Abstract: A semiconductor package that include first and second semiconductor chips bonded together, wherein the first semiconductor chip includes a first semiconductor substrate, a first semiconductor element layer and a first wiring structure sequentially stacked on a first surface of the first semiconductor substrate, first connecting pads and first test pads on the first wiring structure, and first front-side bonding pads, which are connected to the first connecting pads, wherein the second semiconductor chip includes a second semiconductor substrate, a second semiconductor element layer and a second wiring structure sequentially stacked on a third surface of the second semiconductor substrate, and first back-side bonding pads bonded to the first front-side bonding pads on the fourth surface of the second semiconductor substrate, and wherein the first test pads are not electrically connected to the second semiconductor chip.

Abstract: The present disclosure relates to an apparatus for closed reduction of a bone fracture. The apparatus includes at least: a pulling adaptor including: a handle configured to be gripped by an operator; an insertion rod that is extended from the handle in a longitudinal direction of the handle, and configured to be inserted into the bone fracture which is depressed in at least one area thereof; and a pulling lug that is bent and extended from an end of the insertion rod such that a longitudinal direction of the pulling lug is perpendicular to a longitudinal direction of the insertion rod or such that the pulling lug is inclined with respect to the insertion rod, the pulling lug being configured to be inserted into the at least one depressed area of the bone fracture, in order to pull the bone fracture.

Abstract: A display device includes: a display panel having a display area and a non-display area at least partially disposed around the display area; and a touch sensor disposed on the display panel and including a touch sensor area in the display area and a touch peripheral area in the non-display area adjacent to the touch sensor area, wherein the touch sensor includes: a first touch electrode and a second touch electrode; a first touch pad and a second touch pad being adjacent to each other in a first direction; a second touch pad disposed in a touch pad area of the touch peripheral area; a first touch signal line electrically connecting the first touch electrode with the first touch pad, the first touch signal line including a first line portion extended in the first direction and a second line portion extended in a second direction; a second touch signal line electrically connecting the second touch electrode with the second touch pad; a first dummy line extended in the first direction and spaced apart from the f

Abstract: The present invention relates to a method for preparing a chitosan succinate having excellent solubility and biocompatibility, and to a succinylated chitosan prepared thereby. The method for preparing a chitosan succinate according to the present invention can prepare a chitosan-based bio-substance having excellent hydrophilicity, cell proliferation rate, cell affinity, and cell proliferation performance through a simple process, thereby having excellent usability in vivo.

Abstract: The present technique pertains to a method of preparation of a succinylated collagen-fibrinogen hydrogel and a succinylated collagen-fibrinogen hydrogel prepared thereby. The method of preparation of a succinylated collagen-fibrinogen hydrogel according to the present technique can produce a collagen-based bio-substance in a simple process, wherein collagen can be prevented from being entangled and an improvement can be brought about in hydrophilicity, cell growth rate, cell compatibility, and cell diffusion capability, whereby the collagen-based bio-substance exhibits excellent biocompatibility in vivo.

Abstract: A semiconductor device comprises a substrate that including a frontside comprising an active region and a backside opposite to the frontside, an electronic element on the active region, a frontside wiring structure electrically connected to the electronic element on the frontside of the substrate, and a backside wiring structure electrically connected to the electronic element on the backside of the substrate. The backside wiring structure includes a plurality of backside wiring patterns sequentially stacked on the backside of the substrate, and a super via pattern that intersects and extends through at least one layer of the plurality of backside wiring patterns.

Abstract: A semiconductor package includes a first semiconductor chip, which includes a first semiconductor substrate and a first bonding layer on the first semiconductor substrate. A second semiconductor chip includes a second semiconductor substrate, a second bonding layer bonded to the first bonding layer, and a chip-through-via which penetrates the second semiconductor substrate and is connected to the second bonding layer. A passivation film extends along an upper side of the second semiconductor chip and does not extend along side-faces of the second semiconductor chip. The chip-through-via penetrates the passivation film. A multiple-gap-fill film extends along the upper side of the first semiconductor chip, the side faces of the second semiconductor chip, and the side faces of the passivation film. The multiple-gap-fill films includes an inorganic filling film and an organic filling film which are sequentially stacked on the first semiconductor chip.

Abstract: The present disclosure relates to a novel Lactobacillus plantarum CJLP475 strain having acid-resistance, bile-resistance and an immune-enhancing activity, and a composition including the same.

Abstract: The present disclosure relates to a composition comprising a Lactobacillus plantarum CJLP475 strain deposited under Accession No. KCCM12287P; and a Lactobacillus plantarum CJLPl7 strain deposited under Accession No. KCCM12249P, and use thereof.

Abstract: An integrated circuit device includes a substrate, a landing pad on the substrate, and a through-via structure passing through the substrate and connected to the landing pad. The through-via structure may include a conductive plug, a first conductive barrier layer covering a sidewall and a lower surface of the conductive plug, and a second conductive barrier layer covering a sidewall of the first conductive barrier layer.

Abstract: A semiconductor device includes a protective layer, a redistribution pattern, a pad pattern and an insulating polymer layer. The protective layer may be formed on a substrate. The redistribution pattern may be formed on the protective layer. An upper surface of the redistribution may be substantially flat. The pad pattern may be formed directly on the redistribution pattern. An upper surface of the pad pattern may be substantially flat. The insulating polymer layer may be formed on the redistribution pattern and the pad pattern. An upper surface of the insulating polymer layer may be lower than the upper surface of the pad pattern.

Abstract: The present disclosure relates to a composition comprising a Lactobacillus plantarum CJLP475 strain deposited under Accession No. KCCM12287P; and a Lactobacillus plantarum CJLP243 strain deposited under Accession No. KCCM11045P, and use thereof.

Abstract: A display device includes: a display panel having a display area and a non-display area at least partially disposed around the display area; and a touch sensor disposed on the display panel and including a touch sensor area and a touch pad area adjacent to the touch sensor area, wherein the touch sensor includes a plurality of touch electrodes disposed in the touch sensor area, a plurality of touch pads disposed in the touch pad area, and a plurality of touch signal lines electrically connecting the touch electrodes with the touch pads, respectively.

Abstract: Disclosed is an apparatus for measuring bio signals. The apparatus for measuring bio signals includes: a sensor module configured to include a needle sensor to be inserted into the skin; and a main body to which the sensor module is separably coupled, and which is configured to include a controller controlling the sensor module to measure a bio signal through the needle sensor, once the sensor module is coupled.

Abstract: The present disclosure relates to a method, an apparatus and a computer program for noninvasively determining a cause of a blood pressure change. The method includes at least: obtaining maximum amplitudes of heart sounds; monitoring changes in the maximum amplitudes; estimating change amounts of indexes on a myocardial contractile force and on vascular resistance, based on increasing or decreasing of a blood pressure of the patient, and the changes in the maximum amplitudes; and determining the cause of the blood pressure change of the patient as an effect of at least one of alpha action, alpha blockage, beta action and beta blockage, based on results of the estimation of the first change amount of the first index, the second change amount of the second index and the third change amount of the third index.

Abstract: The present invention relates to a coolant heater. The purpose of the present invention, a coolant heater which effectively heats coolant of a vehicle by means of a heating unit, is to provide a coolant heater having improved sensitivity and responsiveness to over-heating and assured stability by utilizing a temperature fuse to prevent over-heating. Another purpose of the present invention is to provide a coolant heater having enhanced durability of the temperature fuse coupling part by improving the structure by which the temperature fuse is fixed.

Abstract: A method for wafer planarization includes forming a second insulating layer and a polishing layer on a substrate having a chip region and a scribe lane region; forming a first through-hole in the polishing layer in the chip region and the scribe lane region and a second through-hole in the second insulating layer in the chip region, wherein the second through-hole and the first through-hole meet in the chip region; forming a pad metal layer inside the first through-hole and the second through-hole and on an upper surface of the polishing layer; and polishing the polishing layer and the pad metal layer by a chemical mechanical polishing (CMP) process to expose an upper surface of the second insulating layer in the chip region and the scribe lane region.

Abstract: The present invention relates to: a recombinant peptide in which a Mitochondria Localization Sequence (MLS) peptide and the Signal Transducer and Activator of Transcription 3 (STAT3) are fused to each other; a recombinant vector carrying a polynucleotide coding for the recombinant peptide; and a composition comprising the recombinant peptide or the recombinant vector as an active ingredient for prevention or treatment of autoimmune disease or inflammatory disease, wherein the recombinant peptide or the recombinant vector allows STAT3 to be overexpressed in the mitochondria to enhance the mitochondrial function, resulting in inhibiting the expression of inflammatory cytokines including IL-17, whereby the composition may be advantageously used for preventing or treating autoimmune disease or inflammatory diseases.

Abstract: A semiconductor device includes a voltage comparison circuit and a calibration control circuit. The voltage comparison circuit compares test reference voltages and generates a comparison result signal. The calibration control circuit controls an offset value of the voltage comparison circuit.

Abstract: According to an embodiment, a method of providing information on whether an item is available for order includes receiving first information indicating whether items are available for order from a vendor device, receiving second information for requesting to check whether an item is available for order from an orderer device, identifying the item to be checked for order availability on the basis of the second information, determining whether the item is available for order on the basis of the first information and the second information, generating third information indicating whether the item is available for order on the basis of the determination of whether the item is available for order, and transmitting the third information to the orderer device in response to the second information. An embodiment provides a device for providing information on whether an item is available for order.