Patents by Inventor Jin-Myung HWANG

Jin-Myung HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing compositions and methods of manufacturing semiconductor devices using the same
    Patent number: 10435587
    Abstract: A polishing composition includes abrasive particles, a pyrrolidone containing a hydrophilic group, a dispersing agent, a first dishing inhibitor including polyacrylic acid, and a second dishing inhibitor including a non-ionic polymer.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: October 8, 2019
    Assignees: Samsung Electronics Co., Ltd., K.C. Tech Co., Ltd.
    Inventors: Seung-Ho Park, Ki-Hwa Jung, Sang-Kyun Kim, Jun-Ha Hwang, Chang-Gil Kwon, Seung-Yeop Baek, Jae-Woo Lee, Ji-Sung Lee, Jae-Kwang Choi, Jin-Myung Hwang
  • Slurry composition for chemical mechanical polishing
    Patent number: 10428242
    Abstract: A slurry composition for chemical mechanical polishing, the slurry composition including ceramic polishing particles; a dispersion agent; a pH control agent and an additive having affinity with silicon nitride.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: October 1, 2019
    Assignees: SAMSUNG ELECTRONICS CO., LTD., K.C. TECH Co., Ltd.
    Inventors: Doo-sik Moon, Sang-hyun Park, Bo-un Yoon, Ho-young Kim, Se-jung Park, Jae-hak Lee, Jin-myung Hwang
  • SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING
    Publication number: 20180282581
    Abstract: A slurry composition for chemical mechanical polishing, the slurry composition including ceramic polishing particles; a dispersion agent; a pH control agent and an additive having affinity with silicon nitride.
    Type: Application
    Filed: February 15, 2018
    Publication date: October 4, 2018
    Applicant: K.C. TECH Co., Ltd.
    Inventors: Doo-sik MOON, Sang-hyun PARK, Bo-un YOON, Ho-young KIM, Se-jung PARK, Jae-hak LEE, Jin-myung HWANG
  • POLISHING COMPOSITIONS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME
    Publication number: 20170029664
    Abstract: A polishing composition includes abrasive particles, a pyrrolidone containing a hydrophilic group, a dispersing agent, a first dishing inhibitor including polyacrylic acid, and a second dishing inhibitor including a non-ionic polymer.
    Type: Application
    Filed: July 20, 2016
    Publication date: February 2, 2017
    Applicant: K.C. Tech Co., Ltd.
    Inventors: Seung-Ho PARK, Ki-Hwa JUNG, Sang-Kyun KIM, Jun-Ha HWANG, Chang-Gil KWON, Seung-Yeop BAEK, Jae-Woo LEE, Ji-Sung LEE, Jae-Kwang CHOI, Jin-Myung HWANG