Abstract: In a surface emitting laser package, a surface emitting laser element and a substrate may be electrically connected through a diffusion part. In detail, according to the surface emitting laser package, a housing includes a step, the diffusion part is disposed at the step of the housing, and the surface emitting laser element and the substrate may be electrically connected through a connection wiring extending through the housing to correspond to the step and a conductive line disposed at one side of the diffusion part.

Abstract: The present disclosure relates to a reverse-time migration method for marine vertical cable seismic (VCS) survey data and provides a reverse-time migration apparatus and method for vertical cable seismic (VCS) survey data using directional propagation of receiver wavefields, configured to perform equation-of-motion-based transform and inverse-transform processing on observed pressure wavefields during back-propagation of receiver wavefields to solve the problem of reflection boundary screening due to long-wavelength artifacts and avoid up/down wavefield separation to thereby simplify a migration process and improve overall quality of migration images.

Abstract: The present invention provides a medical robot which is hygienic and capable of precisely transferring a catheter, a driving device mounted on the medical robot, and a roller module mounted on the driving device. The roller module includes: a driving unit; and a roller unit rotated about the vertical axis by the driving unit, wherein the roller unit includes at least one roller and at least one shaft independently coupled to the at least one roller of the roller unit and rotated by the driving unit, wherein at least one groove is formed on the at least one roller of the roller unit and at least a part of the at least one shaft of the roller unit is disposed on the at least one groove.

Abstract: A semiconductor package that include first and second semiconductor chips bonded together, wherein the first semiconductor chip includes a first semiconductor substrate, a first semiconductor element layer and a first wiring structure sequentially stacked on a first surface of the first semiconductor substrate, first connecting pads and first test pads on the first wiring structure, and first front-side bonding pads, which are connected to the first connecting pads, wherein the second semiconductor chip includes a second semiconductor substrate, a second semiconductor element layer and a second wiring structure sequentially stacked on a third surface of the second semiconductor substrate, and first back-side bonding pads bonded to the first front-side bonding pads on the fourth surface of the second semiconductor substrate, and wherein the first test pads are not electrically connected to the second semiconductor chip.

Abstract: A fault diagnostic apparatus may include an upper case with a bottom having an opening, a lower case coupled to the bottom of the upper case, and a printed circuit board (PCB) substrate module including a substrate supported on an inner side of the upper case or the lower case, and a microphone disposed in the substrate adjacent to the vibration plate to generate a sensing signal of an acoustic wave by the vibration generated from the vibration plate. The lower case may have a vibration plate formed toward the upper case on a lower surface and be configured to vibrate itself in response to an external vibration.

Abstract: In a surface emitting laser package, a surface emitting laser element and a substrate may be electrically connected through a diffusion part. In detail, according to the surface emitting laser package, a housing includes a step, the diffusion part is disposed at the step of the housing, and the surface emitting laser element and the substrate may be electrically connected through a connection wiring extending through the housing to correspond to the step and a conductive line disposed at one side of the diffusion part.

Abstract: The present invention relates to an image processing system for a catheter operation. One embodiment comprises: a storage unit for at least temporarily storing a plurality of candidate routes on which a guide wire can proceed on a changing route caused by vascular bifurcations while proceeding from a first point by using a blood vessel image; and a processor for selecting, from an image inputted while an operation proceeds, at least one route corresponding to the current shape of the guide wire on the basis of a similarity comparison between the current shape of the guide wire and each of the plurality of candidate routes.

Abstract: An image signal processor includes a gradation detection module configured to receive a pixel signal from an external device and a correction module configured to receive the pixel signal. The correction module is connected to the gradation detection module. The gradation detection module is configured to estimate a gradient of the pixel signal, correct the pixel signal based on the gradient to generate a corrected pixel signal, calculate a first variance value based on the pixel signal, calculate a second variance value based on the corrected pixel signal, calculate a gradation probability value based on a comparison result between the first variance value and the second variance value, and generate a gradation map as information about the gradation probability value of the pixel signal. The correction module is configured to correct the pixel signal based on the gradation map.

Abstract: The present invention provides a medical robot which is hygienic and capable of precisely transferring a catheter, a driving device mounted on the medical robot, and a roller module mounted on the driving device. The roller module includes: a driving unit; and a roller unit rotated about the vertical axis by the driving unit, wherein the roller unit includes at least one roller and at least one shaft independently coupled to the at least one roller of the roller unit and rotated by the driving unit, wherein at least one groove is formed on the at least one roller of the roller unit and at least a part of the at least one shaft of the roller unit is disposed on the at least one groove.

Abstract: A semiconductor package includes a substrate, a semiconductor layer on the substrate, a wiring structure on the semiconductor layer, a connection pad on and connected to the wiring structure, a test pad on and connected to the wiring structure, the test and connection pads being horizontally spaced from each other, a first liner film on the wiring structure and having a first bonding pad trench, a second liner film on the first liner film and having a second bonding pad trench, a first bonding pad including a barrier layer in contact with the first liner film and a metal layer on the barrier layer, and a second bonding pad filling an inner portion of the second bonding pad trench and in contact with the second liner film, wherein the second liner film integrally covers upper surfaces of the barrier layer and metal layer.

Abstract: The present disclosure relates to a child checking apparatus and a method therefor. A child checking apparatus includes a processor configured to transmit an authentication response message corresponding to an authentication request message if the authentication request message is received from a switch device after a vehicle is turned off and to determine whether the switch device operates within a predetermined time period to issue a warning. The child checking apparatus also includes a storage configured to store data driven by the processor, an algorithm, and a PIN code for encryption.

Abstract: A hard coating composition includes a norbornene-based compound represented by a Chemical Formula 1 and a polymer including at least one of an epoxy-based resin, a polyurethane-based resin, or an acrylic resin.

Abstract: A method of manufacturing a flexible display substrate using a process film and a process film for manufacturing a flexible display substrate are provided. The method of manufacturing the flexible display substrate using the process film is as follows. A base layer for the flexible display substrate is prepared on a glass substrate. A packaging process is performed on the base layer to form a plurality of cells which are spaced apart from one another at a predetermined distance. The base layer is covered with the process film, after forming the plurality of cells. The base layer is separated from the glass substrate, while the base layer is laminated to the process film. The base layer is cut along each cell to form a plurality of flexible display substrates.

Abstract: A method of manufacturing an optoelectronic device includes the steps of: providing a substrate; depositing a first electrode layer on the substrate; depositing a first charge-carrier selective layer with a thickness less than 5 nm situated directly on the first electrode layer; depositing insulating silicon oxide nanoparticles directly on the first charge-carrier selective layer, the particles having a diameter between 10 nm and 100 nm; depositing a perovskite-based semiconductor layer on the first charge-carrier selective layer and on the insulating silicon oxide nanoparticles, the perovskite-based semiconductor layer being in intimate contact with both the first charge-carrier selective layer and the insulating silicon oxide nanoparticles; depositing a second charge-carrier selective layer on the perovskite-based semiconductor layer; depositing a second electrode layer on the second charge-carrier selective layer.

Abstract: The present inventive concept relates to: a radiation detector including a bendable radiation detecting panel and a radiation inspection apparatus including same. The radiation detector includes: a radiation detecting panel which is flexible, extending in a first direction, and detecting radiation incident to a first face; and a bending support unit which is plate-shaped, provided on a second face of the radiation detecting panel opposite to the first face to support the radiation detecting panel, and having a flexibility. The flexibility of the bending support unit is less than a flexibility of the radiation detecting panel.

Abstract: A storage device and an operating method thereof are provided. Provided is a storage device including, a memory cell, and a storage controller which includes a flash controller that performs a data operation on the memory cell, and a processor that executes an RTOS (Real Time Operating System) for controlling the flash controller, wherein the RTOS communicates with the storage controller and operates in a normal operation mode, the RTOS generates a snapshot data in a debug mode when a defect occurs, the RTOS switches to the debug mode through context switching in the normal operation mode, and the RTOS operates in the normal operation mode, when an urgent work occurs, while performing an operation of generating the snapshot data in the debug mode.

Abstract: Provided is a reflector comprising: an outer wall; and an inner wall which reflects the xenon lamp light from a xenon lamp toward an object to be light sintered, and which consists of inner side walls and an inner top wall which are spaced apart by a predetermined distance from the outer wall to allow cooling water for cooling heat generated by the xenon lamp light to flow, wherein at least a part of the inner side walls has the same thickness as at least a part of the inner top wall.

Abstract: A method of manufacturing a semiconductor device is provided. The method includes forming a preliminary via structure through a portion of a substrate; partially removing the substrate to expose a portion of the preliminary via structure; forming a protection layer structure on the substrate to cover the portion of the preliminary via structure that is exposed; partially etching the protection layer structure to form a protection layer pattern structure and to partially expose the preliminary via structure; wet etching the preliminary via structure to form a via structure; and forming a pad structure on the via structure to have a flat top surface.

Abstract: A method of operating a memory system, which includes a memory controller and at least one non-volatile memory, includes storing, in the memory system, temperature-dependent performance level information received from a host disposed external to the memory system, setting an operation performance level of the memory system to a first performance level, operating the memory controller and the at least one non-volatile memory device according to the first performance level, detecting an internal temperature of the memory system, and changing the operation performance level of the memory system to a second performance level that is different from the first performance level. The operation performance level is changed by the memory controller of the memory system, and changing the operation performance level is based on the temperature-dependent performance level information and the detected internal temperature.