Patents by Inventor Jin Min Cheon

Jin Min Cheon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR DEVICE ENCAPSULATING FILM, SEMICONDUCTOR DEVICE ENCAPSULATING FILM AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME
    Publication number: 20210363379
    Abstract: An epoxy resin composition for semiconductor device encapsulation films, a film for encapsulation of semiconductor devices, and a semiconductor device encapsulated using the same, the epoxy resin composition including a liquid epoxy resin; a curing agent; about 2 wt % to about 10 wt % of a binder resin; and about 50 wt % or more of an oxide, a nitride, a carbide, or a hydroxide of gadolinium, boron, samarium, cadmium, or europium, all wt % being based on a total weight of the epoxy resin composition.
    Type: Application
    Filed: May 12, 2021
    Publication date: November 25, 2021
    Inventors: Seung Woo HONG, Jin Min CHEON, Young Joon LEE
  • EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME
    Publication number: 20210355344
    Abstract: An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the same, the epoxy resin composition including an epoxy resin; a curing agent; and an inorganic filler, wherein the inorganic filler includes gadolinium oxide, samarium oxide, boron nitride, or boron carbide.
    Type: Application
    Filed: May 12, 2021
    Publication date: November 18, 2021
    Inventors: Jin Min CHEON, Young Joon LEE, Seung Woo HONG
  • Phosphonium-based compound, epoxy resin composition containing same, semiconductor device manufactured using same
    Patent number: 10385161
    Abstract: The present invention relates to a phosphonium-based compound represented by chemical formula 1, an epoxy resin composition containing the same, and a semiconductor device manufactured by using the same.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: August 20, 2019
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Min Gyum Kim, Jin Woo Choi, Ki Hyeok Kwon, Dong Hwan Lee, Joo Young Chung, Jin Min Cheon
  • Compound containing phosphonium ion, epoxy resin composition containing same, and device manufactured by using same
    Patent number: 10047191
    Abstract: The present invention relates to a compound containing phosphonium ion of a chemical formula 1, an epoxy resin composition containing the same, and a device manufactured by using the same.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: August 14, 2018
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Jin Min Cheon, Min Gyum Kim, Jung Seob Kim, Dong Hwan Lee, Hwan Sung Cheon, Seung Han
  • Pyridiniuivi-based compound, epoxy resin composition comprising same, and apparatus manufactured using same
    Patent number: 9957348
    Abstract: The present invention relates to a pyridinium-based compound of chemical formula 1, an epoxy resin composition comprising the same, and an apparatus manufactured by using the same.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: May 1, 2018
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Dong Hwan Lee, Min Gyum Kim, Jung Seob Kim, Jin Min Cheon, Hwan Sung Cheon, Seung Han
  • Phosphonium compound, preparation method thereof, epoxy resin composition including the same, and semiconductor device prepared by using the same
    Patent number: 9896465
    Abstract: A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1:
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: February 20, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Dong Hwan Lee, Min Gyum Kim, So Yoon Kim, Woo Chul Na, Yoon Man Lee, Ji Yoon Cho, Ki Hyeok Kwon, KyoungChul Bae, Eun Jung Lee, Joo Young Chung, Jin Min Cheon, Jin Woo Choi, Seung Han
  • Curing catalyst for epoxy resin composition, epoxy resin composition comprising same, and apparatus manufactured by using same
    Patent number: 9890238
    Abstract: The present invention relates to a curing catalyst for an epoxy resin composition represented by chemical formula 1, an epoxy resin composition comprising the same, and an apparatus manufactured using the same.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: February 13, 2018
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Jung Seob Kim, Min Gyum Kim, Dong Hwan Lee, Jin Min Cheon, Hwan Sung Cheon, Seung Han
  • Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared using the same
    Patent number: 9890307
    Abstract: A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1:
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: February 13, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Ki Hyeok Kwon, Min Gyum Kim, Joo Young Chung, Jin Min Cheon, Jin Woo Choi, Seung Han, Dong Hwan Lee
  • Epoxy resin composition for encapsulating a semiconductor device and semiconductor device prepared using the same
    Patent number: 9870971
    Abstract: An epoxy resin composition and a semiconductor device, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a silicon compound, wherein the curing catalyst includes a phosphonium compound represented by the following Formula 4 and the silicon compound comprises a silicon compound represented by the following Formula 7:
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: January 16, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Joo Young Chung, Ki Hyeok Kwon, Min Gyum Kim, Jin Min Cheon, Jin Woo Choi, Seung Han
  • Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared from the same
    Patent number: 9868751
    Abstract: A phosphonium compound, an epoxy resin composition, a method of preparing a phosphonium compound, and a semiconductor device encapsulated with the epoxy resin composition, the compound being represented by Formula 1:
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: January 16, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Min Gyum Kim, Ki Hyeok Kwon, Dong Hwan Lee, Joo Young Chung, Jin Min Cheon, Jin Woo Choi
  • Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared using the same
    Patent number: 9850390
    Abstract: An epoxy resin composition for encapsulation of a semiconductor device and a semiconductor device encapsulated with the epoxy resin composition, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a compound containing at least one hydroxyl group, wherein the curing catalyst includes a phosphonium compound represented by Formula 4:
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: December 26, 2017
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Jin Min Cheon, Ki Hyeok Kwon, Min Gyum Kim, Joo Young Chung, Jin Woo Choi, Seung Han
  • PHOSPHONIUM-BASED COMPOUND, EPOXY RESIN COMPOSITION CONTAINING SAME, SEMICONDUCTOR DEVICE MANUFACTURED USING SAME
    Publication number: 20170306079
    Abstract: The present invention relates to a phosphonium-based compound represented by chemical formula 1, an epoxy resin composition containing the same, and a semiconductor device manufactured by using the same.
    Type: Application
    Filed: January 22, 2016
    Publication date: October 26, 2017
    Inventors: Min Gyum KIM, Jin Woo CHOI, Ki Hyeok KWON, Dong Hwan LEE, Joo Young CHUNG, Jin Min CHEON
  • PHOSPHONIUM COMPOUND, EPOXY RESIN COMPOSITION INCLUDING THE SAME AND SEMICONDUCTOR DEVICE PREPARED USING THE SAME
    Publication number: 20170018473
    Abstract: A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1:
    Type: Application
    Filed: July 14, 2016
    Publication date: January 19, 2017
    Inventors: Ki Hyeok KWON, Min Gyum KIM, Joo Young CHUNG, Jin Min CHEON, Jin Woo CHOI, Seung HAN, Dong Hwan LEE
  • EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PREPARED USING THE SAME
    Publication number: 20170002192
    Abstract: An epoxy resin composition and a semiconductor device, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a silicon compound, wherein the curing catalyst includes a phosphonium compound represented by the following Formula 4 and the silicon compound comprises a silicon compound represented by the following Formula 7:
    Type: Application
    Filed: July 1, 2016
    Publication date: January 5, 2017
    Inventors: Joo Young CHUNG, Ki Hyeok KWON, Min Gyum KIM, Jin Min CHEON, Jin Woo CHOI, Seung HAN
  • EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PREPARED USING THE SAME
    Publication number: 20160379909
    Abstract: An epoxy resin composition for encapsulation of a semiconductor device and a semiconductor device encapsulated with the epoxy resin composition, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a compound containing at least one hydroxyl group, wherein the curing catalyst includes a phosphonium compound represented by Formula 4:
    Type: Application
    Filed: June 21, 2016
    Publication date: December 29, 2016
    Inventors: Jin Min CHEON, Ki Hyeok KWON, Min Gyum KIM, Joo Young CHUNG, Jin Woo CHOI, Seung HAN
  • PHOSPHONIUM COMPOUND, PREPARATION METHOD THEREOF, EPOXY RESIN COMPOSITION INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE PREPARED BY USING THE SAME
    Publication number: 20160368937
    Abstract: A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1:
    Type: Application
    Filed: June 22, 2016
    Publication date: December 22, 2016
    Inventors: Dong Hwan LEE, Min Gyum KIM, So Yoon KIM, Woo Chul NA, Yoon Man LEE, Ji Yoon CHO, Ki Hyeok KWON, KyoungChul BAE, Eun Jung LEE, Joo Young CHUNG, Jin Min CHEON, Jin Woo CHOI, Seung HAN
  • PYRIDINIUM-BASED COMPOUND, EPOXY RESIN COMPOSITION COMPRISING SAME, AND APPARATUS MANUFACTURED USING SAME
    Publication number: 20160333136
    Abstract: The present invention relates to a pyridinium-based compound of chemical formula 1, an epoxy resin composition comprising the same, and an apparatus manufactured by using the same.
    Type: Application
    Filed: May 9, 2014
    Publication date: November 17, 2016
    Inventors: Dong Hwan LEE, Min Gyum KIM, Jung Seob KIM, Jin Min CHEON, Hwan Sung CHEON, Seung HAN
  • CURING CATALYST FOR EPOXY RESIN COMPOSITION, EPOXY RESIN COMPOSITION COMPRISING SAME, AND APPARATUS MANUFACTURED BY USING SAME
    Publication number: 20160326303
    Abstract: The present invention relates to a curing catalyst for an epoxy resin composition represented by chemical formula 1, an epoxy resin composition comprising the same, and an apparatus manufactured using the same.
    Type: Application
    Filed: May 16, 2014
    Publication date: November 10, 2016
    Inventors: Jung Seob KIM, Min Gyum KIM, Dong Hwan LEE, Jin Min CHEON, Hwan Sung CHEON, Seung HAN
  • COMPOUND CONTAINING PHOSPHONIUM ION, EPOXY RESIN COMPOSITION CONTAINING SAME, AND DEVICE MANUFACTURED BY USING SAME
    Publication number: 20160159971
    Abstract: The present invention relates to a compound containing phosphonium ion of a chemical formula 1, an epoxy resin composition containing the same, and a device manufactured by using the same.
    Type: Application
    Filed: February 27, 2014
    Publication date: June 9, 2016
    Inventors: Jin Min CHEON, Min Gyum KIM, Jung Seob KIM, Dong Hwan LEE, Hwan Sung CHEON, Seung HAN
  • PHOSPHONIUM COMPOUND, EPOXY RESIN COMPOSITION INCLUDING THE SAME AND SEMICONDUCTOR DEVICE PREPARED FROM THE SAME
    Publication number: 20160115184
    Abstract: A phosphonium compound, an epoxy resin composition, a method of preparing a phosphonium compound, and a semiconductor device encapsulated with the epoxy resin composition, the compound being represented by Formula 1:
    Type: Application
    Filed: October 21, 2015
    Publication date: April 28, 2016
    Inventors: Min Gyum KIM, Ki Hyeok KWON, Dong Hwan LEE, Joo Young CHUNG, Jin Min CHEON, Jin Woo CHOI