductive wiring layer, a first covering layer, and a second covering layer. The first through hole extends through the first covering layer and the conductive wiring layer. The second through hole extends through the second covering layer. The second through hole is formed at a location corresponding to an exposed zone on a second surface of the conductive wiring layer and communicates with the first through hole. A first conductive paste layer is formed on a surface of the first covering layer and fills in the first through hole to form a pillar portion in the first through hole. The pillar portion has a bottom end forming a curved cap. The exposed zone of the second surface of the conductive wiring layer is at least partially covered by the curved cap.

Abstract: An attenuation reduction grounding structure of differential-mode signal transmission lines of a flexible circuit board includes a flexible substrate on which at least one pair of differential-mode signal lines, at least one grounding line, a covering insulation layer, and a thin metal foil layer are formed. At least one via hole extends through the thin metal foil layer and the covering insulation layer and corresponds to a conductive contact zone of the grounding line. The via hole is filled with a conductive paste layer to electrically connect the thin metal foil layer to the conductive contact zone of the grounding line to provide an excellent grounding arrangement. The thin metal foil layer includes a plurality of openings formed at locations corresponding to top angles of the differential-mode signal lines.

Abstract: Disclosed is a flexible circuit cable with at least two bundled wire groups. The circuit cable has first and second ends respectively connected to first and second connection sections. The circuit cable includes a cluster section, which is formed of a plurality of cluster wires formed by slitting the circuit cable, in an extension direction of the cable, at a predetermined cut width. The cluster section includes at least two independent bundles, which are formed by dividing the cluster wires of the circuit cable into different signal groups according to electrical signals transmitted therethrough. Bundling members are used to the cluster wires of the independent bundles according to predetermined bundling modes. Further, the circuit cable has a surface forming a shielding conductive layer for electromagnetic interference protection and impedance control for internal signals of the circuit cable.

Abstract: An attenuation reduction grounding pattern structure for connection pads of a flexible circuit board includes a plurality of high frequency connection pads formed on a component surface of a substrate and a plurality of differential mode signal lines arranged on the substrate and connected to the high frequency connection pads. The substrate has a grounding surface forming a grounding layer. The grounding layer includes an attenuation reduction grounding pattern structure formed at a location corresponding to the transition zone and including a hollowed area and a protruded portion. The protruded portion extends a predetermined length in a direction from the grounding layer toward the high frequency connection pads and along the adjacent high frequency connection pads to reach the transition zone. The protruded portion and the high frequency connection pads form a polarization-direction-varying electric field in the transition zone.

Abstract: A method is performed at a computer server for enabling voice communication between two terminals through IM service. Upon receiving a message from a remote computer, the message including an IM identifier of a callee terminal user and a mobile device identifier of the terminal, the computer system updates an entry for the callee terminal user in a database. Upon receiving a request from a caller terminal user at a caller terminal to start voice communication with the callee terminal user, the computer server identifies the entry that includes the IM identifier of the callee terminal user and sends a voice communication request to a service control point (SCP) in a switched telephone network. The SCP then returns an IP address and a port number of the callee terminal and launches a call request against the callee terminal. The computer server establishes a voice communication channel between the two terminals.

Abstract: A bundled flexible flat circuit cable includes a flexible substrate that forms at least one cluster section having an end forming at least one first connection section and an opposite end forming at least one second connection section. Both the first and second connection sections or one of the first and second connection sections form a stack structure. The flexible substrate can be of a structure of single-sided or double-sided substrate and may additionally include an electromagnetic shielding layer. A bundling structure is provided to bundle the cluster section at a predetermined location to form a bundled structure. The bundling structure can be made of a shielding material, an insulation material, or a combination of shielding material and insulation material.

Abstract: A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.

Abstract: The present invention provides methods for treating disorders arising from hypogonadism by administering myostatin antagonists to subjects suffering from such disorders.

Abstract: A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.

Abstract: Disclosed is a grounding pattern structure for high-frequency connection pads of a circuit board. A substrate of the circuit board includes a component surface on which at least a pair of high-frequency connection pads. At least a pair of differential mode signal lines are formed on the substrate and connected to the high-frequency connection pads. The grounding surface of the substrate includes a grounding layer formed at a location corresponding to the differential mode signal lines. The grounding surface of the substrate includes a grounding pattern structure formed thereon to correspond to a location adjacent to the high-frequency connection pads. The grounding pattern structure is electrically connected to the grounding layer. The component surface of the substrate can be provided with a connector mounted thereto with signal terminals of the connector soldered to the high-frequency connection pads.

Abstract: Disclosed herein is an oral dosage formulation that contains both immediate-release and sustained release drugs for treating neurodegenerative disorders. The immediate-release drug in the oral dosage formulation is an acetylcholinesterase inhibitor (AChEI) with a dissolution rate of releasing more than 80% of the AChEI within 60 min; and the sustained-release drug is memantine with a dissolution rate of releasing more than 80% of memantine within 12 hours.

Abstract: Methods and apparatus to provide loop parallelization based on loop splitting and/or index array are described. In one embodiment, one or more split loops, corresponding to an original loop, are generated based on the mis-speculation information. In another embodiment, a plurality of subloops are generated from an original loop based on an index array. Other embodiments are also described.

Abstract: The present invention relates to valved cryogenic refrigerators, in particular, Gifford McMahon (GM) refrigerators, and GM type pulse tube refrigerators where gas is cycled between high and low pressures by a valve mechanism that connects to an expander. Input power is reduced by use of a buffer volume which stores gas that flows to and from the warm end of the regenerator through a valve that opens and closes during the periods when the main supply and return valves are closed and is closed when the main supply and return valves are open.

Abstract: A connection structure for a flexible circuit cable includes a flexible circuit cable that has a flexible circuit substrate having a first end bonded to a soldering stage of the connector housing with first finger pad conductive contacts of conductive lines of the flexible circuit cable respectively corresponding to cable soldering sections of metal conductive terminals of the connector. A soldering layer is formed between a metal coating layer of the first finger pad conductive contact of each of the conductive lines and the cable soldering section of the corresponding metal conductive terminals to set the conductive lines of the flexible circuit cable in electrical connection with the metal conductive terminals of the connector.

Abstract: Disclosed is a soldering structure for mounting at least one connector on a flexible circuit board. The connector includes SMD pins and solder-dipping pins. The flexible circuit board has a connector mounting section having a component surface on which SMD soldering zones and solder-dipping pin holes are formed. A reinforcement plate is coupled to a reinforcement bonding surface of the flexible circuit board. The reinforcement plate has through holes corresponding to the solder-dipping pin holes of the flexible circuit board. The SMD pins of the connector are respectively soldered to the SMD soldering zones of the flexible circuit board, and the solder-dipping pins of the connector are respectively inserted through the solder-dipping pin holes of the flexible circuit board and the through holes of the reinforcement plate to the soldering surface of the reinforcement plate to be soldered with a solder material.

Abstract: A bundled flexible circuit cable with water resistant structure is provided, in which a flexible substrate forms a cluster section having a lap section. In the lap section, a plurality of flat cable components that collectively form the cluster section is arranged to stack by substantially paralleling each other and corresponding up and down and is bonded and positioned by being applied with an adhesive material. The flat cable components are enclosed by a water resistant component at the lap section, whereby water, liquids, and contaminants are prevented from moving through gaps present in the bundled flexible substrate to get into the enclosure of an electronic device so as to realize protection against water, humidity, and dust. A tubular member or a wrapping member is further provided to fit over a section of the cluster section other than the lap section in order to facilitate extension through a holed mechanism device, such as a hinge, and to improve resistance against flexing and bending.

Abstract: A rigid-flexible circuit board includes at least one flexible circuit board and at least one rigid circuit board. The flexible circuit board includes a flexible-board substrate, a plurality of flexible circuit board differential mode signal lines, at least one flexible circuit board grounding line, a flexible circuit board insulation layer formed on the upper surface of the flexible-board substrate and covering the flexible circuit board differential mode signal lines and the flexible circuit board grounding line. The rigid circuit board is stacked on the stacking section of the flexible circuit board. A shielding layer is formed on the flexible circuit board insulation layer of the flexible circuit board and corresponds to the extension section of the flexible circuit board. The shielding layer further extends from the extension section to the stacking section.

Abstract: An etchant for removing a porous low-k dielectric layer on a semiconductor substrate includes a hydrofluoric acid-based solvent, a dilating additive for dilating the pores in the porous low-k dielectric, and a passivating additive that forms a passivation layer at the interface between the low-k dielectric layer and the semiconductor substrate.

Abstract: The present invention discloses a filter device. The filter device comprises a housing with an air inlet and an filtered air outlet; a high voltage electric field region provided between two ends of the housing, wherein the direction of the electric field is perpendicular to the direction along which the air is introduced into the housing; an ionization source provided in the electric field region to ionize the ionizable pollutants present in the air introduced from the air inlet and form the resultant ionized pollutants which will move towards both ends of the housing under the influence of the electric field; and a discharging device for discharging the ionized pollutants which have arrived at the ends of the housing out of the filter device. The present invention also relates to a filtering method of using the filter device, and a trace detector.

Abstract: A connection structure for a flexible circuit cable includes a flexible circuit cable that has a flexible circuit substrate having a first end bonded to a soldering stage of the connector housing with first finger pad conductive contacts of conductive lines of the flexible circuit cable respectively corresponding to cable soldering sections of metal conductive terminals of the connector. A soldering layer is formed between a metal coating layer of the first finger pad conductive contact of each of the conductive lines and the cable soldering section of the corresponding metal conductive terminals to set the conductive lines of the flexible circuit cable in electrical connection with the metal conductive terminals of the connector.